14 packaging designer jobs at 9 companies in Oatfield, OR
1mo
Save
Mark Applied
Hide
Senior Designer
Portland, Oregon, United States
OnsiteFull Time
10+ YOE10+ years professional design experience; strong portfolio in branding, packaging, merchandise; expert Adobe Creative Cloud; presentation, communication, project management skills.
Adobe Creative Cloud, SketchUp, Fusion 360
3d
Save
Mark Applied
Hide
Structural Designer
Hillsboro, Oregon, United States
$50k-$70k/yr HybridFull Time
1+ YOEHigh school or associate degree in architectural design, engineering design, or drafting; 1–2+ years using AutoCAD or Revit for engineering or architectural design packages; industrial design experience preferred.
AutoCAD, Revit, BIM, AI Large Language Models
3d
Save
Mark Applied
Hide
Instrumentation & Controls Designer
Hillsboro, Oregon, United States
$80k-$100k/yr HybridFull Time
10+ YOEAssociate degree or equivalent technical training, approximately 10 years of I&C design experience, and independent design-package production. Requires AutoCAD, Revit, PLC/DCS knowledge, diagram interpretation, and code familiarity.
AutoCAD, Revit, Navisworks, PLC, DCS, BAS, UPS, P&IDs, HVAC, OEMs, AI Large Language Models
3w
Save
Mark Applied
Hide
Hardware Designer, Sr
Bengaluru or Portland
HybridFull Time
4+ YOE4+ years creating medium/high complexity CAD models and assemblies in Unigraphics-NX, producing drawing packages for sheet metal, machined parts and weldments, applying DFM/DFA, and mentoring designers.
Unigraphics-NX, Team Center, SAP, PLM, Microsoft Excel, Microsoft Word, Microsoft PowerPoint
3w
Save
Mark Applied
Hide
Silicon Packaging Design Engineer
Phoenix or Hillsboro or Chandler
$164k-$232k/yr OnsiteFull Time
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
Cadence Allegro, Cadence Constraint Manager, Siemens Xpedition, Product Lifecycle Management (PLM)
3mo
Save
Mark Applied
Hide
Silicon Packaging Design Engineer
Phoenix or Hillsboro
$106k-$200k/yr OnsiteFull Time
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
Virtuoso, Innovus, FusionCompiler, ICvalidator, Calibre
1mo
Save
Mark Applied
Hide
Creative Director
Portland, Oregon, United States
OnsiteFull Time
7+ YOE7+ years creative experience with leadership, strong portfolio in packaging and production, expertise in creative operations, knowledge of structural packaging and print production, Adobe Creative Cloud proficiency, Mac/Windows experience, and excellent communication skills.
Adobe Creative Cloud, Mac, Windows
2w
Save
Mark Applied
Hide
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yr HybridFull Time
12+ YOEBS, MS, or PhD in electrical engineering, physics, or computer engineering; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional system-manufacturing design.
AI
2w
Save
Mark Applied
Hide
3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
3d
Save
Mark Applied
Hide
Director of Package Design
Mountain View or Redmond or Hillsboro or Austin or Raleigh
$143k-$275k/yr HybridFull Time
3+ YOERequired: doctorate plus 3+ years, master's plus 6+ years, bachelor's plus 8+ years, or equivalent. Preferred: 15+ years semiconductor package experience and advanced packaging, CAD, simulation, supplier, and manufacturing expertise.
Cadence Allegro, EDA, BGA
1mo
Save
Mark Applied
Hide
Staff Mechanical Engineer
Fremont or Salem
$185k-$240k/yr HybridFull Time
8+ YOE8+ years mechanical design experience, B.S./M.S. in Mechanical Engineering, experience with mechanism design, electronics packaging, FEA/thermal analysis, Creo, Windchill, Jira/Confluence; ability to mentor engineers.
Creo, Windchill, Jira, Confluence
3w
Save
Mark Applied
Hide
FLORAL/CLERK
Happy Valley, Oregon, United States
OnsitePart Time
Provide customer service, design and prepare floral arrangements, package orders, maintain merchandise, operate cash register, and follow safety and company policies.
4w
Save
Mark Applied
Hide
Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
5d
Save
Mark Applied
Hide
Signal and Power Integrity Engineer
Raleigh or Redmond or Austin or Hillsboro or Mountain View
$102k-$202k/yr HybridFull Time
1+ YOEMaster’s degree plus 1+ year or bachelor’s degree plus 2+ years in technical engineering; 5+ years of signal and power integrity, system design, electrical modeling, or silicon packaging experience preferred.