12 packaging designer jobs at 9 companies in Portland, OR
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Senior Designer
Portland, Oregon, United States
OnsiteFull Time
10+ YOE10+ years professional design experience; strong portfolio in branding, packaging, merchandise; expert Adobe Creative Cloud; presentation, communication, project management skills.
Adobe Creative Cloud, SketchUp, Fusion 360
3w
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Hardware Designer, Sr
Bengaluru or Portland
HybridFull Time
4+ YOE4+ years creating medium/high complexity CAD models and assemblies in Unigraphics-NX, producing drawing packages for sheet metal, machined parts and weldments, applying DFM/DFA, and mentoring designers.
Unigraphics-NX, Team Center, SAP, PLM, Microsoft Excel, Microsoft Word, Microsoft PowerPoint
3w
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Silicon Packaging Design Engineer
Phoenix or Hillsboro or Chandler
$164k-$232k/yr OnsiteFull Time
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
Cadence Allegro, Cadence Constraint Manager, Siemens Xpedition, Product Lifecycle Management (PLM)
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Silicon Packaging Design Engineer
Phoenix or Hillsboro
$106k-$200k/yr OnsiteFull Time
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
Virtuoso, Innovus, FusionCompiler, ICvalidator, Calibre
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Senior Design Lead
Chandler or Hillsboro or Washington
$88k-$134k/yr OnsiteFull Time, Contract
10+ YOEBachelor's or master's degree in electrical or electronics engineering; 10+ years for senior level or 4–6+ years with MS/6+ years with BS in IC packaging and package design; Xpedition or Cadence expertise.
Siemens Xpedition, Cadence Allegro, Advanced Package Designer, APD, SiP
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Creative Director
Portland, Oregon, United States
OnsiteFull Time
7+ YOE7+ years creative experience with leadership, strong portfolio in packaging and production, expertise in creative operations, knowledge of structural packaging and print production, Adobe Creative Cloud proficiency, Mac/Windows experience, and excellent communication skills.
Adobe Creative Cloud, Mac, Windows
2w
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Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yr HybridFull Time
12+ YOEBS, MS, or PhD in electrical engineering, physics, or computer engineering; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional system-manufacturing design.
AI
1w
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3D-IC Application Engineer
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yr HybridFull Time
4+ YOEMSEE/BSEE and 4+ years of design experience with advanced IC package or interposer layout. Requires package design tools, scripting, Windows/Linux, and strong presentation and customer skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
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Staff Mechanical Engineer
Fremont or Salem
$185k-$240k/yr HybridFull Time
8+ YOE8+ years mechanical design experience, B.S./M.S. in Mechanical Engineering, experience with mechanism design, electronics packaging, FEA/thermal analysis, Creo, Windchill, Jira/Confluence; ability to mentor engineers.
Creo, Windchill, Jira, Confluence
3w
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Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
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Signal and Power Integrity Engineer
Raleigh or Redmond or Austin or Hillsboro or Mountain View
$102k-$202k/yr HybridFull Time
1+ YOEMaster’s degree plus 1+ year or bachelor’s degree plus 2+ years in technical engineering; 5+ years of signal and power integrity, system design, electrical modeling, or silicon packaging experience preferred.
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Mechanical Product Design Engineer II
Portland, Oregon, United States
$86k-$110k/yr HybridFull Time
2+ YOEBachelor's in engineering and 2+ years related experience; proficiency with CAD (preferably NX), Microsoft Office, strong communication, and ability to support vocational chassis packaging.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint, CAD, NX, Power Bi, VBA, Imacs, Smaragd, ERSE