4 packaging designer jobs at 2 companies in Vermont

3mo
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PMTS Photonics Packaging Design Integration
Essex Junction, Vermont, United States
$132k-$242k/yr OnsiteFull Time
GlobalFoundries
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
15+ YOEMS or PhD with 15+ years in advanced packaging for photonics; experience with SiPh, HFSS, Zmax, Flotherm; packaging design and analysis; cross-functional collaboration.
HFSS, Zmax, Flotherm, Photonic packaging tools
2w
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Packaging Design Integration Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
GlobalFoundries
GlobalFoundriesNASDAQ: GFS: Semiconductor foundry providing chip design and fabrication services.
Graduating with a bachelor's, master's, or PhD in a STEM discipline, 3.0 GPA, analytical skills, engineering data experience, teamwork, and English fluency; packaging knowledge preferred.
Photonix, HFSS, Zemax/Zmax, FloTHERM, Design of Experiments (DOE)
2w
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Packaging Design Integration Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
GlobalFoundries
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
Graduating with a bachelor's, master's, or PhD in an applicable STEM discipline, 3.0 GPA, analytical skills, engineering data analysis, cross-functional teamwork, and English fluency.
Photonix, HFSS, Zemax/Zmax, FloTHERM, Design of Experiments (DOE)
1mo
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Advanced Packaging SI/PI Senior Engineer
Westborough or Burlington
OnsiteFull Time
Marvell
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Ansys HFSS, Keysight ADS, Cadence Sigrity