32 packaging designer jobs at 17 companies in Youngtown, AZ
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Senior Medical Packaging Engineer
Tempe, Arizona, United States
$78k-$130k/yrHybridFull Time
StrykerNYSE: SYK: Manufactures medical devices and equipment for healthcare providers.
2+ YOEDesign and test sterile packaging for medical devices; packaging validation; cross-functional collaboration; 2+ years in regulated packaging environment.
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
0.5+ YOEBachelor's degree plus 1+ year or master's degree plus 6 months in electrical, mechanical, or materials science engineering; 6+ months with package or PCB layout and design tools.
MarvellNASDAQ: MRVL: Global leader in data infrastructure semiconductor solutions.
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Maverick Power: Designs and builds engineered power distribution systems.
2+ YOE2+ years creating electrical drawing packages for power distribution and switchgear; experience with CAD, PDM/PLM/ERP, BOM development, and manufacturing documentation.
AmazonNASDAQ: AMZN: Multinational technology focused on e-commerce and cloud computing.
5+ YOEBachelor's degree in electrical engineering or related field and 5+ years of IC package layout and physical design experience. Requires package layout tools, advanced packaging, DFM, and physical verification expertise.
ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yrRemoteFull Time
CiscoNASDAQ: CSCO: Global leader in networking, cybersecurity, and cloud-native technology solutions.
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Renesas ElectronicsTokyo Stock Exchange: 6723: Global provider of embedded semiconductor and system solutions.
15+ YOE15–20 years in power package development, with expertise in SiP/module, wafer-level and flip-chip packaging, assembly, qualification, SPC, statistical analysis, and package design rules.
HDR: Global professional services firm specializing in architecture, engineering, and construction.
Bachelor's degree; EIT preferred; experience in bridge/structural design; familiarity with engineering software packages listed; proficient in MS Office and AutoCAD.
Advanced Process Chemical Design & Permit Engineer (TSMC Project)
Phoenix, Arizona, United States
HybridFull Time
Marketech International Corporation USA: Professional technology service provider dedicated to marketing and technology integration support services for semiconductor and opto-electronics industries.
2+ YOE2+ years in design/permitting/project engineering for chemical/utility/MEP systems; experience preparing construction drawings, permit packages, AHJ coordination; proficiency with AutoCAD, Bluebeam, Revit; strong organization and communication.
Hartford or Indianapolis or Phoenix or Raleigh or Richardson
$102k-$164k/yrOnsiteFull Time
InfosysNYSE: INFY: Global leader in next-generation digital services and consulting.
Bachelor's degree or equivalent, experience with Oracle CX Cloud (Fusion Service Cloud, Engagement Cloud), BI Publisher, Groovy scripting, integrations and full project lifecycle; ability to design solutions, configure and deploy Oracle Cloud packages; US work authorization required.
Oracle CX Cloud, Fusion Service Cloud, Engagement Cloud, BI Publisher, Oracle Order Management Cloud, Subscription Management Cloud, Oracle Inventory Cloud, Oracle Maintenance Cloud, Oracle Service Logistics Cloud, Oracle Cloud, Application Composer, Page Composer, Groovy Scripting, Redwood UX, Visual Builder, Webservices
Sargent & Lundy: Professional engineering consultancy for the power and energy industry.
8+ YOEABET-accredited BS in Electrical Engineering; minimum 8 years electrical design experience (nuclear power plant experience preferred); experience with LV/MV systems, design change packages, calculations, vendor interfacing; ability to be badged for unescorted nuclear access; PE and MS preferred.
Mechanicsburg or Dallas or United States or Denver or Salt Lake City or Indianapolis or Cincinnati or Charlotte or Roanoke or Marlton or Pittsburgh or St. Louis or Chicago or Phoenix
$90k-$125k/yrRemoteFull Time
Gannett Fleming: Infrastructure engineering, design, and construction management firm.
3+ YOEBachelor's in civil/electrical/structural engineering, 3+ years transmission line design, high proficiency in PLS-CADD, knowledge of NESC/IEEE codes, ability to prepare construction packages, travel to client sites; PE preferred.
State of Arizona: Official government website for the State of Arizona.
Manage multiple large construction projects from design through close-out, use Procore, draft RFPs/bid packages, prepare reports, inspect sites, and retain a valid state driver's license; background check required.
Koch Engineered Solutions: Private Koch industrial-solutions group serving industrial partners with engineering, emissions control, energy, construction, and asset-integrity services.
Applied knowledge of electrical codes and standards, power infrastructure design experience, ability to develop electrical drawing packages for PV and BESS projects, mentor team members, and perform cost/benefit analyses. PE licensure or path to licensure preferred.
Mercury SystemsNasdaq Global Select Market: MRCY: Public aerospace and defense electronics manufacturer providing secure signal and data processing components, modules, subsystems, and solutions.
6+ YOEBachelor's in EE/CE, typically 6+ years microelectronics packaging experience, expertise in high-speed digital and signal integrity, substrate/SiP design, ability to obtain U.S. government security clearance, and experience leading cross-functional teams.
Texas InstrumentsNASDAQ: TXN: Global semiconductor designing and manufacturing analog and embedded processing chips.
5+ YOEBachelor's in electrical/computer/electrical systems or equivalent product engineering experience, minimum 5 years experience; preferred experience in package design, data analysis, automotive requirements, production manufacturing, stakeholder management, and strong communication and problem-solving skills.