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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$142k-$214k/yr OnsiteFull Time
7+ YOEBS in Electrical, Materials, or Mechanical Engineering; 7+ years in process or packaging engineering; experience with automated packaging equipment and semiconductor/display production; travel up to ~10%
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom
2mo
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$135k-$203k/yr OnsiteFull Time
7+ YOEBS in engineering; 7+ years in process/packaging in microfabrication; experience with automated packaging equipment; ISO 5 cleanroom experience; travel up to 10%; proficiency with DOE/SPC.
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom, Six Sigma
1w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
2w
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Packaging Module Development Engineer
Phoenix or Chandler
$115k-$220k/yr HybridFull Time
1+ YOEPhD or Master's in engineering/physics/materials,1+ year experience in mechanical design/equipment development,strong experimental and prototype background,publication record for PhD candidates.
1mo
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
1mo
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
1w
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Physical Failure Analysis Engineer II
Chandler, Arizona, United States
OnsiteFull Time
2+ YOEMinimum 2 years experience in physical failure analysis, expert with Dual Beam FIB/SEM, experience with package decapsulation, CNC milling, X-ray and C-SAM, bachelor’s or master’s in a technical field, strong technical writing and device knowledge.
Dual Beam FIB/SEM, FIB/SEM, SEM, TEM, CNC milling, X-ray analysis, C-SAM (Scanning Acoustic Microscopy)
3mo
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Architectural Designer (Onsite)
Chandler, Arizona, United States
OnsiteFull Time
3+ YOELead development of construction documents; supervise a Drafter; ensure code and client specs; coordinate with designers; develop and annotate design packages; prepare calculations and schedules.
1d
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Designer I/II
Casa Grande, Arizona, United States
OnsiteFull Time
2+ YOEPrepare and modify plant design change packages, gather and develop engineering data, support design documents and walk‑downs; requires CADD coursework and design experience.
CADD, Windows
2w
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NPI & Technology Leader
Chandler, Arizona, United States
OnsiteFull Time
15+ YOEBachelor's in engineering or related field; 15+ years in semiconductor R&D, technology or product development; demonstrated NPI leadership, process/package/IP expertise, and program management experience.
1mo
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Workface Planner
Chandler, Arizona, United States
OnsiteFull Time
5+ YOEDevelop and maintain Installation Work Packages (IWPs), manage constraints, support AWP/WFP processes, coordinate with engineering/procurement/construction, and analyze planning performance. Requires bachelor's + 5+ years experience or 9+ years without degree.