Essex Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Essex Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Essex Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Essex Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
1w
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Packaging Engineer
Plattsburgh, New York, United States
$90k/yr OnsiteFull Time
5+ YOEBachelor's in engineering, 5+ years packaging engineering experience, expertise in packaging design/validation, ISTA/ASTM familiarity, Lean/Six Sigma exposure, supplier management, and CAD/ERP proficiency.
ArtiosCAD, SolidWorks, Microsoft Word, Microsoft PowerPoint, Microsoft Excel, Microsoft Visio, ERP, PLM
1mo
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Packaging Engineer
Essex Junction, Vermont, United States
$65k-$75k/yr OnsiteFull Time
Bachelor's degree or equivalent experience; 3–5 years packaging experience preferred; strong leadership, attention to detail, cross-functional teamwork, and Microsoft Office experience.
Microsoft Office
5d
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Principal Packaging Integration Engineer
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
2+ YOEPhD or MS+2 years experience in packaging/process integration, failure analysis, DOE; experience bringing packaged products to production; strong written/spoken English.
5d
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Principal Packaging Integration Engineer
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
2+ YOEPhD or MS+2 years experience in packaging/process integration, failure analysis, DOE, production transfer, and strong English communication.
5d
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Principal Packaging Design Integration Engineer
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
2+ YOEPhD or MS+2 years experience in packaging/product development; experience bringing packaged products to production; expertise in thermal/mechanical/electrical/optical co-design; HFSS/Zmax/Flotherm experience; strong English communication.
HFSS, Zmax, Flotherm
5d
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Principal Packaging Design Integration Engineer
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
2+ YOEPhD or MS+2yrs experience, packaged products production experience, expertise in advanced packaging design, proficiency with HFSS, Zmax, Flotherm, and strong English communication.
HFSS, Zmax, Flotherm
1w
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Photonics Packaging Characterization Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$65k-$146k/yr OnsiteFull Time
1+ YOEBachelors/Masters in Materials Science, Mechanical Eng, Applied Physics or related; 1-3 years semiconductor packaging/characterization experience; 3.0+ GPA; English fluency; hands-on inspection and metrology skills.
AOI, profilometry, SEM, X-ray, acoustic microscopy
1w
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Photonics Packaging Characterization Engineer (2026 New College Graduate)
Essex Junction, Vermont, United States
$65k-$146k/yr OnsiteFull Time
1+ YOEBachelors or Master's in Materials Science/Mechanical Engineering/Applied Physics or related, 1+ years semiconductor packaging/characterization experience, 3.0+ GPA, EM/inspection tool experience, strong communication and problem-solving.
AOI, profilometry, SEM, X‑ray, acoustic microscopy
2mo
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PMTS Photonics Packaging Design Integration
Essex Junction, Vermont, United States
$132k-$242k/yr OnsiteFull Time
15+ YOEMS or PhD with 15+ years in advanced packaging for photonics; experience with SiPh, HFSS, Zmax, Flotherm; packaging design and analysis; cross-functional collaboration.
HFSS, Zmax, Flotherm, Photonic packaging tools
2mo
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Advanced Packaging Cryogenic Modeling Engineer
Essex Junction, Vermont, United States
$118k-$239k/yr OnsiteFull Time
10+ YOEMS + minimum 10 years in semiconductor mechanical/thermal/electrical modeling; experience with cryogenic modeling and commercial multi-physics tools; strong problem solving and communication skills.
Ansys Mechanical Workbench
6d
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Advanced Packaging SI/PI Senior Engineer
Westborough or Burlington
OnsiteFull Time
3+ YOEBS/MS in electrical or computer engineering with 3+ years experience; experience with SI/PI simulation, circuit extraction, scripting for automation; familiarity with semiconductor packaging and PCB design; strong communication skills; export-control eligibility.
Ansys HFSS, Keysight ADS, Cadence Sigrity
2mo
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Advanced Packaging Cryogenic Modeling Engineer
Essex Junction or Santa Clara
$118k-$239k/yr OnsiteFull Time
10+ YOEM.S. + 10 years relevant experience (PhD + 8 preferred). Cryogenic thermal/mechanical/electrical modeling experience using commercial multiphysics tools (e.g., Ansys), semiconductor process knowledge, strong problem solving, 3.0 GPA, English fluency, up to 10% travel.
Ansys Mechanical Workbench, Cadence, Mentor Graphics, Keysight ADS
2mo
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Quantum Assembly Engineer
Essex Junction, Vermont, United States
$118k-$210k/yr OnsiteFull Time
10+ YOEMS in engineering with 10+ years in BEOL, bump/wafer, OSAT, packaging; strong problem solving; English fluency; travel up to 10%.
2mo
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Quantum Assembly Engineer
Essex Junction, Vermont, United States
$118k-$210k/yr OnsiteFull Time
10+ YOEMS in engineering/materials plus 10+ years experience; deep knowledge of BEOL, bump/interconnect and package assembly; strong problem solving, DOE expertise, 3.0+ GPA, English fluency, up to 10% travel.
dilution refrigerators, High-precision alignment / bonding tools
2w
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Low-Temperature Bonding Engineer
Essex Junction, Vermont, United States
$85k-$146k/yr OnsiteFull Time
4+ YOEBachelor's in engineering or materials science, ≥4 years related experience, BEOL and package/assembly knowledge, DOE expertise, strong problem solving and communication, English fluency, up to 10% travel.
1w
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PT Package Center Supervisor
Plattsburgh, New York, United States
$26-$43/hr OnsitePart Time
Supervise and develop warehouse teams, enforce safety and productivity, facilitate training, lift up to 70 lbs, flexible shift availability, Microsoft Office proficiency; bachelor's degree and management experience preferred.
Microsoft Office