8 packaging developer jobs at 6 companies in Goleta, CA
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Packaging Engineer (50730)
Oxnard, California, United States
$30-$40/hrOnsiteFull Time
Haas Automation: Manufactures CNC machine tools and industrial automation equipment.
3+ YOEBachelor’s degree; 1-3 years of packaging design experience; ability to design packaging for shipping national/internationally; relocate to Henderson, NV if required.
SaniSure: Designs and manufactures single-use bioprocessing and fluid management systems.
4+ YOEBachelor's in engineering or related, 4+ years packaging/labeling experience in pharma/biotech/medical device, SolidWorks and ISTA/ASTM knowledge, DFMEA/change control experience, GMP experience, up to 10% travel.
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
5+ YOEU.S. citizen able to obtain/maintain DoD Secret clearance; STEM degree with 5+ years (or advanced degree with 3+ years); experience with GD&T and ASME standards, CREO, mechanical design, thermal/structural analysis and electronics packaging.
Geometric Dimensioning and Tolerancing (GD&T), ASME, CREO, Earned Value Management (EVM)
RTXNYSE: RTX: Provides advanced aerospace and defense systems and services.
8+ YOEU.S. citizen with active DoD Secret clearance; STEM degree with 8+ years (or advanced degree +5); experience in electronics packaging, GD&T/ASME drawing standards, 3D CAD (Creo/Pro/Engineer), and environmental qualification testing.
HRL Laboratories: Conducts advanced scientific research for aerospace and automotive industries.
6+ YOEBachelor's or master's in engineering with 6+ years R&D experience, experience with IR camera systems, wafer fabrication and packaging, data/statistical analysis, delivering to DoD/NASA standards, strong communication; US citizenship and ability to obtain government security clearance required.
RTXNYSE: RTX: RTX provides advanced aerospace and defense systems and services.
7+ YOEU.S. citizen with active DoD Secret clearance, STEM degree with 7–10+ years experience, electronics packaging, thermal/structural analysis, GD&T/ASME, 3D solid modeling (Creo/ProEngineer), and FEA experience.
ITWNYSE: ITW: Global manufacturer of specialized industrial equipment and consumables.
6+ YOEBachelor's in EE/Applied Physics, 6+ years in optoelectronic component manufacturing/engineering, experience with microelectronic packaging/assembly, NPI, customer-facing technical work, product qualification/compliance, and ability to work with export-controlled information (U.S. Person).
AutoCAD, Microsoft Office Suite, ERP Systems, SPC, DOE, JMP, Minitab, multimeter, picoamp meters, power supplies, optical microscopes, spectrometers, wire bonders, die attach systems, environmental chambers, optical testers
Lockheed MartinNYSE: LMT: Designs and manufactures global security and aerospace systems.
9+ YOEBachelor's in engineering or physics required; experience in semiconductor packaging or FPA manufacturing (flip-chip hybridization, substrate thinning, AR coating) required. U.S. citizenship required. Proficiency with MS Office; experience with DOE/SPC and JMP/MATLAB; leadership and troubleshooting experience.
Microsoft Word, Microsoft PowerPoint, Microsoft Excel, JMP, MATLAB