6 packaging developer jobs at 4 companies in Jefferson, GA

3w
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Director, R&D - Labeling and Packaging
Covington, Georgia, United States
OnsiteFull Time
BD
BDNYSE: BDX: Manufactures medical devices, surgical instruments, and pharmacy automation systems.
12+ YOEBachelor's in engineering/packaging/industrial design, 12+ years in packaging/labeling/product development with leadership experience; regulatory and process-improvement expertise in regulated industries.
2mo
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Field Applications Engineer
Gainesville, Georgia, United States
RemoteFull Time
Cirkla
Cirkla: Manufacturers of sustainable, fiber-based packaging alternatives to plastic.
3+ YOE3–6 years in technical sales or application engineering; packaging knowledge; strong problem solving; travel to the US; able to work onsite.
MAP/VSP, overwrap, packaging equipment
4w
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Plasma Dry Etch Engineer
Covington, Georgia, United States
$100k-$150k/yr OnsiteFull Time
Absolics
Absolics: Manufacturer of glass substrates for high-performance semiconductor packaging.
3+ YOEHands-on experience developing plasma etch, PVD, and plasma ablation for advanced packaging; vacuum system and metrology (SEM, XPS/AES) skills; DOE and root-cause analysis; PhD preferred or MS with 3+ years.
SEM, XPS, AES, profilometry, four-point probe, Minitab, JMP, RIE, ICP, PVD, PECVD, ALD
4w
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Senior Desktop Engineer
Conyers, Georgia, United States
$83k-$164k/yr HybridFull Time
Acuity Inc.
Acuity Inc.NYSE: AYI: Provides lighting systems and building automation technologies.
5+ YOE5+ years endpoint/desktop engineering experience; hands-on with Microsoft Intune, Windows Autopilot, SCCM; PowerShell scripting; packaging/deployment; endpoint security and compliance.
Microsoft Intune, Windows Autopilot, SCCM, AUTOMOX, Win32, MSI, MSIX, PowerShell, BitLocker, CIS Level 1
4w
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Dielectric and Polymer Materials Engineer
Covington, Georgia, United States
$100k-$150k/yr OnsiteFull Time
Absolics
Absolics: Manufacturer of glass substrates for high-performance semiconductor packaging.
3+ YOELead evaluation and integration of advanced packaging dielectric and polymeric materials; film deposition/lamination, patterning, cure and reliability characterization; hands-on experience with multiple dielectrics and film characterization methods.
ellipsometry, FTIR, TGA, DSC, profilometry, nanoindentation, HAST, uHAST, TCT, FIB-SEM, TEM, laminography, plasma-enhanced CVD, PVD, CMP
4w
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Process Integration Engineer
Covington, Georgia, United States
$100k-$150k/yr OnsiteFull Time
Absolics
Absolics: Manufacturer of glass substrates for high-performance semiconductor packaging.
5+ YOEExperience integrating multi-step package build-up (lithography, etch, PVD, electroplating), authoring Process Integration Plans, SPC/DOE proficiency, metrology/failure analysis (SEM, FIB, CD-SEM), and 5+ years' process integration experience; Ph.D. preferred.
SEM, FIB, CD-SEM, Overlay metrology, Electrical test, Statistical process control (SPC), Design of Experiments (DOE), JEDEC, IPC, CMP, RDL, DFM