3+ YOEB.S. in Packaging or related engineering, 3+ years pharmaceutical/regulatory engineering experience, knowledge of secondary/tertiary packaging design and qualification, ASTM/ISTA/IATA standards, ArtiosCAD, Solidworks, TOPS, cGMP change control, and project management skills.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
Technical Marketing Engineer Advanced IC Packaging
Wilsonville, Oregon, United States
$130k-$233k/yrHybridFull Time
SiemensXETRA: SIE: Manufactures industrial automation, infrastructure, and energy technology systems.
5+ YOE5+ years in 2.5D/3DIC or advanced IC packaging from an EDA perspective; EE/electronics academic background; scripting with Tcl and Python; Linux and Microsoft Office proficiency; customer-facing solution experience.
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
3+ YOEExperience in semiconductor IC development, manufacturing, testing and packaging; doctorate/masters/bachelor degree with corresponding years of engineering experience; security screening and export-control eligibility required.
HCLTechNational Stock Exchange of India: HCLTECH: Global provider of information technology services and software consulting.
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
HPNYSE: HPQ: Manufactures personal computers, printers, and 3D printing hardware.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, experience with global supply chains, cross-functional leadership, and expertise in recycled/renewable materials and packaging transformation.
Austin or Boulder or Fremont or San Diego or Santa Clara or Wilsonville
$125k-$251k/yrHybridFull Time
Siemens HealthineersXetra: SHL: Manufacturer of medical diagnostic and imaging equipment.
4+ YOEMSEE/BSEE and 4+ years of design experience, advanced IC package or interposer layout expertise, package design tools, scripting, Windows/Linux, and customer-facing applications engineering skills.
Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, Cadence APD/SiP, Siemens Xpedition/i3DL, Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Microsoft Excel, TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, Verilog, LEF/DEF, GDS, OASIS, Sigrity, SIWave, ADS, Siemens Calibre DRC, Siemens Calibre LVS, 3DSTACK, Microsoft Word, Microsoft PowerPoint, VBS, Python, Tcl, Perl, Windows, Linux
HPNYSE: HPQ: Manufacturer of personal computers, printers, and imaging devices.
8+ YOEBachelor's in engineering, 8–12+ years experience in circular economy, packaging or materials engineering, experience across global supply chains, strong cross-functional collaboration and problem-solving skills.
FDL, Panda, Viking, SIRA, Marble, EU CSRD, ESRS, LCA
Tech MahindraNational Stock Exchange of India: TECHM: Global provider of information technology and business process services.
7+ YOEBachelor's degree,7+ years IT experience with Windows desktop/laptop imaging, OS deployment, device provisioning, application packaging, troubleshooting, and strong communication.
HPNYSE: HPQ: Produces personal computers, printers, and related digital imaging products.
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, expertise in recycled/renewable materials, global supply chain experience, strong cross-functional and problem-solving skills.
KLANASDAQ: KLAC: Provides process control and yield management for semiconductor manufacturing.
0+ YOEMaster's degree (0 years) or Bachelor's plus 2 years; experience with metrology, testing techniques (spectroscopy, HPLC), wet etch and packaging applications; strong problem solving, technical writing, project coordination, and training skills; ~30% travel.
Microsoft Outlook, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Project, spectroscopy, HPLC
PowerLattice: Develops power delivery chiplets for high-performance AI processors.
5+ YOERequires 5 years in power or signal integrity for high-performance SoCs, package-level expertise, debugging skills, customer communication, discretion, and independent problem-solving.
BIOTRONIK: Manufactures cardiovascular and endovascular medical devices for patient therapy.
8+ YOEB.Sc. or M.Sc. in EE/Physics/Materials,8+ years experience in chip scale packaging and high-reliability electronics, strong failure analysis and supplier qualification skills, leadership and technical writing ability.
Microsoft Excel, Microsoft Word, Microsoft PowerPoint
Daimler Truck North AmericaXetra: DTG: Designs and manufactures commercial trucks and school buses.
2+ YOEBachelor's in engineering and 2+ years related experience; proficiency with CAD (preferably NX), Microsoft Office, strong communication, and ability to support vocational chassis packaging.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint, CAD, NX, Power Bi, VBA, Imacs, Smaragd, ERSE
Lake Oswego or Beaverton or Gresham or Hillsboro or Portland or McMinnville or Oregon
$90k-$120k/yrOnsiteFull Time
Hoffman Construction Company: General contractor specializing in large-scale and complex construction projects.
2+ YOEAnalyze MEP cost proposals, prepare cost estimates and authorization packages, maintain job cost reports and forecasts, perform on-screen material takeoffs; 2+ years construction estimating experience and bachelor's in engineering or construction management required.
Microsoft Windows, Microsoft Excel, Microsoft Word, Microsoft Outlook, Microsoft PowerPoint, Microsoft Teams, Prolog, Procore, E-Builder, Bluebeam, Microsoft Project, Primavera P6, AutoCAD, Revit, Navisworks
Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging
Santa Clara or Hillsboro
$196k-$368k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
12+ YOEBS, MS, or PhD in EE, Physics, or CE; 12+ years of relevant experience; expertise in power delivery, thermal dissipation, current density, and cross-functional semiconductor development.
Greenberry Industrial: Industrial construction and metal fabrication services for heavy industry.
5+ YOE5+ years industrial construction estimating experience; proficiency in Microsoft Excel and estimating tools; ability to perform quantity takeoffs, develop labor/material pricing, evaluate subcontractor quotes, and assemble compliant bid packages.
Matheson: Supplying industrial, medical, and specialty gases and equipment.
Commercial driver responsible for delivering gas cylinders; requires valid commercial Class B license with Hazmat and air brake endorsements, medical card, ability to lift heavy cylinders, HS diploma or equivalent, and safe driving record.