16 packaging developer jobs at 10 companies in Rensselaer, NY
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Advanced Packaging Modeling Engineer
Malta, New York, United States
$98k-$176k/yrOnsiteFull Time
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
3+ YOEMS+5 years or PhD+3 years experience in mechanical/thermal/electrical modeling for semiconductor advanced packaging; familiarity with Ansys Mechanical Workbench and semiconductor processes; English fluency; minimum 3.0 GPA.
GlobalFoundriesNASDAQ: GFS: Semiconductor foundry providing chip design and fabrication services.
3+ YOEM.S.+5 years or PhD+3 years in relevant field; experience with Ansys Mechanical Workbench or equivalent; strong semiconductor process and integration knowledge; overall GPA ≥3.0; English proficiency.
Primo BrandsNYSE: PRMB: Provides bottled water products, dispensers, and hydration delivery services.
Experience in factory maintenance and reliability, troubleshooting, SAP/CMMS and Microsoft Office proficiency, ability to develop and mentor mechanics, knowledge of continuous improvement (LEAN, DMAIC, TPM), travel up to 75% and weekend availability.
SAP, CMMS, AMM, Microsoft Excel, Microsoft Word, Microsoft PowerPoint, Microsoft Outlook, Microsoft Teams, LEAN, DMAIC, 5why, BDA, TPM
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
10+ YOER&D interconnect and interposer integration for cryogenic superconducting systems; lead development; 2.5D/3D packaging; ensure qubit performance and system integration.
GlobalFoundriesNASDAQ: GFS: Semiconductor foundry providing chip design and fabrication services.
5+ YOEMaster's in engineering or materials science with 5+ years' related experience; deep knowledge of BEOL, advanced bonding, TSVs, package development, DOE, strong problem solving, 3.0+ GPA, English fluency, up to 20% travel.
BDNYSE: BDX: Manufactures medical devices, surgical instruments, and pharmacy automation systems.
3+ YOEBachelor's in mechanical or controls engineering or equivalent, 3+ years automation/assembly/packaging experience, project leadership, SolidWorks preferred, GMP/ISO and Lean experience preferred, willingness to travel up to 25%.
Quest Global: Global engineering services for product development and lifecycle management.
3+ YOEBachelor’s in Electrical Engineering; 3+ years in installation packages/field engineering in power/industrial settings; travel ~15%; strong communication and customer interaction.
Electrical drawings, Cable schedules, Power bus routing, Equipment arrangements, Specifications generation, Field engineering, Interconnection drawings, Turbine control products, GE Excitation
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
15+ YOE15+ years semiconductor process integration or advanced manufacturing experience; relevant technical degree; expertise in integration, BEOL, photonics, packaging; strong analytical and communication skills.
Tokyo ElectronTokyo Stock Exchange: 8035: Produces equipment used to manufacture semiconductors and electronic displays
5+ YOEPhD in a relevant STEM field,5+ years semiconductor R&D experience,expertise in advanced packaging and heterogeneous/3D integration,hands-on wafer bonding/process integration,project leadership,publication/patent record.
GlobalFoundriesNASDAQ: GFS: Semiconductor foundry providing chip design and fabrication services.
15+ YOE15+ years semiconductor process integration experience; degree in engineering, materials science, physics or related; expertise in integration, BEOL, photonics, packaging; strong analytical and communication skills.
GE VernovaNYSE: GEV: Designs and services technologies for global power generation and electrification.
1+ YOEMaster's in structural or mechanical engineering +1 year OR Bachelor's in civil or mechanical engineering +2 years; perform building code analysis (IBC, Eurocode, ACSE), create foundation load tables, and prepare customer drawing packages.
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
8+ YOEBS in Electrical/Optical Engineering or related field; 8+ years experience for BS, 7+ for MS, 5+ for PhD in photonics or related; strong communication and English proficiency; experience in silicon photonics design, testing, and packaging.
Hannaford SupermarketsEuronext Amsterdam: AD: Operates a chain of supermarkets selling food and groceries.
Customer-service oriented deli associate able to slice, prepare, weigh and package deli products, meet physical demands, complete training, and develop product knowledge.
National GridLondon Stock Exchange: NG: Operates electricity and natural gas transmission and distribution networks.
5+ YOEAAS in Engineering Technology, valid driver's license, CAD proficiency, 5+ years utility drafting/design experience, ability to develop gas distribution design packages and mentor junior staff.
AMETEKNYSE: AME: Manufacturer of electronic instruments and electromechanical devices.
Experience developing 3D models and drawing packages using SolidWorks or similar CAD; knowledge of manufacturing, GD&T (ASME Y14.5), Mil-Specs, BOM management, and strong verbal/written communication.