1mo
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Flexible Packaging Engineer - Destiny Packaging |Salinas, CA
Salinas, California, United States
$75k-$80k/yr HybridFull Time
Knowledge of flexible packaging films and structures, Excel and presentation skills, ability to support sales and customers, bachelor's degree preferred, travel as needed; 2 years field experience preferred.
Microsoft PowerPoint, Keynote, Microsoft Excel
1d
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Integrated Circuit Packaging Architect Engineer
San Jose, California, United States
$183k-$314k/yr HybridFull Time
Proven semiconductor technology development and leadership experience in package architecture, process definition, DFM/DFY, and yield improvement; strong communication skills; BS/MS/PhD in related fields.
2mo
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Software Engineer 6 - Ads Pricing & Packaging
Los Gatos or New York
$499k-$900k/yr OnsiteFull Time
10+ YOE10+ years software development experience (5+ years on inventory management); expertise in yield optimization, dynamic pricing, auction mechanics, rate card and packaging systems; API and data model design; technical leadership and strong communication.
VAST, OpenRTB
2mo
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Software Engineer 6 - Ads Pricing & Packaging
Los Gatos or New York
$499k-$900k/yr OnsiteFull Time
10+ YOE10+ years software development; 5+ years in inventory management and yield optimization; experience with dynamic pricing, rate cards, and auction mechanics; strong leadership and communication skills.
Programming, API Design, Data Modeling, Advertising Technology, Auction Systems, Rate Card Management, Inventory Management Systems
3w
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
3w
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Software Engineer 5 - Ads Pricing & Packaging
Los Gatos, California, United States
$388k-$619k/yr OnsiteFull Time
Experience building inventory management and monetization systems for advertising, distributed systems, cloud applications, microservices, NoSQL, Apache Kafka, CI/CD/DevOps, and cross-functional project delivery.
Apache Kafka, NoSQL, CI/CD, VAST, OpenRTB
3w
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Advanced Package Design Engineer
San Jose, California, United States
OnsiteFull Time
10+ YOE10+ years experience in 2.5D/3D IC packaging, familiarity with packaging manufacturing flows, yield and reliability qualification, CAD/EDA flows, strong communication and cross-functional collaboration; BS in engineering required, MS/PhD preferred.
CAD, PDK, EDA
1mo
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Assembly Process Development Engineer
Morgan Hill, California, United States
$117k-$171k/yr OnsiteFull Time
8+ YOEBS/MS in engineering preferred; 8+ years in package/assembly process development (die attach, SMT, lid attach); hands-on die bond experience (Datacon EVO); experience with FMEA, SPC, DoE, GR-468 qualification and failure analysis.
Datacon EVO, FMEA, DFMEA, PFMEA, SPC, Pareto Analysis, Control Charts, 8D, DoE, GR-468
1mo
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Mechanical Design Engineer
Morgan Hill or Melbourne or Lowell or North America or Europe or Asia
$82k-$131k/yr OnsiteFull Time
5+ YOEMechanical engineering degree with 5+ years in electronics packaging/assembly, proficiency in SolidWorks/AutoCAD and thermal analysis (Icepak preferred), GD&T, machining, tolerance/material selection, vendor coordination, BOM and DFM experience.
SolidWorks, Icepak, AutoCAD, PCB layout viewers, GD&T
1mo
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EMIR Engineer, Annapurna Labs - Cloud Scale Machine Learning
Austin or Cupertino
$136k-$213k/yr OnsiteFull Time
Experienced EM/IR engineer for SoC EMIR sign-off, power-grid design and analysis, EMIR flow setup, cross-domain IR analysis (die/package/board), EDA tool collaboration, and post-silicon correlation.
SystemVerilog, Make, FusionCompiler, Innovus, PrimePower, PrimeTime, ARM
3mo
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Director, Product Development Engineering-ASIC/SoC
San Jose, California, United States
$204k-$349k/yr OnsiteFull Time
Experience in semiconductor business development and custom ASIC/SoC solutions; strong technical understanding of chip architecture, IP, packaging, and design ecosystems; proven ability to manage large customer engagements and executive relationships.
ASIC, SoC, FPGA, IP, packaging, design tools
3mo
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Director, Product Development Engineering-ASIC/SoC
San Jose, California, United States
OnsiteFull Time
Semiconductor business development experience; ASIC/SoC/custom FPGA knowledge; leadership of large cross-functional teams; strong strategic, financial, and communication skills.
ASIC, SoC, FPGA, IP, packaging, software, financial modeling
3w
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Manufacturing Manager
Salinas, California, United States
$136k-$182k/yr OnsiteFull Time
5+ YOEBS/BA or equivalent experience, 5+ years industry experience, knowledge of corrugated packaging manufacturing, leadership, EPA compliance, continuous improvement and people development.