36 packaging developer jobs at 17 companies in Superior, AZ
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Packaging Module Engineer
Phoenix or Chandler
$99k-$189k/yr OnsiteFull Time
1+ YOEMaster's in engineering/physics/chemistry with 1+ years (or PhD with 6+ months). Experience in packaging assembly, SPC, DOE, DFM, data analysis, and risk assessment required.
2mo
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$142k-$214k/yr OnsiteFull Time
7+ YOEBS in Electrical, Materials, or Mechanical Engineering; 7+ years in process or packaging engineering; experience with automated packaging equipment and semiconductor/display production; travel up to ~10%
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom
2mo
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Packaging Process Engineer – Microdisplay
Chandler, Arizona, United States
$135k-$203k/yr OnsiteFull Time
7+ YOEBS in engineering; 7+ years in process/packaging in microfabrication; experience with automated packaging equipment; ISO 5 cleanroom experience; travel up to 10%; proficiency with DOE/SPC.
Automated packaging equipment, DOE, SPC, ISO 5 cleanroom, Six Sigma
2w
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Advanced Packaging Design Engineer
Santa Clara or Chandler
$192k-$287k/yr OnsiteFull Time
5+ YOEBS/MS/PhD in engineering,5-10 years advanced packaging design experience, expertise with Cadence APD, high-speed interfaces, substrate and assembly processes, and cross-functional collaboration.
Cadence APD, AutoCAD
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Sr. Package Layout Engineer, Annapurna Labs - AI Silicon Packaging
Tempe or Austin or Cupertino
$159k-$248k/yr OnsiteFull Time
10+ YOEBachelor's in EE or related, 10+ years IC package layout and physical design experience, expertise with advanced packaging (2.5D/3D, WLP, RDL, TSV), package DRC/DFM, and collaboration with SI/PI and manufacturing teams.
Cadence APD/SiP, Synopsys IC Packaging, Mentor Xpedition, Python, TCL, Skill, Ravel
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Advanced Packaging Principal Integration Technologist
Tempe or United States
$179k-$288k/yr OnsiteFull Time
10+ YOEMSc or higher in engineering, 10+ years 300mm process/equipment R&D experience in advanced packaging, 7+ years external business development experience, consortium engagement preferred, strong equipment/process/integration knowledge and ecosystem network. US work authorization required.
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.
6d
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Sr Staff Package Design Engineer
Tempe, Arizona, United States
OnsiteFull Time
10+ YOE10+ years experience in package development for power SiP/module, wafer-level and flip-chip LGA packaging; strong analytical, communication, and process integration skills.
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ASIC Packaging Signal/Power Integrity Hardware Engineering Technical Lead (Remote)
San Jose or Research Triangle Park or Acton or Dallas or Tempe or Cary or Carlsbad or Colorado Springs
$184k-$264k/yr RemoteFull Time
3+ YOEBachelor's/MS/PhD in Electrical Engineering with 3+ to 8+ years SI/PI experience; expertise in high-speed design, SI/PI simulation, layout review, SPICE; mentoring and leadership experience.
Cadence Sigrity, Ansys HFSS, Keysight ADS, Cadence APD, Ansys EM, SPICE, Vector Network Analysis, IBIS
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
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Senior Electrical Engineer - United States
Bedminster or Houston or Katy or Scottsdale
$120k-$150k/yr OnsiteFull Time
Applied knowledge of electrical codes and standards, power infrastructure design experience, ability to develop electrical drawing packages for PV and BESS projects, mentor team members, and perform cost/benefit analyses. PE licensure or path to licensure preferred.
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Facilities Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
1+ YOEAssociates degree, 1+ years facilities experience (3+ preferred), AutoCAD proficiency, ability to plan/design layouts, estimate costs, prepare bid packages, and lead small-to-mid facility projects.
AutoCAD
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Physical Failure Analysis Engineer II
Chandler, Arizona, United States
OnsiteFull Time
2+ YOEMinimum 2 years experience in physical failure analysis, expert with Dual Beam FIB/SEM, experience with package decapsulation, CNC milling, X-ray and C-SAM, bachelor’s or master’s in a technical field, strong technical writing and device knowledge.
Dual Beam FIB/SEM, FIB/SEM, SEM, TEM, CNC milling, X-ray analysis, C-SAM (Scanning Acoustic Microscopy)
1w
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Work Package Technician
Tempe, Arizona, United States
OnsiteFull Time
2+ YOE2+ years construction/project controls/document control experience preferred; ability to develop and coordinate construction work packages, read engineering drawings, and use project management software.
Microsoft Office Suite, Bluebeam, Primavera P6, Procore, Aconex, Microsoft SharePoint, Autodesk Construction Cloud
5d
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Designer I/II
Casa Grande, Arizona, United States
OnsiteFull Time
2+ YOEPrepare and modify plant design change packages, gather and develop engineering data, support design documents and walk‑downs; requires CADD coursework and design experience.
CADD, Windows
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Senior Technical Lead, New Product Development, SiC & Si Power Discretes/Modules
Scottsdale or San Jose
OnsiteFull Time
10+ YOEMaster's/PhD in EE/Materials/Physics, 10+ years in power semiconductor product development (SiC/Si MOSFET preferred), deep device and packaging expertise, proven cross-functional leadership, escalation and executive communication skills.
2w
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NPI & Technology Leader
Chandler, Arizona, United States
OnsiteFull Time
15+ YOEBachelor's in engineering or related field; 15+ years in semiconductor R&D, technology or product development; demonstrated NPI leadership, process/package/IP expertise, and program management experience.
1mo
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Workface Planner
Chandler, Arizona, United States
OnsiteFull Time
5+ YOEDevelop and maintain Installation Work Packages (IWPs), manage constraints, support AWP/WFP processes, coordinate with engineering/procurement/construction, and analyze planning performance. Requires bachelor's + 5+ years experience or 9+ years without degree.
2mo
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Package Consultant 3
Austin or Hartford or Indianapolis or Raleigh or Richardson or Tempe or United States
OnsiteFull Time
Hands-on Boomi AtomSphere integration design/development, REST/SOAP/XML/JSON and flat file experience, ability to design solution architecture and lead large data migrations; bachelor\u0002s degree or equivalent experience; must be authorized to work in the US without employer sponsorship.
Boomi AtomSphere, Boomi, REST, SOAP, XML, JSON, CSV, iPaaS, Cloud Integration and API Management, TIBCO, Vitria, webMethods, IBM WBI, SAP NetWeaver