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Senior Packaging Engineer
Hillsboro, Oregon, United States
$79k-$147k/yr OnsiteFull Time
3+ YOEB.S. in Packaging or related engineering, 3+ years pharmaceutical/regulatory engineering experience, knowledge of secondary/tertiary packaging design and qualification, ASTM/ISTA/IATA standards, ArtiosCAD, Solidworks, TOPS, cGMP change control, and project management skills.
ArtiosCAD, Solidworks, TOPS, ASTM, ISTA, IATA
2w
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Senior IC Packaging Engineer
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$120k-$235k/yr HybridFull Time
1+ YOEAdvanced IC packaging expertise with experience in 2.5D/3D packaging, substrate/interposer design, supplier management, reliability assessment, and EDA/PCB layout tools; advanced degree or equivalent experience required.
Cadence Allegro
2d
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Silicon Packaging Design Engineer
Phoenix or Hillsboro or Chandler
$164k-$232k/yr OnsiteFull Time
10+ YOEMaster's in EE/ME, 10+ years PCB layout with Cadence Allegro and Cadence Constraint Manager, 5+ years hardware development (schematic, SI, power delivery), PCB manufacturability and DRC expertise, strong analytical and collaboration skills.
Cadence Allegro, Cadence Constraint Manager, Siemens Xpedition, Product Lifecycle Management (PLM)
2mo
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Silicon Packaging Design Engineer
Phoenix or Hillsboro
$106k-$200k/yr OnsiteFull Time
3+ YOEBachelor's degree with 3+ years or Master's with 2+ years in Electrical/Computer Engineering or STEM; experience with custom layout/EDA tools; silicon physical layout and interconnects; strong collaboration.
Virtuoso, Innovus, FusionCompiler, ICvalidator, Calibre
3w
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Advanced Packaging Lithography Development Manager
Hillsboro, Oregon, United States
$156k-$298k/yr OnsiteFull Time
6+ YOEMaster's or PhD in engineering or related field, 5–6+ years relevant lithography/process development experience, equipment expertise (ASML, Canon, Nikon, track), project management and people leadership.
ASML, Canon, Nikon, scanner/stepper systems, track equipment, Design of Experiments (DOE)
3w
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Advanced Packaging Dry Etch Module Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr OnsiteFull Time
2+ YOEMaster's or PhD in engineering/physical science with process development experience in semiconductor manufacturing; experience with DOE, plasma etch equipment, and driving programs to production.
2mo
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Principal Engineer, Hybrid Bonding Module
Hillsboro, Oregon, United States
$211k-$298k/yr OnsiteFull Time
15+ YOEExpert in hybrid bonding and advanced packaging; lead module development, FOK equipment, and high-volume manufacturing readiness; strong communication and mentoring skills.
Hybrid bonding, Wafer bonding, Advanced packaging, Process development, Yield improvement, Reliability enhancement, FOK platform development
1mo
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Senior Design Lead (122083)
Chandler or Hillsboro
OnsiteContract
10+ YOEBachelor's or Master's in Electrical/Electronics Engineering; ~10+ years IC packaging/package design for senior level (4–6+ years mid); hands-on experience with Siemens (Mentor) Xpedition or Cadence Allegro/APD, physical/substrate design, SI/PI-aware design, DFM and design rule compliance.
Siemens (Mentor) Xpedition (XPD), Cadence Allegro, Advanced Package Designer (APD / SiP)
1mo
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Circularity Innovation Engineer
Vancouver or Spring
$116k-$182k/yr OnsiteFull Time
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, experience with global supply chains, cross-functional leadership, and expertise in recycled/renewable materials and packaging transformation.
Workday
4w
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Staff Mechanical Engineer
Fremont or Salem
$185k-$240k/yr HybridFull Time
8+ YOE8+ years mechanical design experience, B.S./M.S. in Mechanical Engineering, experience with mechanism design, electronics packaging, FEA/thermal analysis, Creo, Windchill, Jira/Confluence; ability to mentor engineers.
Creo, Windchill, Jira, Confluence
1mo
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Circularity Innovation Engineer
Vancouver or Spring
$116k-$182k/yr OnsiteFull Time
8+ YOEBachelor's in engineering, 8+ years experience in circular economy, packaging or materials engineering, expertise in recycled/renewable materials, global supply chain experience, strong cross-functional and problem-solving skills.
Workday
3w
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Field Applications Engineer
Hillsboro, Oregon, United States
$83k-$141k/yr OnsiteFull Time
0+ YOEMaster's degree (0 years) or Bachelor's plus 2 years; experience with metrology, testing techniques (spectroscopy, HPLC), wet etch and packaging applications; strong problem solving, technical writing, project coordination, and training skills; ~30% travel.
Microsoft Outlook, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Project, spectroscopy, HPLC
3d
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Staff Manufacturing Engineer, Advanced Components (62390)
Lake Oswego, Oregon, United States
OnsiteFull Time
8+ YOEB.Sc. or M.Sc. in EE/Physics/Materials,8+ years experience in chip scale packaging and high-reliability electronics, strong failure analysis and supplier qualification skills, leadership and technical writing ability.
Microsoft Excel, Microsoft Word, Microsoft PowerPoint
1mo
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Principal Signal and Power Integrity Engineer
Raleigh or Austin or Hillsboro or Mountain View or Redmond
$143k-$275k/yr HybridFull Time
3+ YOEDegree in EE/CE/CS (or equivalent) with required technical experience (PhD+3, MS+6, BS+8); experience in power integrity, silicon/package/system PI, advanced packaging, modeling, and strong communication skills.
2d
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Mechanical Product Design Engineer II
Portland, Oregon, United States
$86k-$110k/yr HybridFull Time
2+ YOEBachelor's in engineering and 2+ years related experience; proficiency with CAD (preferably NX), Microsoft Office, strong communication, and ability to support vocational chassis packaging.
Microsoft Word, Microsoft Excel, Microsoft PowerPoint, CAD, NX, Power Bi, VBA, Imacs, Smaragd, ERSE
1mo
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MEP Cost Control Engineer
Lake Oswego or Beaverton or Gresham or Hillsboro or Portland or McMinnville or Oregon
$90k-$120k/yr OnsiteFull Time
2+ YOEAnalyze MEP cost proposals, prepare cost estimates and authorization packages, maintain job cost reports and forecasts, perform on-screen material takeoffs; 2+ years construction estimating experience and bachelor's in engineering or construction management required.
Microsoft Windows, Microsoft Excel, Microsoft Word, Microsoft Outlook, Microsoft PowerPoint, Microsoft Teams, Prolog, Procore, E-Builder, Bluebeam, Microsoft Project, Primavera P6, AutoCAD, Revit, Navisworks
4d
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Principal Signal & Power Engineer (Die to Die and Chiplet Design)
Raleigh or Redmond or Mountain View or Austin or Hillsboro
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced degree in EE/CE/CS or equivalent experience with 3–8+ years technical experience; expertise in signal and power integrity, chiplet and package design; ability to pass Microsoft Cloud Background Check and export-control screening.
1mo
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Fabrication Estimator
Vancouver, Washington, United States
$80k-$95k/yr OnsiteFull Time
5+ YOE5+ years industrial construction estimating experience; proficiency in Microsoft Excel and estimating tools; ability to perform quantity takeoffs, develop labor/material pricing, evaluate subcontractor quotes, and assemble compliant bid packages.
Microsoft Excel, Procore, Autodesk Build, Navisworks, Tekla Powerfab, Trimble, SolidWorks, SharePoint, Strumis
2mo
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Package Gas Driver 1 - Portland, OR
Portland, Oregon, United States
$31-$32/hr FieldFull Time
Commercial driver responsible for delivering gas cylinders; requires valid commercial Class B license with Hazmat and air brake endorsements, medical card, ability to lift heavy cylinders, HS diploma or equivalent, and safe driving record.