3d
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Packaging Engineer
Fort Collins, Colorado, United States
$85k-$100k/yr HybridFull Time
4+ YOEBachelor's in Engineering, 4+ years packaging engineering or project experience, CAD experience, paper-based packaging knowledge, Solidworks/ArtiosCAD and ISTA/ASTM experience preferred.
Solidworks, ArtiosCAD, PLM
2d
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Package Design Engineer
San Jose or Austin or Fort Collins
$122k-$195k/yr OnsiteFull Time
6+ YOEBSEE with 8+ years or MSEE with 6+ years in flip-chip BGA package design; knowledge of package signal and power integrity; Cadence APD and Cadence SKILL experience preferred; project management and collaboration skills.
Cadence APD, Cadence SKILL
1w
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ASIC Package Design Manager
Fort Collins, Colorado, United States
$144k-$230k/yr OnsiteFull Time
12+ YOE3+ Mgmt12+ years in flip-chip-BGA package design with high-speed SerDes, knowledge of SI/PI and power integrity, project and people management experience, BSEE/MSEE or similar, and ability to collaborate globally.