12 packaging engineer jobs at 11 companies in Connecticut

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Senior Packaging Engineer - North Haven
North Haven, Connecticut, United States
$98k-$148k/yr OnsiteFull Time
Medtronic
MedtronicNew York Stock Exchange: MDT: Develops and manufactures medical devices and digital health solutions.
4+ YOEDegree in packaging/mechanical/manufacturing engineering, 4+ years experience (Bachelors) or equivalent, experience in regulated packaging operations, IQ/OQ/PQ validation, CAPA, Lean/Six Sigma, and project management skills.
IQ, OQ, PQ, Lean Manufacturing, Six Sigma
2w
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Senior Packaging Engineer - North Haven
North Haven, Connecticut, United States
$98k-$148k/yr OnsiteFull Time
Medtronic
MedtronicNYSE: MDT: Developing and manufacturing medical technologies and therapies globally.
4+ YOEExperience in packaging/process engineering, equipment validation (IQ/OQ/PQ), regulated industry compliance, project leadership, failure analysis, and continuous improvement.
Installation Qualification (IQ), Operational Qualification (OQ), Performance Qualification (PQ), Lean Manufacturing, Six Sigma
2w
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Junior Software Packaging Engineer
California or Colorado or Connecticut or Florida or Georgia or Illinois or Kansas or Massachusetts or Maryland or Maine or New Jersey or North Carolina or New York or Oregon or Tennessee or Texas or Virginia or Washington or Austin or Tampa
$85k-$110k/yr HybridFull Time
NinjaOne
NinjaOne: Unified IT platform for automated endpoint management and security.
2+ YOE2+ years technical experience, Windows OS familiarity, scripting or OOP experience, Git knowledge, comfortable with AI coding assistants; packaging, installer analysis, and automation skills.
Java, Kotlin, C++, Golang, Postgres, AWS, Git, PowerShell, Zsh, CI/CD, Copilot, Claude
3w
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Packaging Design Manager
Trumbull, Connecticut, United States
$103k-$154k/yr OnsiteFull Time
UnileverLondon Stock Exchange: ULVR: Manufactures and distributes food, home, and personal care products.
6+ YOE6+ years packaging/industrial design or packaging engineering experience; experience leading projects from concept to launch; strong packaging materials and manufacturing process knowledge; cross-functional collaboration and stakeholder management.
Siemens NX, KeyShot, Adobe Creative Suite
2mo
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Genset Mechanical Integration Engineer
Suffield or Bloomfield
OnsiteFull Time
LiquidPiston
LiquidPiston: Developing compact, high-efficiency rotary internal combustion engines.
2+ YOEBS in Mechanical Engineering; 2+ yrs engine packaging/integration; SolidWorks; mechanical design and simulation; subsystem integration; independent problem-solving.
SolidWorks, ANSYS
2w
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GIE - EDE Engineer 3
Canaan, Connecticut, United States
OnsiteFull Time
BD
BDNYSE: BDX: Manufactures medical devices, surgical instruments, and pharmacy automation systems.
3+ YOEBachelor's in mechanical or controls engineering or equivalent, 3+ years automation/assembly/packaging experience, project leadership, SolidWorks preferred, GMP/ISO and Lean experience preferred, willingness to travel up to 25%.
SolidWorks
4d
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Design & Development Engineer
Shelton, Connecticut, United States
$110k-$140k/yr OnsiteFull Time
Sperry Rail
Sperry Rail: Global provider of rail flaw detection and inspection services.
5+ YOEBachelor's in engineering,5+ years product development/platform design,SolidWorks and PDM/PLM experience,GD&T proficiency,ability to produce full technical data packages and BOMs,structured problem-solving skills.
SolidWorks, PDM, PLM, Sage X3, VCRM
2mo
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Finishing Operator III 2nd Shift (56249)
South Windsor, Connecticut, United States
$27-$28/hr OnsiteFull Time
Mill Rock Packaging
Mill Rock Packaging: Produces high-end sustainable paperboard packaging and folding cartons.
1+ YOEGED/high school; 1+ year folding carton/printing packaging; 1+ year folder-gluer experience; strong communication, math, and computer skills; ability to work overtime.
Folder-gluer machine, Radius software
2mo
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Structural Designer
Manchester, Connecticut, United States
OnsiteFull Time
Allied Printing Services
Allied Printing Services: Full-service commercial printing and direct mail solutions provider.
3+ YOE3+ years in structural design for printing/packaging; proficient in ArtiosCAD, Impact CAD, Kasemake, Illustrator, Esko DeskPack; CAM tables (Kongsberg, Zund); strong collaboration and project management.
ArtiosCAD, Impact CAD, Kasemake, Adobe Illustrator, Esko DeskPack, Kongsberg, Zund
5d
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Program Manager
Manchester or Ontario or Nebraska or North Dakota or North Carolina or Montana or Texas or Tennessee or South Dakota or Pennsylvania or Oklahoma or New York or Nevada or New Mexico or Wisconsin or New Jersey or South Carolina or New Hampshire or Ohio or Minnesota or Louisiana or Kentucky or Indiana or Illinois or Idaho or Georgia or Florida or Colorado or Wyoming or West Virginia or Vermont or Virginia or Utah or Mississippi or Missouri or Michigan or Maryland or Massachusetts or Kansas or Iowa or Delaware or Connecticut or Arizona or Arkansas or Alabama or District of Columbia
$113k-$141k/yr OnsiteFull Time
Amcor
AmcorNYSE: AMCR: Develops and produces flexible and rigid packaging solutions globally.
7+ YOE7+ MgmtBachelor's in mechanical or electrical engineering (or equivalent), 7+ years plastics packaging engineering and project management experience, SPC experience, ability to manage complex capital projects and travel ~60%.
SPC
1mo
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First Article Technician
Bloomfield, Connecticut, United States
$25-$37/hr OnsiteFull Time
IRP Medical
IRP Medical: Manufacturer of precision silicone and elastomer components for medical devices.
2+ YOEPrepare AS9102-compliant FAI packages, review and bubble engineering drawings, create inspection templates, use Net-Inspect and Microsoft Office; high school diploma and 2+ years manufacturing inspection or related experience preferred.
Net-Inspect, Microsoft Word, Microsoft Excel, Microsoft Outlook
3w
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Program Manager - Semiconductor
Middlefield, Connecticut, United States
$160k-$190k/yr OnsiteFull Time
AMETEK
AMETEKNYSE: AME: Manufacturer of electronic instruments and electromechanical devices.
6+ YOEBachelor's in engineering, 6-8 years semiconductor experience (HBM/advanced packaging preferred), proven program leadership, ability to work with global customers, domestic/international travel required, US work authorization and export-controlled access required.