19 packaging engineer jobs at 10 companies in Windsor, CO
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Chief Packaging Engineer - 906
Brooklyn Park or Broomfield
$208k-$260k/yrHybridFull Time
Quantinuum: Building full-stack quantum computing hardware and software systems.
Advanced semiconductor/photonic packaging expert with significant senior-level experience (12+ years with PhD, 15+ with MS, or 18+ with BS). Must be a U.S. Person and meet national security nationality restrictions.
Sr. Internal Harnessing and Packaging Engineer – BNS Core Components
Longmont or Denver
$144k-$202k/yrOnsiteFull Time
Blue Origin: Develops reusable rockets and systems for human spaceflight.
8+ YOEBS in engineering,8+ years in electronics packaging or harnessing,product transition to high-rate production,DfM/DfA,IPC/WHMA-A-620 knowledge,proficiency with Creo/SolidWorks/Altium/Windchill,U.S. work eligibility required.
MoogNYSE: MOG.A: Design and manufacture of precision motion control systems.
5+ YOEBachelor's in Mechanical Engineering or related, 5+ years designing/testing CCAs, cabling, and enclosures; ability to obtain U.S. security clearance; proficiency with NX, Teamcenter, and ANSYS Workbench; strong communication and customer interface skills.
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
4+ YOEBachelor's or equivalent,4+ years software development with Linux system-level focus, experience with package managers and repositories, scripting in Python or Bash, strong debugging and collaboration skills.
Associate Engineer, Product Innovation - Metal Packaging Laboratories
Westminster, Colorado, United States
$67k-$93k/yrOnsiteFull Time
Ball CorporationNYSE: BALL: Produces sustainable aluminum packaging for beverages and household products.
0+ YOEBachelor's in engineering or 0–2 years engineering experience (or 3 years related experience), metrology and data analysis skills, technical writing, and ability to execute test plans and root cause analysis.
4+ YOEBS in Engineering + 4+ years related experience (advanced degree may substitute), ability to work hands-on in Class 100 cleanroom, strong process documentation and configuration-control skills, effective multidisciplinary communication, U.S. citizenship required and must be able to obtain Top Secret/SCI with polygraph.
Software Linux Engineer - Installation and Packaging
Santa Clara or Westford or St. Louis or Boulder or New York
$152k-$288k/yrOnsiteFull Time
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
4+ YOEBachelor's or equivalent, 4+ years Linux system-level software development, experience with package management, repository and release automation, Python or Bash scripting, CI/CD and kernel/driver familiarity.
4+ YOEHigh school diploma + 4+ years related experience (or degree substitution), experience in microelectronic/focal plane assembly, cleanroom and ESD handling certifications obtainable, microscope inspection proficiency, strong organization and communication.
Quest Global: Global engineering services for product development and lifecycle management.
3+ YOEBachelor’s in Electrical Engineering; 3+ years in installation packages/field engineering in power/industrial settings; travel ~15%; strong communication and customer interaction.
Electrical drawings, Cable schedules, Power bus routing, Equipment arrangements, Specifications generation, Field engineering, Interconnection drawings, Turbine control products, GE Excitation
CesiumAstro: Develops phased array communication systems for satellites and aircraft.
9+ YOEBS or MS in Mechanical/Aerospace Engineering, 9+ years in electronics packaging design (thermal, vibration, stress), expertise in thermal management, FEA/thermal simulation (Ansys), SolidWorks CAD, GD&T, EMI/EMC mitigation, spaceflight hardware experience, and strong communication skills. US person required.
CesiumAstro: Develops phased array communication systems for satellites and aircraft.
9+ YOEBS/MS in Mechanical or Aerospace Engineering; 11 years' experience (9 with MS) in electronics packaging design with thermal, vibration, and stress analysis; expertise in CAD/FEA, SolidWorks Simulation, CNC, EMI/EMC, GD&T; excellent communication; U.S. eligibility required for export-controlled work.
Quest Global: Global engineering services for product development and lifecycle management.
5+ YOEBachelor's in Engineering and at least 5 years' experience designing and integrating DCS/PLC and BOP cabinet systems for power plant applications; proficiency with AutoCAD Electrical, Autodesk Inventor, PLM tools; willingness to travel up to 10%.
Engineer Senior Principal - Optical - Focal Plane Systems
Boulder, Colorado, United States
$133k-$226k/yrOnsiteFull Time
BAE SystemsLondon Stock Exchange: BA: Designs and manufactures advanced defense and aerospace systems.
8+ YOEBS in engineering or related field + 8+ years experience (advanced degree may substitute), experience modeling/testing focal planes, mechanical/thermal/contamination packaging knowledge, strong communication and leadership; eligible for Top Secret/SCI polygraph.
Lead Engineer - Packaged & Mechanical Systems Product Standards and Methods
Longmont, Colorado, United States
$98k-$164k/yrOnsiteFull Time
GE VernovaNYSE: GEV: Designs and services technologies for global power generation and electrification.
5+ YOEBachelor's in Mechanical Engineering, 5+ years mechanical design experience, 2+ years controls experience, leadership and interpersonal skills, CAD and BOM experience, familiarity with ANSYS/SDRC I-Deas and Inventor/UG/SolidWorks.
BroadcomNASDAQ: AVGO: Designs and sells semiconductors and infrastructure software to enterprises.
12+ YOE3+ Mgmt12+ years in flip-chip-BGA package design with high-speed SerDes, knowledge of SI/PI and power integrity, project and people management experience, BSEE/MSEE or similar, and ability to collaborate globally.
DanoneEuronext Paris: BN: Global food and beverage producing dairy and plant-based goods.
5+ YOEBachelor's or Master's in engineering, food science, supply chain, packaging or related; 5+ years R&I/CPG/governance or related experience; experience with PLM/digital platforms, Excel and Power BI; strong governance, risk, and stakeholder skills.
PLM, Microsoft Excel, Power BI, Microsoft collaboration tools