24 packaging module development engineer jobs at 6 companies in United States
1mo
Save
Mark Applied
Hide
Packaging Module Development Engineer
Phoenix or Chandler
$85k-$163k/yr OnsiteFull Time
1+ YOEBachelor's or Master's in engineering with 1+ years experience, familiarity with equipment adjustment, process characterization, SPC and DOE, semiconductor packaging or manufacturing experience, and cross-functional collaboration skills.
Statistical Process Control (SPC), Design of Experiments (DOE)
1mo
Save
Mark Applied
Hide
Restraints Electronics Module Development Engineer
Dearborn, Michigan, United States
$100k-$167k/yr HybridFull Time
3+ YOEBachelor's degree in engineering, 3+ years automotive experience, product development and validation experience, knowledge of passive safety electronics, CAD packaging, CAN networking and supplier support.
WERS, IVS, FEDE, JFROG, VSEM, JIRA, 3DX, CATIA, Team Center, CAN
2d
Save
Mark Applied
Hide
Wireless Module Engineer
Austin or San Diego or Sunnyvale or North America
OnsiteFull Time
2+ YOEBachelor's degree, strong RF fundamentals, communication and project leadership skills; preferred advanced technical degree, 2+ years wireless module development, ATE, packaging, reliability, data analysis, and vendor management.
Automated Test Equipment (ATE), I2C, PCIe, VCO, Cpk, AI/ML, GRR, PCB, RF
2mo
Save
Mark Applied
Hide
Staff Semi Packaging Engineer
San Jose, California, United States
$130k-$188k/yr OnsiteFull Time
3+ YOEMaster's in a relevant engineering field + ≥3 years industrial IC/package experience; expertise in analog IC package/module design, reliability and BOM selection, CAD modeling, and process development (FMEA, SPC, DOE); OSAT collaboration experience.
CAD
1mo
Save
Mark Applied
Hide
Director of Advanced IC Packaging Development
San Jose, California, United States
$200k-$250k/yr HybridFull Time
15+ YOE15+ years in semiconductor package development with expertise in Power SiP/modules, flip‑chip and wafer‑level packaging; experience leading R&D, NPI, OSAT qualification, SPC and statistical methods.
SPC, DOE, OSAT
1mo
Save
Mark Applied
Hide
Development Team Manager - Opto Electronic Modules
Allentown, Pennsylvania, United States
$125k-$205k/yr OnsiteFull Time
5+ YOEMS in Mechanical Engineering, 5-10 years mechanical design or product development, project leadership experience, strong interpersonal and communication skills; CAD, FEA, optical packaging, statistical analysis and Agile preferred.
3D CAD, solid modeling tools, FEA, Agile
2mo
Save
Mark Applied
Hide
Senior Technical Lead, New Product Development, SiC & Si Power Discretes/Modules
Scottsdale or San Jose
OnsiteFull Time
10+ YOEMaster's/PhD in EE/Materials/Physics, 10+ years in power semiconductor product development (SiC/Si MOSFET preferred), deep device and packaging expertise, proven cross-functional leadership, escalation and executive communication skills.
Explore Jobs