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Senior Engineer, Electronics Packaging Design
Erie, Pennsylvania, United States
$105k-$149k/yr OnsiteFull Time
10+ YOEBachelor's in Mechanical Engineering,10+ years designing mechanical packaging for electronics,proficiency with Siemens NX and ANSYS/Icepak,knowledge of PCB integration,thermal/EMC/shock/vibration requirements,manufacturing support,ability to travel up to 10%.
Siemens NX, ANSYS, Icepak
2mo
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Sr. Principal Design Engineer
Rolling Meadows or Amherst or Apopka or Charlottesville or Sykesville or Annapolis
$112k-$185k/yr HybridFull Time
8+ YOEBachelor's in STEM with 8+ years or Master’s in STEM with 6+ years; experience with PCB fabrication, CAD tools (Cadence Allegro), DFM rules; US citizenship and ability to obtain security clearance; strong communication.
Cadence Allegro, Valor NPI, CAD tools
1mo
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Electrical Engineer IV
Buffalo, New York, United States
$127k-$159k/yr OnsiteFull Time
8+ YOEBachelors/Masters in EE or equivalent; 8+ years hardware engineering experience; expertise in PCB design (Altium/Cadence), high-speed interfaces, power/analog design, microcontrollers, Python/C/C++, sensor integration, manufacturing and test; English proficiency.
Altium Designer, Cadence Allegro, Python, C/C++, Bash, NVIDIA Jetson, I2C, SPI, UART, CAN, CAN FD, RS232, RS485, USB, PCIe, Ethernet, GMSL, FPD-Link, STM32, NXP, TI, ARM Cortex, Multimeter, Oscilloscope, Logic Analyzer
3w
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Lead Engineer - Electronics & Mechanical Packaging
Erie, Pennsylvania, United States
$62k-$85k/yr OnsiteFull Time
3+ YOEBachelor's in Mechanical Engineering, 3+ years mechanical packaging design for electronic assemblies, proficiency in 3D CAD and simulation, PCB integration, thermal and stress analysis, product launch experience.
Siemens NX, Unigraphics, ANSYS, Icepak, CFD