PromotedHiringCafe
Founding Machine Learning / AI Search Engineer
Cupertino, CA, US
$160k-$310k/yr On-SiteFull Time
Build the ML and AI search behind HiringCafe — ranking, recommenders, retrieval, and LLM agents that surface jobs people would never find on their own.
Python, PyTorch, Elasticsearch, LLMs
3mo
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Principal Process Engineer, Thin Films
Boise, Idaho, United States
OnsiteFull Time
7+ YOEMS or PhD in Materials Science, Chemical Engineering, Physics, or related field; 7+ years in thin film deposition; data analysis/DOE; knowledge of thermodynamics and kinetics.
thin-film deposition, plasma processing, data analysis, DOE, Python, AI scripting
4d
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Principal Quality Engineer
Redmond or Hillsboro or Mountain View or Santa Clara or Austin or Boise or Raleigh
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced electrical/hardware engineering degree and extensive experience in hardware quality, data-center debug, RCA, supplier quality management, and cross-team leadership; must meet Microsoft security screening.
2mo
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Principal Process Engineer, Die Bonding
Boise, Idaho, United States
OnsiteFull Time
8+ YOEBS + 8+ years semiconductor process engineering experience; expertise in die bonding/advanced packaging, DOE, data analysis, failure analysis, FMEA/8D, SPC/FDC/RMS/APC, supplier management, and strong communication skills.
Design of Experiments (DOE), FMEA, 8D, SPC, FDC, RMS, APC
3w
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Tainan or Bundang or Santa Clara or Heimstetten or Boise or Rehovot
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive experience in semiconductor process integration and advanced packaging, project management, technical leadership, data analysis, and communication skills.
3w
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
2mo
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Principal Program Manager (Hyperscaler Cloud Data Center - full lifecycle program ownership)
Boise or Irvine or Santa Clara
$160k-$237k/yr HybridFull Time
5+ YOEBachelor's in CS/EE with 10+ yrs; or Master's with 7+ yrs; 5+ yrs PM in semiconductor; strong leadership, communication, risk mgmt, and cross-functional skills.
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