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Principal Node Development Product Engineer, DPAG
Boise, Idaho, United States
OnsiteFull Time
Bachelor’s degree in Electrical, Computer Engineering, Materials Science or related field; experience in semiconductor manufacturing/tech development, DRAM exposure; strong data analysis and cross-functional collaboration; Python or data-analysis scripting preferred.
Python, Data analysis
2mo
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Principal Process Engineer, Die Bonding
Boise, Idaho, United States
OnsiteFull Time
8+ YOEBS in engineering; 8+ years in semiconductor process engineering; die bonding expertise; DOE; data analysis; strong communication; project management.
DOE, FMEA, SPC, FDC, 8D, Data analysis, DOE design of experiments
2w
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Principal Quality Engineer
Redmond or Hillsboro or Mountain View or Santa Clara or Austin or Boise or Raleigh
$143k-$275k/yr HybridFull Time
3+ YOEAdvanced electrical/hardware engineering degree and extensive experience in hardware quality, data-center debug, RCA, supplier quality management, and cross-team leadership; must meet Microsoft security screening.
2mo
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Principal Product Yield Analysis Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEBS/MS/PhD in Electrical, Electronics, Photonics, Materials Science & Engineering, Applied Physics, or Computer Engineering; 5+ years in semiconductor; experience in failure analysis and data analysis; strong English communication.
EDS A, Layout tracing, Advanced image analysis, Programming: Java, C++, Python, R
1mo
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Dry Etch Principal Process Development Engineer
Boise, Idaho, United States
OnsiteFull Time
7+ YOEBachelor's in engineering/materials/physics, 7+ years dry etch process development experience, strong plasma etch and reactor knowledge, experimental design and data analysis, cross-team communication skills.
SPC
1mo
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Tainan or Bundang or Santa Clara or Heimstetten or Boise or Rehovot
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive experience in semiconductor process integration and advanced packaging, project management, technical leadership, data analysis, and communication skills.
2mo
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Principal Program Manager (Hyperscaler Cloud Data Center - full lifecycle program ownership)
Boise or Irvine or Santa Clara
$160k-$237k/yr HybridFull Time
5+ YOEBachelor's in CS/EE with 10+ yrs; or Master's with 7+ yrs; 5+ yrs PM in semiconductor; strong leadership, communication, risk mgmt, and cross-functional skills.
1mo
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PROCT ADT Equipment Staff Engineer/ Principal (Dry Etch | Deposition CVD/PVD/Diffusion | CMP | Wet)
Boise, Idaho, United States
OnsiteFull Time
6+ YOEBachelor's in engineering or related field (or equivalent), 6+ years semiconductor manufacturing experience, expertise in equipment/process problem solving, data analysis/DOE, multi-site leadership, and supplier engagement.
3w
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Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Boise, Idaho, United States
OnsiteFull Time
2+ YOERequires a bachelor's degree in engineering/science, 2+ years in product integration/test/yield or related semiconductor roles, strong data analysis and problem-solving, communication skills, and ability to work cross-functionally with 20–50% travel.
3mo
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Principal Analog Design Engineer — Mixed-Signal PHY (Clocking / High-Speed I/O)
Boise or Folsom or Richardson or San Jose
$159k-$347k/yr OnsiteFull Time
10+ YOE10+ years analog/mixed-signal IC design; PLL/DLL/clocking; transistor-level simulations; analog-digital interfaces; lab data correlation
HSpice
1w
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Staff / Principal Full Stack AI Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEBachelor's degree or equivalent,5+ years building and deploying production AI/web applications; strong Python and JavaScript/TypeScript skills; cloud (AWS/Azure/GCP), Docker, Kubernetes, CI/CD, SQL experience; data pipeline and ML deployment expertise.
React, Angular, Streamlit, Python, FastAPI, JavaScript, TypeScript, Docker, Kubernetes, CI/CD, AWS, Azure, GCP, SQL, NVIDIA Omniverse, Gazebo, Unity Robotics Hub, Unreal Engine, Siemens Tecnomatix