18 principal data engineer jobs at 3 companies in Star, ID
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Principal Node Development Product Engineer, DPAG
Boise, Idaho, United States
OnsiteFull Time
Bachelor’s degree in Electrical, Computer Engineering, Materials Science or related field; experience in semiconductor manufacturing/tech development, DRAM exposure; strong data analysis and cross-functional collaboration; Python or data-analysis scripting preferred.
Python, Data analysis
3mo
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Principal Process Engineer, Die Bonding
Boise, Idaho, United States
OnsiteFull Time
8+ YOEBS in engineering; 8+ years in semiconductor process engineering; die bonding expertise; DOE; data analysis; strong communication; project management.
DOE, FMEA, SPC, FDC, 8D, Data analysis, DOE design of experiments
2mo
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Principal Product Yield Analysis Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEBS/MS/PhD in Electrical, Electronics, Photonics, Materials Science & Engineering, Applied Physics, or Computer Engineering; 5+ years in semiconductor; experience in failure analysis and data analysis; strong English communication.
EDS A, Layout tracing, Advanced image analysis, Programming: Java, C++, Python, R
3mo
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Principal Process Engineer, Die Bonding
Boise, Idaho, United States
OnsiteFull Time
8+ YOEBS + 8+ years semiconductor process engineering experience; expertise in die bonding/advanced packaging, DOE, data analysis, failure analysis, FMEA/8D, SPC/FDC/RMS/APC, supplier management, and strong communication skills.
Design of Experiments (DOE), FMEA, 8D, SPC, FDC, RMS, APC
2mo
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Principal Engineer, Adv DRAM PI
Boise, Idaho, United States
OnsiteFull Time
5+ YOEMS (required) or PhD in physics/materials science/EE, 5+ years semiconductor process integration experience, strong device physics and materials knowledge, project management and team leadership, data analysis and experiment design skills.
8D, FMEA, SPC
1mo
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Dry Etch Principal Process Development Engineer
Boise, Idaho, United States
OnsiteFull Time
7+ YOEBachelor's in engineering/materials/physics, 7+ years dry etch process development experience, strong plasma etch and reactor knowledge, experimental design and data analysis, cross-team communication skills.
SPC
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Tainan or Bundang or Santa Clara or Heimstetten or Boise or Rehovot
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive experience in semiconductor process integration and advanced packaging, project management, technical leadership, data analysis, and communication skills.
1mo
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Dry Etch Principal Process Development Engineer
Boise, Idaho, United States
OnsiteFull Time
7+ YOEBachelor's in engineering/physics/materials, 7+ years dry etch process development experience, strong plasma etch and reactor knowledge, experimental design and data analysis skills, and cross-team communication ability.
SPC
1mo
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
2mo
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Principal Wet Process Engineer, Advanced Packaging
Boise, Idaho, United States
OnsiteFull Time
12+ YOEMS in relevant field required, 12+ years process development experience in advanced packaging for memory products, strong data analysis with Python/statistics, DOE, SPC/FDC, FMEA/8D, wet chemistry and cleanroom experience preferred.
Python, SPC, FDC, RMS, APC, AI
3mo
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Sr. Principal Data Center Solutions Architect
San Jose or Longmont or Boise
$148k-$308k/yr OnsiteFull Time
12+ YOEBachelor's in EE/CE/Physics/CS (or equivalent), 12+ years in optical interconnect, high-speed networking, silicon photonics, or datacenter architecture; system-level interconnect expertise; customer engagement and cross-functional leadership experience.
2mo
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Principal Program Manager (Hyperscaler Cloud Data Center - full lifecycle program ownership)
Boise or Irvine or Santa Clara
$160k-$237k/yr HybridFull Time
5+ YOEBachelor's in CS/EE with 10+ yrs; or Master's with 7+ yrs; 5+ yrs PM in semiconductor; strong leadership, communication, risk mgmt, and cross-functional skills.
6d
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Senior/Staff/Principal/MTS Engineer, Etch - Procurement and Operations Central Team Advanced Development
Boise, Idaho, United States
OnsiteFull Time
5+ YOEBachelor's in engineering,5+ years semiconductor process experience (etch/films/planarization),troubleshooting,experimental design,data analysis,SPC,metrology,device physics,ability to travel internationally,interest in applying AI/LLM to processes.
LLM, AI Agents, Agentic AI workflows, Statistical Process Control (SPC)
1mo
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Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Boise, Idaho, United States
OnsiteFull Time
2+ YOEBachelor's degree in engineering or related field, 2+ years in product integration/test/yield/design/BEOL, strong device physics and data analysis skills, ability to travel 20–50% and work cross‑functionally.
1mo
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Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Boise, Idaho, United States
OnsiteFull Time
2+ YOERequires a bachelor's degree in engineering/science, 2+ years in product integration/test/yield or related semiconductor roles, strong data analysis and problem-solving, communication skills, and ability to work cross-functionally with 20–50% travel.
1mo
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Senior/Principal Eng, FE OCT CPEE Photo EUV Track, Material & Cost Excellence
Boise, Idaho, United States
OnsiteFull Time
8+ YOEBachelor's in Engineering/Materials/Physics (or equivalent), 8+ years in semiconductor manufacturing with photolithography/track systems, equipment installation/qualification experience, DOE and data-analysis skills, and project leadership experience.
2w
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Staff / Principal Full Stack AI Engineer
Boise, Idaho, United States
OnsiteFull Time
5+ YOEBachelor's degree or equivalent,5+ years building and deploying production AI/web applications; strong Python and JavaScript/TypeScript skills; cloud (AWS/Azure/GCP), Docker, Kubernetes, CI/CD, SQL experience; data pipeline and ML deployment expertise.
React, Angular, Streamlit, Python, FastAPI, JavaScript, TypeScript, Docker, Kubernetes, CI/CD, AWS, Azure, GCP, SQL, NVIDIA Omniverse, Gazebo, Unity Robotics Hub, Unreal Engine, Siemens Tecnomatix
3w
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Principal Technical Product Manager – CDBU DRAM
Meridian or San Jose
$141k-$319k/yr OnsiteFull Time
3+ YOEBachelor's in engineering, 3+ years product management in semiconductors, experience defining technical product requirements, data-driven analytical skills, customer-facing communication, familiarity with AI tools.
JAMA, JIRA
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