HiringCafe
United StatesRemote · Hybrid · Onsite · Field · All Environments
United StatesRemote · Hybrid · Onsite · Field · All Environments
United StatesRemote · Hybrid · Onsite · Field · All Environments
United StatesRemote · Hybrid · Onsite · Field · All Environments
10 principal process engineer packaging jobs at 9 companies in United States
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Principal Packaging Engineer
Florence or Cincinnati
$107k-$178k/yr OnsiteFull Time
10+ YOEBachelor's degree in Chemical, Mechanical, Packaging, or Electrical Engineering; 10+ years engineering experience; 5+ years with food-industry packaging equipment OEMs; automated packaging systems expertise and 30–50% travel.
FMEA, FAT, SAT, ROI, LEAN, PFD
1mo
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Senior / Principal Silicon Photonic Packaging & Process Engineer
New York, New York, United States
$150k-$250k/yr OnsiteFull Time
10+ YOEBS/MS in engineering or equivalent,10+ years in semiconductor/photonic packaging or precision opto-mechanical assembly, SolidWorks and Minitab experience, DOE/SPC proficiency, travel up to 25%.
SolidWorks, Minitab
1w
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Principal Wet Process Engineer, Advanced Packaging
Boise, Idaho, United States
OnsiteFull Time
8+ YOEMS in materials science, chemical engineering, chemistry, physics, or related field; 8+ years of semiconductor process development experience. PhD, wet chemistry, cleanroom, Python, statistics, DOE, and advanced packaging experience preferred.
FMEA, 8D, SPC, FDC, RMS, APC, Python, Design of Experiments (DOE)
1w
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Principal Wet Process Engineer, Advanced Packaging
Boise, Idaho, United States
OnsiteFull Time
8+ YOERequires an MS in a related science or engineering field and 8+ years of semiconductor process development experience. Preferred: PhD, wet chemistry cleanroom experience, Python, statistics, AI, automation, and DOE.
Statistical Process Control (SPC), Fault Detection and Classification (FDC), Run-to-Run Monitoring (RMS), Advanced Process Control (APC), Python, Design of Experiments (DOE)
2w
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Principal Process Development Engineer
Morgan Hill, California, United States
$100k-$180k/yr OnsiteFull Time
8+ YOEBachelor's degree required; master's preferred, with 8+ years in semiconductor package and assembly process development. Requires die bond equipment, backend assembly, FMEA, SPC, DOE, reliability testing, and project management experience.
Datacon EVO, FMEA, DFMEA, PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology, DoE, ISO9001, ISO14001
2mo
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SR Principal Engineer, Packaging (Barceloneta, U.S. Other Territories, Other U.S. Territories)
Barceloneta, Puerto Rico, United States
OnsiteFull Time
5+ YOEBachelor's in Engineering with 5+ years pharma experience (Master's in Packaging/Polymers with 3+ years preferred). Expertise in packaging materials/processes, GMP and product lifecycle, bench and production scale experience, project leadership, English fluency, and willingness to travel.
2mo
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Sr. Principal Photonic Process Integration Engineer
Fremont, California, United States
$128k-$224k/yr HybridFull Time
10+ YOEPhD in EE/Physics/Materials and 10+ years foundry/photonic process experience; expertise in process integration, yield analysis, SPC/JMP, failure analysis, CAPA, advanced packaging, and Python for data analysis.
JMP, Python
4w
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Principal Optical Assembly Engineer
San Jose, California, United States
$133k-$185k/yr OnsiteFull Time
8+ YOEB.S./M.S./Ph.D. in engineering or related field,8+ years in optical assembly or photonics packaging,hands-on process development,alignment and fiber attach experience,SPC/Cpk yield analysis,process documentation and equipment qualification.
SPC, Cpk, active alignment systems, dispensing tools, curing tools
1w
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Principal Engineer, Architect for Integration, Engineering, and Security
Chicago, Illinois, United States
$161k-$218k/yr OnsiteFull Time
10+ YOEBachelor's degree and 10–12 years of relevant experience in integration or solution architecture, data design, software selection, security, and retail or consumer packaged goods processes.
1w
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Principal CPU Architect - High-Performance and Physical Design
Santa Clara or Austin or Hillsboro
$272k-$431k/yr OnsiteFull Time
15+ YOERequires a BS/MS in engineering or computer science, 15+ years of relevant experience, extensive CPU architecture and high-frequency server CPU design expertise, and knowledge of power, process, circuit, and packaging technologies.
RTL, VLSI, SW, GPU, SoC