4 semiconductor engineer jobs at 2 companies in Madeira, OH

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Semiconductor Device Engineer
Beavercreek Township, Ohio, United States
OnsiteFull Time
KBR
KBRNYSE: KBR: Provides engineering, technology, and professional services for global markets.
0+ YOEBachelor's in EE/Materials/Physics/Nanoengineering,0–2 years cleanroom experience,TCAD simulation exposure,DC/RF electrical testing and metrology experience,ability to obtain Public Trust clearance.
TCAD, Synopsys Sentaurus, Silvaco, COMSOL, Python, MATLAB, SEM, AFM, optical microscopes, probe stations, parameter analyzers, network analyzers, source measure units, lock-in amplifiers
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Semiconductor Device Engineer
Beavercreek, Ohio, United States
OnsiteFull Time
KBR
KBRNYSE: KBR: Provides engineering, technology, and professional services for global markets.
4+ YOEPhD in EE/Materials/Physics or MS+3yrs microelectronics experience; 4+ years cleanroom experience; hands-on microfabrication, DC/RF testing, microscopy, TCAD simulation; strong communication and publication record.
TCAD, Sentaurus, Silvaco, COMSOL, SEM, AFM, probe station, parameter analyzer, network analyzer, source measure unit, lock-in amplifier, optical microscope
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Semiconductor Engineering Technician (42894)
Mason, Ohio, United States
$65k-$121k/yr OnsiteFull Time
L3Harris Technologies
L3Harris TechnologiesNYSE: LHX: Aerospace and defense providing mission-critical technology solutions.
8+ YOEHigh school diploma and 8 years of relevant experience, or associate degree and 4 years of related experience. Requires semiconductor, cleanroom, equipment, chemical, teamwork, and communication experience.
Microsoft Excel, Microsoft Access, Microsoft Office
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Senior Associate Electrical Engineering (40984)
Mason, Ohio, United States
OnsiteFull Time
L3Harris Technologies
L3Harris TechnologiesNYSE: LHX: Aerospace and defense providing mission-critical technology solutions.
2+ YOEBachelor's in science/engineering or equivalent experience, ~2 years related experience, cleanroom experience, familiarity with semiconductor processing (photolithography, etch, deposition, bonding, grinding, dicing), strong technical writing and presentation, Microsoft Office proficiency.
Microsoft PowerPoint, Microsoft Word, Microsoft Excel