Freeform: Deploys autonomous AI-powered metal 3D printing factories.
5+ YOEBachelor's in mechanical engineering, 5+ years in semiconductor equipment or fabrication, strong part-design and design-for-manufacturing skills, materials/tolerances knowledge, and ability to collaborate with customers and cross-functional teams.
OSI SystemsNASDAQ: OSIS: Manufacturer of specialized electronic systems for security and healthcare.
1+ YOEBachelor's in electrical/electronics engineering required (Master's preferred); 1+ years semiconductor production test experience to military/space specs; knowledge of semiconductor physics, ATE/TESEC, test equipment, MIL-STD methods, and strong troubleshooting and communication skills.
Lorlin, TESEC, Spectrum analyzer, Oscilloscope, Pulse generator, ATE, TESEC ATE systems, curve tracers, waveform generators, power supplies
SemtechNASDAQ: SMTC: Produces high-performance analog and mixed-signal semiconductor products
3+ YOEBachelors in engineering or related, 3+ years semiconductor deposition/etch experience, hands-on PECVD and ICP-RIE/RIE experience, data analysis and SPC skills, failure analysis and root-cause problem solving.
PECVD, ICP-RIE, RIE, SEM, FIB, SIMS, SPC, DOE, 8D, Six Sigma
AECOMNYSE: ACM: Provides infrastructure consulting and engineering services for global projects.
10+ YOE2+ MgmtBachelor's in architecture or engineering plus 10 years relevant experience (or equivalent) including 2 years leadership; PE or architecture license preferred; 5 years semiconductor design preferred; strong communication, leadership, and proposal skills.
Electronics Parts, Materials, and Processes Engineer - Advanced Packaging
El Segundo or Chantilly
$117k-$176k/yrOnsiteFull Time
The Aerospace Corporation: Provides technical expertise and research for national space programs.
8+ YOEBachelor’s in materials science, electrical engineering, or related; 8+ years engineering experience; proficiency in advanced semiconductor packaging; PMP standards; ability to obtain TS/SSBI clearance.
MS Project, Jira, advanced semiconductor packaging, PMP standards
Microelectronics Fabrication & Process Integration Engineer, MOSIS 2.0
Marina Del Rey, California, United States
HybridFull Time
University of Southern California: Private research university providing higher education and healthcare services.
5+ YOEBachelor’s in Electrical Engineering, Materials Science, Physics, or related field; 5+ years semiconductor fabrication experience; US person; strong communication; fabrication knowledge; hybrid work.
lithography, deposition, etch, metrology, data analysis, AI/ML
Infineon TechnologiesFrankfurt Stock Exchange: IFX: Designs and manufactures semiconductors for power and IoT systems.
10+ YOEPhD in Electrical Engineering (Power Electronics), 10+ years in the semiconductor industry with high-volume power product launches; expertise in DC/DC topologies, IBCs, hot-swap controllers, GaN/SiC, HVDC/VPD, schematic/PCB design, system bring-up, and customer-facing technical engagement.
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
3+ YOE3-5 years mechanical design in precision hardware or 2-3 years with MS/ PhD; CAD tools; DFM; tolerance analysis; semiconductor test infrastructure
TeradyneNASDAQ: TER: Designs and manufactures automated test equipment and advanced robotics systems.
8+ YOE8+ years in capital equipment sales/marketing (semiconductor/test/datacenter), ATE or production test experience, proven long-cycle design-in ability, bachelor\u0002s preferred in EE/physics, strong communication and analytical skills, willing to travel 25%+.
Electrical Designer (Revit) - Portland, Oregon, United States
Portland or Tempe or Irvine or Los Angeles or Oakland or Redding or Sacramento or San Diego or San Francisco or San Jose or Denver or Albuquerque or Henderson or Austin or Dallas or Fort Worth or Houston or San Antonio or Holladay
$71k-$98k/yrHybridFull Time
JacobsNYSE: J: Global provider of professional engineering and technical services.
3+ YOEHigh school diploma; 3+ years electrical design experience; 2+ years Revit design; AutoCAD proficiency; additional 2-year Associate’s degree and NEC exposure preferred; semiconductor experience preferred.