21 semiconductor process engineer jobs at 2 companies in Barre, VT
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MTS Etch Process Engineer
Essex Junction, Vermont, United States
$98k-$176k/yrOnsiteFull Time
GlobalFoundriesNASDAQ: GFS: Manufacturer of semiconductors and provider of wafer fabrication services.
5+ YOEBachelor's/Master's/PhD in engineering or physical science, minimum 5 years etch process development experience, hands-on etch tooling knowledge, semiconductor fab experience preferred, strong communication and project skills.
Fujifilm Dimatix: Designs and manufactures industrial drop-on-demand inkjet printheads.
8+ YOEBachelor's in Engineering/Material Science/Chemistry/Physics with typically 8+ years' MEMS/semiconductor process experience (alternatives with M.S./PhD plus less experience). Experience with wafer fab processes, SPC/DoE, JMP/Minitab, root-cause analysis, and yield improvement.
FujifilmTokyo Stock Exchange: 4901: Providing medical imaging, healthcare solutions, and photographic technology products.
5+ YOEBachelor's in engineering/materials/chemistry/physics with ~5+ years MEMS/semiconductor wafer fab experience; strong root-cause analysis, SPC/DoE, problem solving, metrology, and presentation skills.
Statistical Process Control (SPC), Design of Experiments (DoE), PECVD, CMP, AOI, FDC, Photolithography, Wet Etch, Thin Films, Sputtering, Laser Dice, Automation Systems, wafer metrology tools
FujifilmTokyo Stock Exchange: 4901: Diversified manufacturer of healthcare, imaging, and semiconductor material products.
5+ YOEBachelor's in Engineering/Materials/Chemistry/Physics plus ~5 years MEMS/semiconductor wafer fab experience (or advanced degree with reduced experience). Requires SPC/DoE familiarity, wafer metrology, problem solving, and cleanroom experience.
Photolithography, Wet Etch, Thin Films, Sputtering, PECVD, Laser Dice, Ash and Wet Strip, Bond, CMP, Dry Film, AOI, Automation Systems, FDC, wafer metrology tools, Statistical Process Control (SPC), Design of Experiments (DoE)
GlobalFoundriesNASDAQ: GFS: Semiconductor foundry providing chip design and fabrication services.
3+ YOEMaster's in EE/CS, 3+ years post-baccalaureate experience in semiconductor test data analysis, tester/prober/handler platforms, test process development, and cross-functional communication.