2mo
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Dry Etch Process Develop Engineer
New York, New York, United States
$107k-$182k/yr RemoteFull Time
3+ YOEDevelop and optimize dry etch plasma processes; analyze data; collaborate across teams; MS/PhD in engineering; experience in semiconductor processing.
ICP/RIE, plasma etch, DOE, SPC
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Films Process Development Engineer
New York, New York, United States
$107k-$182k/yr OnsiteFull Time
3+ YOEMS or PhD (or equivalent) with 3+ years semiconductor experience; strong process science foundation, DOE experience, ability to work cross-functionally, and strong analytical/problem-solving skills.
DOE, XPS, AFM, XRD, SIMS, ALD, CVD, PECVD, SPC, Artificial Intelligence
2mo
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Films Process Development Engineer
New York, New York, United States
$107k-$182k/yr RemoteFull Time
4+ YOEPhD or MS with 4+ years semiconductor materials/process development experience; strong materials science, chemical reaction engineering, thin film physics; hands-on patterning films and ALD/CVD family; SPC knowledge; analytical and communication skills.
ALD, CVD, PECVD, PE-ALD, LPCVD, SPC, XPS, AFM, XRD, SIMS, EUV, VME
2mo
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Dry Etch Process Develop Engineer
Albany or New York City or Boise or Hiroshima
$107k-$182k/yr OnsiteFull Time
3+ YOEMS/PhD in engineering/science (or BS + 3+ years); semiconductor process development experience with plasma/dry etch, DOE and statistical analysis, chamber hardware knowledge, and cross-functional collaboration.
2mo
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EUV Lithography Process Development Engineer- TPG
Boise or New York City
OnsiteFull Time
3+ YOEExperience with EUV and photolithography, M.S./Ph.D. + 3+ years semiconductor experience or B.S. + 10+ years; knowledge of 193nm immersion, LELE, SAQP; statistical analysis and communication skills; travel up to monthly.
Prolith, S-Litho, JMP, Python