Bachelor's degree in a STEM field required, cleanroom experience preferred (1-2 years), ability to work extended hours in a cleanroom, lift 20 lb, strong analytical and communication skills.
BAE SystemsLondon Stock Exchange: BA: Designs and manufactures advanced defense and aerospace systems.
3+ YOEHigh school diploma and ~3 years' experience or equivalent. Perform wafer fab processing steps, ensure and qualify equipment, run calibrations/tests, track production in PROMIS, follow clean-room and ESH practices; preferred etch, deposition and photolithography experience.
GPD Optoelectronics: Manufactures high-performance infrared photodetectors and custom optoelectronic sensors.
The posting describes wafer fabrication, but the title is Die Attach Assembly; requirements include semiconductor process expertise, engineering or physics degree, ITAR eligibility, cleanroom and chemical safety compliance, and ability to lift 75 pounds.
Photolithography, RIE, PECVD, MIL-STD, Lean, Six Sigma