13 semiconductor process engineer jobs at 3 companies in New Mexico
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Process Engineer
Albuquerque, New Mexico, United States
OnsiteFull Time
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
1+ YOEBachelor's in engineering, 1-3 years semiconductor manufacturing experience, familiarity with thin films/lithography/wet & dry etch, ability to work with ITAR/EAR controlled information (US citizen or permanent resident), strong problem-solving and SPC knowledge.
StantecTSX: STN: Provides professional engineering, architecture, and environmental consulting services.
10+ YOEPE preferred; proficient with Revit, AutoCAD, NavisWorks, Pipe-Flo, Caesar/Autopipe; strong client communication; BS in Chemical or Mechanical Engineering; 10 years in process/UPW in semiconductor or tech sectors.
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
8+ YOERequires engineering degree; 8–12 years in electroless copper plating, metallization, or semiconductor wet processing; experience with SPC, DOE, FMEA and process qualification; EHS and chemical safety knowledge; willing to relocate to Albuquerque or India.
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
8+ YOEEngineering degree required; 8–12 years in electroless copper plating, metallization, or semiconductor wet processing; experience with SPC/DOE/FMEA and SEM/XRF/profilometry; willing to relocate to Albuquerque or India.
SPC, DOE, FMEA, SEM, XRF, profilometry, optical inspection systems, SAT
Advanced Packaging Technology Development Process Integration Engineer
Albuquerque, New Mexico, United States
$134k-$189k/yrOnsiteFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBachelor's (or higher) in Engineering, Material Science, or Physics with process integration, yield, quality, or process development experience in high-volume semiconductor manufacturing; strong cross-functional collaboration and problem-solving skills.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEBachelors in engineering or science required, 2+ years semiconductor or silicon photonics experience, advanced data analysis using JMP/GAJT/SQL, SPC and DOE experience; optics/SiP experience preferred.
JMP, GAJT, SQL, Statistical Process Control (SPC), Design of Experiment (DOE)
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
PhD in a STEM field, expertise in statistical analysis, machine learning, failure and yield analysis, and experience with high-volume semiconductor manufacturing; on-site presence required at least 4 days/week.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
4+ YOEBachelor's in STEM,4+ years' relevant experience,expertise in semiconductor singulation processing,process control,DOE,and manufacturing process improvement.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
4+ YOEBachelor's in STEM and 3–4+ years' experience in equipment monitoring, process characterization, manufacturing improvement, and semiconductor equipment; EM/optical characterization and metrology experience preferred.
Director - Process Integration & Technology Transfer
Albuquerque, New Mexico, United States
HybridFull Time
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
12+ YOE12+ MgmtSenior-level leadership with 12+ years in semiconductor packaging, substrate manufacturing, or related high-tech manufacturing; Bachelor's in engineering or related field.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEBachelor's in a STEM field, 2+ years manufacturing/process control experience (1+ with master’s), DOE and process improvement experience, semiconductor process and metrology knowledge, strong analytical and project leadership skills.
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
8+ YOEEngineering degree required; 8–12 years in semiconductor wet etching/TGV/copper etching; leadership experience; knowledge of SPC, DOE, FMEA, process characterization, yield analysis; willing to relocate to Albuquerque or India.
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
5+ YOEBachelor's in engineering,5+ years in semiconductor manufacturing with etch and thin film experience,people management experience,process improvement and statistical problem-solving skills.