PromotedHiringCafe
Founding Full-stack / Product Engineer
Cupertino, CA, US
$130k-$300k/yr On-SiteFull Time
Help us build a 100× better job search engine. We need a full-stack engineer with great taste, sharp fundamentals, and a track record of shipping polished product on React/Next.js plus a real backend (Firebase, Elasticsearch, Redis, Stripe).
React, Next.js, TypeScript, Firebase, Elasticsearch, Redis, Stripe
1mo
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AI Full Stack Engineer
Boise, Idaho, United States
OnsiteFull Time
Experienced full‑stack engineer with production backend/full‑stack experience, cloud‑native and CI/CD familiarity, C#, ASP.NET, Angular, SQL/NoSQL, Kubernetes, MCP and custom AI agent experience, and RAG/LLM integration skills.
C#, ASP.NET, Angular, RESTful APIs, SQL, NoSQL, Kubernetes, CI/CD, Model Context Protocol (MCP), LLMs, embeddings, retrieval-augmented generation (RAG)
1mo
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AI Full Stack Engineer
Boise, Idaho, United States
OnsiteFull Time
Experienced full‑stack engineer with production backend/full‑stack experience, cloud‑native CI/CD and container deployments, strong system design, C#, ASP.NET, Angular, RESTful APIs, SQL/NoSQL, Kubernetes, and AI agent/MCP/RAG integration skills.
C#, ASP.NET, Angular, RESTful APIs, APIs, SQL, NoSQL, Kubernetes, CI/CD, Model Context Protocol (MCP), LLMs, retrieval-augmented generation (RAG)
1mo
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AI Full Stack Engineer
Boise, Idaho, United States
OnsiteFull Time
Experienced full‑stack engineer with production backend/full‑stack experience, cloud‑native/CI/CD and container skills, data modeling, and experience with C#, ASP.NET, Angular, SQL/NoSQL, Kubernetes; AI skills (custom agents, MCP, prompt engineering, RAG) preferred.
C#, ASP.NET, Angular, RESTful APIs, SQL, NoSQL, Kubernetes, CI/CD, LLMs, Model Context Protocol (MCP), Retrieval-Augmented Generation (RAG)
1mo
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AI Full Stack Engineer
Boise, Idaho, United States
OnsiteFull Time
Experienced full-stack engineer with production-grade backend/API design, cloud-native and CI/CD experience, C#/ASP.NET/Angular, SQL/NoSQL, Kubernetes; experience with custom AI agents, Model Context Protocol, RAG and prompt engineering.
C#, ASP.NET, Angular, RESTful APIs, SQL, NoSQL, Kubernetes, CI/CD, Model Context Protocol (MCP), LLMs, embeddings, retrieval-augmented generation (RAG)
1w
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Sr. Full-Stack AI Software Development Engineer
Boise, Idaho, United States
OnsiteFull Time
Experienced in full‑stack development, scalable API and backend design, cloud‑native and microservices architecture, and integrating AI/LLM capabilities such as agentic workflows and RAG. Strong problem solving and engineering skills.
REST, LLMs, RAG
1w
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Full Stack Developer (Angular/NodeJS) - II
Boise or United States
$85k-$117k/yr RemoteFull Time
8+ YOE8+ years back-end focused experience with Java and/or NodeJS, Angular front-end experience, AWS cloud skills, RESTful API design, EMR/healthcare data familiarity, Public Trust clearance eligibility.
Angular, NodeJS, Java, JavaScript, TypeScript, AWS, Azure, API Gateway, Lambda, S3, CloudWatch, Git, GitHub, JUnit, Jest, JIRA, Docker, ECS, EKS, C#, .Net, Electronic Data Interchange X.12 (EDI), Microsoft Teams
1w
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Sr. Full-Stack AI Software Development Engineer
Boise, Idaho, United States
OnsiteFull Time
Experience designing and delivering full-stack, cloud-native applications with AI/ML integration, microservices and REST APIs; strong software engineering, observability, and problem-solving skills.
MCP, REST API, large language models (LLMs), RAG
3mo
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Principal Engineer Advanced Package Technology Development
Boise, Idaho, United States
OnsiteFull Time
5+ YOE5+ years in semiconductor advanced packaging; advanced degree in materials science, electrical, chemical, mechanical eng or physics; knowledge of HBM, 2.5D and 3D integration, hybrid bonding; wafer level packaging or 3D stacking; DRAM/OSAT experience.
High Bandwidth Memory, 2.5D integration, 3D integration, Hybrid bonding, Wafer Level Packaging, OSAT, DRAM, Semiconductor manufacturing
3mo
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Principal Engineer Advanced Package Technology Development
Boise or Singapore
OnsiteFull Time
6+ YOE5+ years in advanced semiconductor packaging, BS/MS/PhD or equivalent experience in relevant engineering or physics fields, deep knowledge of HBM/2.5D/3D integration and hybrid bonding, hands-on wafer-level packaging or 3D stacking experience, DRAM/OSAT experience, English proficiency.
2mo
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Principal Engineer Advanced Package Technology Development
Boise, Idaho, United States
OnsiteFull Time
6+ YOEOver 5 years experience in semiconductor advanced packaging; BS/MS/PhD in materials, electrical, chemical, mechanical engineering or physics (or equivalent); deep knowledge of HBM, 2.5D/3D integration and hybrid bonding; hands-on WLP/3D stacking and DRAM/OSAT experience.
3mo
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Principal Engineer Advanced Package Technology Development
Singapore or Boise
OnsiteFull Time
5+ YOE5+ years in semiconductor advanced packaging; BS/MS/PhD in engineering/physics; knowledge of HBM, 2.5D, 3D integration; WLP or 3D stacking process experience; DRAM/OSAT background; English proficiency; patent or publications encouraged.
Wafer Level Packaging, 3D stacking, Hybrid bonding, High Bandwidth Memory, DRAM manufacturing, OSAT
2mo
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SMTS Product Architect
Boise or Folsom or San Jose
$177k-$387k/yr OnsiteFull Time
12+ YOEBachelor's in Electrical Engineering, 12+ years engineering experience, familiarity with LPDDR/DRAM/module architectures, memory hierarchy and SoC/ASIC design, experience with TSV/stacked/3D packaging; mentoring experience preferred.