17 staff data engineer jobs at 2 companies in Payette, ID

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STAFF ENGINEER, PHOTO DRAM
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
5+ YOEBS in Electrical Engineering or related with 5+ years lithography; MS/PhD with 3+ years; strong data-driven problem solving; communication and PM skills.
Python, Excel, JMP, ML, Statistical Workflows
1mo
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Staff Engineer (DTPG DOS STRAT Alignment)
Boise, Idaho, United States
HybridFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
2+ YOEMaster's in EE/Product/Computer Engineering + 2 years experience OR equivalent; proficiency in Python, Linux/Unix, VLSI design & EDA tools, data analysis, and Design for Test (DFT); drive cross-DRAM alignment and BKM propagation.
Python, Linux, Unix, VLSI Design, EDA Tools, Design for Test (DFT)
2mo
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Staff Engineer, APTD Dry Etch
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
3+ YOERequires a relevant degree plus 3+ years (MS/PhD) or 5+ years (BS) dry etch experience, hands-on R&D, DOE and data analysis skills, ability to manage multiple priorities and collaborate cross-functionally.
Python, GenAI
2mo
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Staff Machine Learning Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
3+ YOEMaster's degree with 3+ years experience building end-to-end ML systems on cloud platforms; strong ML frameworks; proficient in Python/Java; CI/CD and data pipelines.
TensorFlow, PyTorch, scikit-learn, Python, Java, Kafka, Pub/Sub, Kubeflow, Airflow, Dataflow, GCP, AWS, Azure, Docker, Kubernetes, Git, Jenkins
3mo
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STAFF ENGINEER, PHOTO DRAM
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
3+ YOEBS in relevant field with 5+ years (or MS/PhD with 3+ years) in semiconductor lithography process engineering; strong data-driven problem solving, communication, and project management skills.
Python, JMP, Microsoft Excel
1mo
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Staff Engineer (DTPG DOS STRAT Alignment)
Boise, Idaho, United States
HybridFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
2+ YOEMaster's in EE/Product/Computer Engineering (accepted) with 2 years' related experience; proficiency in Python, Linux/Unix, VLSI/EDA tools, data analysis, and Design for Test (DFT).
Python, Linux, Unix, VLSI Design & EDA Tools
3mo
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Staff Engineer, APTD Backgrind/Edge Trim
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
4+ YOEBS/MS in engineering or science with ≥4 years in wafer edge trim/backgrind/thinning/CMP or mechanical wafer processing; DOE, data analysis, root-cause skills; strong problem solving and project management; Microsoft Office proficiency.
Microsoft Office, DOE, SPC, Python
1mo
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Staff Engineer, Adv DRAM PI
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
3+ YOEMS in Physics/Materials Science/Electrical Engineering (or related),3+ years semiconductor experience,process integration and device physics knowledge,experimental design,data analysis,statistical methods,and ability to lead cross‑functional projects.
1mo
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Tainan or Bundang or Santa Clara or Heimstetten or Boise or Rehovot
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive experience in semiconductor process integration and advanced packaging, project management, technical leadership, data analysis, and communication skills.
1mo
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Staff Engineer, Adv DRAM PI
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
3+ YOEMS in relevant field, 3+ years semiconductor experience, strong process integration and device physics knowledge, experimental design and data analysis skills, and ability to lead cross-functional projects.
2w
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STAFF ENGINEER, DRY ETCH DRAM
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
3+ YOEMS/PhD with 3–5 years or BS with 5–10 years semiconductor experience; expertise in dry etch process development, plasma physics, reactor fundamentals, SPC and data-driven problem solving.
ICP, CCP, SPC, FMEA, 8D, AI
1mo
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Principal/ Staff Engineer, Advanced Packaging Process Integration
Singapore or Taiwan or Boise or Korea or Santa Clara or Israel or Kirchheim bei München
OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Bachelor's in engineering/materials/physics required (advanced degree preferred). Extensive semiconductor process integration and advanced packaging experience, project management and technical leadership, data analysis and problem solving, knowledge of industry standards.
1w
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Senior/Staff/Principal/MTS Engineer, Etch - Procurement and Operations Central Team Advanced Development
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
5+ YOEBachelor's in engineering,5+ years semiconductor process experience (etch/films/planarization),troubleshooting,experimental design,data analysis,SPC,metrology,device physics,ability to travel internationally,interest in applying AI/LLM to processes.
LLM, AI Agents, Agentic AI workflows, Statistical Process Control (SPC)
1mo
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Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
2+ YOEBachelor's degree in engineering or related field, 2+ years in product integration/test/yield/design/BEOL, strong device physics and data analysis skills, ability to travel 20–50% and work cross‑functionally.
1mo
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Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
2+ YOERequires a bachelor's degree in engineering/science, 2+ years in product integration/test/yield or related semiconductor roles, strong data analysis and problem-solving, communication skills, and ability to work cross-functionally with 20–50% travel.
2mo
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Staff Machine Learning Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Manufacturer of semiconductor memory and data storage products.
3+ YOEMaster's in CS/ML/Data Science/Statistics plus 3+ years building end-to-end ML systems on cloud platforms; experience with TensorFlow/PyTorch/scikit-learn, Python or Java, Kafka/Pub-Sub, ETL/ELT pipelines, cloud/DevOps tools, and strong communication skills.
Snowflake, GCP, Azure, TensorFlow, PyTorch, scikit-learn, Python, Java, Kafka, Pub/Sub, Kubeflow, Airflow, Dataflow, SQL, GCP, AWS, Azure, Docker, Kubernetes, LangChain, LangGraph, CrewAI, DsPy, Semantic Kernel, ADK, RAG, GraphRAG, NLP, BigQuery, MSSQL, PostgreSQL, Git, Jenkins
3w
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Staff / Principal Full Stack AI Engineer
Boise, Idaho, United States
OnsiteFull Time
Micron Technology
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
5+ YOEBachelor's degree or equivalent,5+ years building and deploying production AI/web applications; strong Python and JavaScript/TypeScript skills; cloud (AWS/Azure/GCP), Docker, Kubernetes, CI/CD, SQL experience; data pipeline and ML deployment expertise.
React, Angular, Streamlit, Python, FastAPI, JavaScript, TypeScript, Docker, Kubernetes, CI/CD, AWS, Azure, GCP, SQL, NVIDIA Omniverse, Gazebo, Unity Robotics Hub, Unreal Engine, Siemens Tecnomatix