23 teamcenter developer jobs at 10 companies in Salinas, CA
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Senior Application Engineer, PLM
San Jose, California, United States
$127k-$158k/yrRemoteFull Time
ArcherNYSE: ACHR: Develops electric vertical takeoff and landing aircraft for urban mobility.
10+ YOE10+ years Teamcenter PLM architecture and customization experience, hands-on BMIDE/ITK/configuration, API and integration experience, bachelor’s in engineering/CS, strong analytical and communication skills.
Siemens Teamcenter, Bitbucket, Git, Jira, TeamCity, BMIDE, ITK, Workflow Manager, SOAP, REST, Active Workspace, Java, C#, Python, NX, Amazon Web Service
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
4+ YOERequires a bachelor's degree in engineering and 4+ years of manufacturing or engineering experience, with expertise in CAD, Teamcenter, SAP BOMs, engineering change orders, and manufacturability analysis.
Unigraphics/NX, Teamcenter, SAP, Lotus Notes, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, FRACAS, BRIO
MarvellNASDAQ: MRVL: Designs and develops high-performance semiconductor and infrastructure solutions.
5+ YOEBachelor's in CS/EE or related with 10+ years, or Master's/PhD with 5+ years; 5+ years PLM experience (implementation/config/admin); experience with enterprise PLM (Agile, Teamcenter, Windchill), PLM data models, BOMs, change control, integrations, and training.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
2+ YOEBachelor's degree plus 2 years or a master's degree plus no experience in electrical engineering or equivalent; 2+ years in product development and PCB assembly processes.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
4+ YOEBachelor's degree and 4–7 years of related experience required. Preferred proficiency with Zuken E3s, AutoCAD, Teamcenter Engineering PLM, and UG NX, plus project leadership skills.
Zuken E3s, AutoCAD, Teamcenter Engineering PLM, UG NX
Eugenus: Manufacturer of advanced deposition systems for semiconductor device fabrication.
10+ YOEBachelor’s degree in mechanical engineering with 10 years of semiconductor tool design experience in deposition systems; CAD/CAE tools; knowledge of ASME Y14.5, SEMI; design of mechanical systems for semiconductor equipment; teamwork.
Honeywell InternationalNASDAQ: HON: Designs and manufactures technologies for aerospace, buildings, and industry.
2+ YOERequires 2+ years in supplier quality, manufacturing, or quality engineering; manufacturing-process knowledge; quality tools; ISO 9001 or AS9100 familiarity; analytical, communication, and supplier-management skills.
Statistical Process Control (SPC), SAP ERP, Siemens Teamcenter PLM, Geometric Dimensioning and Tolerancing (GD&T)
Foxconn AssemblyTaiwan Stock Exchange: 2317: Assembles electronics and computer hardware for global technology brands.
2+ YOEBachelor's in engineering,2+ years product/manufacturing/NPI experience,knowledge of PLM/ERP/MES,BOM/ECO processes,Excel proficiency,strong analytical and communication skills.
PLM, Agile, Windchill, Teamcenter, ERP, SAP, Oracle, MES, Microsoft Excel, Power BI, Tableau, SQL, Python
E-Space: Builds sustainable LEO satellite networks for global IoT connectivity
2+ YOEBS/MS/PhD in Aerospace/Mechanical/Systems Engineering,2+ years hands-on experience with deployable structures or large space mechanisms,ability to manage ICDs and cross-team hardware integration.
OkloNYSE: OKLO: Developing advanced fast fission nuclear power plants.
3+ YOERequires 3–10 years of mechanical or structural design experience, a mechanical engineering bachelor's degree or higher, 3D CAD and PDM/PLM proficiency, DFM/DFA, GD&T, materials, and manufacturing knowledge.