1mo
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Scientist – TEM Automation & Data Workflows
Phoenix, Arizona, United States
$115k-$130k/yr OnsiteFull Time
MS or PhD in materials science/physics/engineering, hands-on S/TEM operation and TEM automation experience, strong Python skills, experience building data/automation workflows and applying data science/computer vision. U.S. Person required (ITAR).
Python, DigitalMicrograph, ImageJ, PyTorch, TensorFlow
3mo
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Failure Analysis Technician F21 (Phoenix, AZ, US, 85083)
Phoenix, Arizona, United States
OnsiteFull Time
Associate or Bachelor in science/engineering; TEM sample prep and semiconductor analysis experience preferred; safety PPE; on-call nights/weekends; basic PC skills.
FIB, SEM, TEM, C-AFM, nano-probe, EDS
2w
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Materials Analyst, Microscopy (Dual Beam FIB)
Phoenix, Arizona, United States
$73k-$85k/yr OnsiteFull Time
BS/MS in materials science or equivalent experience, hands-on Dual Beam FIB-SEM TEM lamella preparation, SEM imaging, sample management, strong problem-solving; U.S. Person (ITAR) required.
Dual Beam FIB-SEM, SEM, TEM
2w
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Director, Solutions Consulting
Rochester or United States or Phoenix
$225k/yr OnsiteFull Time
8+ YOE5+ MgmtBachelor's or equivalent,8+ years enterprise pre-sales/solutions consulting experience,5+ years leading solutions consulting or sales engineering teams,deep MMS/TEM domain expertise,strong executive communication and coaching skills.
Enterprise Mobility Management (EMM/UEM), Microsoft Intune, Jamf, Samsung Knox, Apple Business Manager, ServiceNow
1mo
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Enterprise Account Sales Executive
Rochester or Phoenix or United States
$230k/yr FieldFull Time
5+ YOE5+ years enterprise B2B software or managed services sales; proven track record closing six- and seven-figure deals; experience with TEM/MMS preferred; quota achievement and complex sales cycle experience; bachelor's degree or equivalent.
Technology Expense Management (TEM), Mobile Management Services (MMS), CRM
3w
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
1mo
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
2mo
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Module Development Engineer
Hillsboro or Phoenix or Santa Clara
$156k-$298k/yr OnsiteFull Time
PhD/Master/Bachelor in chemical engineering, materials science, physics, electrical engineering, or semiconductor-related field with 4+ to 9+ years of relevant experience; hands-on dry etch experience; DOE/statistical analysis; equipment troubleshooting.
JMP, Python, MATLAB, SEM, TEM, CD SEM, AFM, XPS
3mo
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Senior Engineer, Process Engineering | Global R&D Process Engineering Program
Leuven or Helsinki or Tokyo or Phoenix or Dongtan
OnsiteFull Time
0+ YOEPhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics; 0-7+ years in deposition and materials characterization; knowledge of ALD/CVD/epitaxy, and CMOS device characterization.
ALD, CVD, PEALD, Epitaxy, PECVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry, DOE, RSM, CFD
1w
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Physical Failure Analysis Engineer II
Chandler, Arizona, United States
OnsiteFull Time
2+ YOEMinimum 2 years experience in physical failure analysis, expert with Dual Beam FIB/SEM, experience with package decapsulation, CNC milling, X-ray and C-SAM, bachelor’s or master’s in a technical field, strong technical writing and device knowledge.
Dual Beam FIB/SEM, FIB/SEM, SEM, TEM, CNC milling, X-ray analysis, C-SAM (Scanning Acoustic Microscopy)
3w
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP