6 thin film engineer jobs at 4 companies in Patchogue, NY
2mo
Save
Mark Applied
Hide
Manager, Thin Film Deposition R&D
Danbury, Connecticut, United States
$125k-$160k/yr OnsiteFull Time
10+ YOE5+ MgmtMaster’s degree in chemical, electrical, mechanical engineering, or chemistry; 10+ years ALD/CVD R&D; 5+ years management; knowledge of semiconductor processes; experience with DOE/data analysis; strong leadership.
ALD, CVD, DOE, SAS JMP, Statistical analysis
3mo
Save
Mark Applied
Hide
Senior Coating Engineer
Danbury, Connecticut, United States
$87k-$182k/yr OnsiteFull Time
5+ YOEBS in Engineering or Physics; 5+ years optical thin-film coating design/manufacturing; PVD/sputter experience; coating design tools; spectroscopy/metrology; SPC; leadership skills.
Mcleod, TFCalc, PVD, Sputter deposition, Spectroscopy, Ellipsometry, CRDS, PCI
2mo
Save
Mark Applied
Hide
Product Applications Engineer (Customer Site)
Boise or Plainview
OnsiteFull Time
3+ YOEBS +5 yrs (or MS +3 yrs, or PhD) in engineering/physics/chemistry; 2 yrs customer support/management; thin film/semiconductor knowledge; strong communication and analytical skills.
2w
Save
Mark Applied
Hide
Sr. Process Development Engineer (Spector)
Plainview, New York, United States
$143k-$188k/yr OnsiteFull Time
3+ YOEDegree in engineering, physics, materials science, or chemistry with 3–8+ years of thin-film deposition or semiconductor process experience; experiment design, data analysis, customer-facing skills, and willingness to travel 10–20%.
2w
Save
Mark Applied
Hide
Process Development Engineer (Spector)
Plainview, New York, United States
$117k-$154k/yr OnsiteFull Time
3+ YOE3+ years' experience in thin-film deposition or related fields, hands-on vacuum and process development experience, ability to execute experiments, analyze data, document results, and communicate technical findings.
2d
Save
Mark Applied
Hide
Quantum Information Science Postdoctoral Research Associate
Upton, New York, United States
$72k-$82k/yr OnsiteFull Time, Temporary
Ph.D. in experimental physical science or engineering within five years or completed before start; thin-film vapor deposition, X-ray methods, scientific communication, and multidisciplinary collaboration required.
XPS, PES, XAS, XRD, electron-beam lithography, photolithography, electron microscopy