10 xrd jobs at 5 companies in Arizona

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Process and Technology Engineer - (E3)
Tempe, Arizona, United States
$108k-$149k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Master's or PhD in Materials Science/Engineering, familiarity with failure analysis (SEM/EDS/XRD), strong problem-solving and documentation skills, ability to work independently in production, willingness to work night shift and provide limited global technical support.
JMP, Microsoft Excel, Minitab, Python, SEM, EDS, XRD, CVD, PVD, ALD, PECVD, SPC, Six Sigma, Lean Manufacturing
3d
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Geological Technician I - Gunnison Project
Dragoon, Arizona, United States
FieldFull Time
Gunnison Copper
Gunnison CopperToronto Stock Exchange: GCU: Copper mining and production focused on US supply chains.
0.25+ YOEBachelor's degree in geology or final-semester status, 3+ months of geotechnical experience, driver's license, reliable transportation, analytical skills, and outdoor physical capacity.
XRF, XRD, QA/QC
2d
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Senior Engineer, Process Engineering [Epitaxy] | Global R&D Process Engineering Program
Leuven or Helsinki or Tokyo or Phoenix or Dongtan or United States or Belgium or Finland or Japan or Korea
FieldFull Time
ASM International
ASM InternationalEuronext Amsterdam: ASM: Provides wafer processing equipment for semiconductor device manufacturing.
PhD in physics, chemistry, chemical engineering, or materials science; experience with epitaxy techniques and characterization methods; semiconductor physics, equipment, project planning, and communication skills.
RPCVD, MOCVD, MBE, AFM, XRD, TEM, SIMS, ellipsometry, ALD
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
ASM International
ASM InternationalEuronext Amsterdam: ASM: Provides wafer processing equipment for semiconductor device manufacturing.
0+ YOEMaster's or PhD in chemical engineering, materials science, electrical engineering, or physics; experience with thin-film deposition, materials characterization, experimental design, and semiconductor processes.
Atomic Layer Deposition, ALD, PEALD, PECVD, CVD, CFD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, HRTEM, FESEM, Auger, Raman, ellipsometry, CMOS, Design of Experiments (DOE), Response Surface Methodology (RSM), Ishikawa diagrams
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's degree in engineering or related field, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation or defect characterization experience, strong analytical and communication skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
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Senior Process Engineer - Lithography #5427Senior Process Engineer - Lithography #5427
Phoenix or Phoenix
OnsiteFull Time
TSMC
TSMCNew York Stock Exchange: TSM: Manufactures semiconductor chips and integrated circuits for global customers.
1+ YOEMaster’s degree in engineering or related field with 1 year experience; or Bachelor's with 3 years experience; strong background in semiconductor tech.
DOE, SEM, TEM, CD-SEM, EDS, FIB, AFM, XRD, FT-IR, JMP, ASML Yield Star, LELE, SADP, N4/N5 Photolithography, Overlay modeling
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Snr Process Engineer - Early Career (Fall 2026)
Phoenix, Arizona, United States
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
0+ YOEMaster's or PhD in engineering/physics, 0–2 years professional experience (early career), experience with thin film deposition and materials characterization, DOE/RSM skills, hands-on troubleshooting, strong verbal/written communication.
ALD, PEALD, Epitaxy, PECVD, CVD, XPS, SIMS, RBS, AFM, XRR, XRD, TEM, HRTEM, SEM, FESEM, ellipsometry, Auger, Raman, DOE, RSM, Ishikawa diagrams, CFD
1mo
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Package Failure Analysis Engineer
Phoenix or Chandler
$85k-$140k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Bachelor's in relevant engineering or physical science, US citizenship, ability to obtain TS/SCI with polygraph, hands-on electrical fault isolation/defect characterization experience, lab and analytical skills.
SEM, TEM, x-ray, optical microscopy, multimeter, TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, CAD, JMP
2d
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Senior Engineer, Process Engineering [Epitaxy] | Global R&D Process Engineering Program
Leuven or Helsinki or Tokyo or Phoenix or Dongtan
OnsiteFull Time
ASM
ASMEuronext Amsterdam: ASM: Designs and manufactures advanced semiconductor wafer processing equipment.
PhD in physics, chemistry, chemical engineering, or materials science; epitaxy and characterization experience; semiconductor physics and processing knowledge; and project planning, execution, and communication skills.
RPCVD, MOCVD, MBE, AFM, XRD, TEM, SIMS, ellipsometry
2mo
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Process and Technology Engineer - (E3)
Tempe, Arizona, United States
$108k-$149k/yr OnsiteFull Time
Applied Materials
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Master’s or PhD in Materials Science and Engineering or related field; strong material properties knowledge; failure analysis experience; excellent problem-solving and communication; able to work independently and in team; willing to work night shift.
SEM, EDS, XRD, JMP, Excel, Minitab, Python, PVD, CVD, ALD, SPC, Lean Manufacturing