Apache Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Apache Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Apache Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
Apache Junction • 50 milesRemote · Hybrid · Onsite · Field · All Environments
3w
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Intel Foundry Yield Development Engineer
Hillsboro or Phoenix
$134k-$255k/yr HybridFull Time
3+ YOEMaster's in STEM, 3+ years yield development/process technology experience, experience with yield projection and advanced semiconductor process flows, strong data analysis and cross-functional communication skills.
2d
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Yield Platform Analyst
Hillsboro or Phoenix
$134k-$189k/yr HybridFull Time
3+ YOEBachelor's/Master's/PhD in engineering or related field with 3+ years relevant experience, experience applying materials/process fundamentals, advanced data systems, Python, JMP/JSL/SQL, and yield improvement methodologies.
JMP, JSL, SQL, Python
2mo
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Yield and Process Control Automation Engineer
Phoenix or Chandler
$150k-$285k/yr OnsiteFull Time
7+ YOE7+ yrs in semiconductor automation; 5+ yrs with SQL/Oracle/PostgreSQL; yield/SPC workflows; BS/MS in CS/CE or related STEM field.
SQL, Oracle, PostgreSQL, SECS/GEM, GEM300
1mo
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Ocotillo Technology Fabrication Process Integration and Yield Engineer
Phoenix or Chandler
$104k-$199k/yr OnsiteFull Time
3+ YOEBSE/MS/PhD in engineering, statistics, chemistry or physics with 3+ years (varies by degree). Requires semiconductor fabrication knowledge, SPC/DOE, statistical data analysis; experience with JMP/JSL, Python, SQL preferred.
JMP/JSL, Python, SQL, R
2w
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Yield Development Engineering Manager-Strategic Programs
Hillsboro or Phoenix
$265k-$375k/yr HybridFull Time
12+ YOEBachelor's in engineering/physics/materials/data science; 12+ years in semiconductor manufacturing with yield/defect metrology or process integration; experience leading cross-functional, enterprise programs and integrating data analytics/AI; strong leadership and communication.
MES, Foveros, EMIB
1w
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Process Integration and Yield Technician
Phoenix or Chandler
$60k-$85k/yr OnsiteFull Time
1+ YOEAssociate or Bachelor's in engineering-related field, 1+ years hands-on scientific project/lab experience, familiarity with failure analysis and lab instruments, strong verbal and technical writing skills.
mechanical polisher, optical microscope, electron microscopy
3w
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Electrical Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
1+ YOEProvides electrical test engineering support for board assemblies, improving test yield, troubleshooting, performing installation qualification, writing work instructions, conducting measurements and analyses. Associates degree and minimum 1 year experience.
1mo
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Product Development Engineer - Scan Diagnostics
Santa Clara or Phoenix or Hillsboro
$142k-$269k/yr HybridFull Time
4+ YOEBachelor's in engineering required; 4+ years in DFT/scan diagnostics/post-Si diagnostics/yield analysis; proficiency in Python, TCL, C-Shell or PERL; experience with EDA tools; strong communication and teamwork.
Python, TCL, C-Shell, PERL, Tessent, Yield Explorer, JTAG, IJTAG, IEEE1500, Electronic Design Automation (EDA), CAD
3w
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Electrical Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
1+ YOESupports electrical test of board-level assemblies, improves test yield, performs installation qualification, troubleshooting, root cause analysis, writes work instructions; Associates degree and minimum 1 year experience required.
2w
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Staff Process Engineer, Dry Etch
Hillsboro or Phoenix
$134k-$255k/yr HybridFull Time
4+ YOEBachelor's in EE/Physics/Materials/STEM and 4+ years semiconductor experience focused on dry etch; experience with process development, supplier collaboration (LAM/TEL/AMAT/Hitachi) and fab yield/defect work.
LAM, TEL, AMAT, Hitachi, Design of Experiment (DOE), factory automation control systems
1mo
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.