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Principal Engineer – RIE Module Engineering
Hopewell Junction, New York, United States
$114k-$194k/yr OnsiteFull Time
10+ YOEBachelor's in engineering,10+ years semiconductor manufacturing with 7+ years RIE/module roles; expertise in plasma etch, SPC, DOE, FDC, APC, yield analysis, RCA, FMEA and strong data analytics.
SPC, DOE, Fault Detection and Classification (FDC), Advanced Process Control (APC), FMEA, TEL, Lam Research
2mo
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Back Grind/Back Metal Post Fab Engineer
Hopewell Junction, New York, United States
$114k-$194k/yr OnsiteFull Time
onsemi: Designs and manufactures semiconductor solutions for power and sensing.
6+ YOE6-10 years in semiconductor manufacturing integration/tech development; BS in Engineering or Materials Science, MS/PhD preferred; expertise in wafer thinning, back-metal processes, CMOS/BCD, DOE/6-sigma/Lean, and yield optimization; proficient with MS Office and various analysis tools; English fluency.
MS Excel, MS PowerPoint, MS Word, MS Project, Yield analysis tools, Excensio, Spotfire, JMP, Minitab