14 yield engineer jobs at 4 companies in Maricopa, AZ

4d
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Technology Development Foundry Engineering – Staff Yield Engineer
Hillsboro or Folsom or Santa Clara or Austin or Phoenix
$156k-$255k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
2+ YOEDegree in engineering or physical science with 2–6+ years semiconductor yield engineering experience; experience in yield analysis, defect/root-cause, inline/e-test/SORT data, foundry collaboration, and yield model/roadmap development.
1mo
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Intel Foundry Yield Development Engineer
Hillsboro or Phoenix
$134k-$255k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's in STEM, 3+ years yield development/process technology experience, experience with yield projection and advanced semiconductor process flows, strong data analysis and cross-functional communication skills.
5d
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Process Integration and Yield Engineer
Chandler or Phoenix
$155k-$189k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's in materials science, engineering, electrical/mechanical/chemical engineering or related STEM and 3 years' experience; perform yield and failure analysis, statistical and ML/data mining techniques, and lead technology transfer; onsite presence required.
5d
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Process Integration and Yield Engineer
Chandler or Phoenix
$147k-$189k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
1+ YOEMaster's in a STEM field plus 1 year experience; expertise in yield/failure analysis, statistical methods, machine learning, and cross-functional problem solving.
5d
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Process Integration and Yield Engineer
Phoenix or Chandler
$175k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
PhD in a STEM field required; perform yield and failure analysis, apply statistical and data analysis methods, lead technology transfer, and manage process improvements for high-volume semiconductor manufacturing.
2mo
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Yield and Process Control Automation Engineer
Phoenix or Chandler
$150k-$285k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
7+ YOE7+ yrs in semiconductor automation; 5+ yrs with SQL/Oracle/PostgreSQL; yield/SPC workflows; BS/MS in CS/CE or related STEM field.
SQL, Oracle, PostgreSQL, SECS/GEM, GEM300
1mo
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Ocotillo Technology Fabrication Process Integration and Yield Engineer
Phoenix or Chandler
$104k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBSE/MS/PhD in engineering, statistics, chemistry or physics with 3+ years (varies by degree). Requires semiconductor fabrication knowledge, SPC/DOE, statistical data analysis; experience with JMP/JSL, Python, SQL preferred.
JMP/JSL, Python, SQL, R
2w
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Ocotillo Technology Fabrication Yield Device Integration Engineer
Phoenix or Chandler
$104k-$199k/yr OnsiteFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMS in EE/Physics/Materials with 3+ years semiconductor experience (or PhD), experience in process integration/yield, FEOL/BEOL knowledge, DOE/SPC/statistical analysis, project leadership; coding in JSL/SAS/Python preferred.
JSL, SAS, Python, JMP, Minitab
1mo
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Yield Development Engineering Manager-Strategic Programs
Hillsboro or Phoenix
$265k-$375k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
12+ YOEBachelor's in engineering/physics/materials/data science; 12+ years in semiconductor manufacturing with yield/defect metrology or process integration; experience leading cross-functional, enterprise programs and integrating data analytics/AI; strong leadership and communication.
MES, Foveros, EMIB
1mo
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Electrical Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
Abbott
AbbottNYSE: ABT: Provides medical devices, diagnostics, and science-based nutritional products.
1+ YOEProvides electrical test engineering support for board assemblies, improving test yield, troubleshooting, performing installation qualification, writing work instructions, conducting measurements and analyses. Associates degree and minimum 1 year experience.
2d
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Manufacturing Engineer
Chandler, Arizona, United States
OnsiteFull Time
Radius Aerospace
Radius Aerospace: Fabricates and assembles metal components for the aerospace industry.
3+ YOEPrepare tooling and processes from CAD and drawings, ensure customer-spec compliance, support production and quality, and apply lean manufacturing for cost and yield improvements.
Autodesk Inventor, Syteline, Microsoft Word, Microsoft Excel, Microsoft Outlook, Microsoft PowerPoint, Microsoft Project
1mo
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Electrical Engineer II
Scottsdale, Arizona, United States
$61k-$123k/yr OnsiteFull Time
Abbott
AbbottNYSE: ABT: Manufactures medical devices, diagnostics, and nutritional health products.
1+ YOESupports electrical test of board-level assemblies, improves test yield, performs installation qualification, troubleshooting, root cause analysis, writes work instructions; Associates degree and minimum 1 year experience required.
1mo
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Staff Process Engineer, Dry Etch
Hillsboro or Phoenix
$134k-$255k/yr HybridFull Time
Intel
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
4+ YOEBachelor's in EE/Physics/Materials/STEM and 4+ years semiconductor experience focused on dry etch; experience with process development, supplier collaboration (LAM/TEL/AMAT/Hitachi) and fab yield/defect work.
LAM, TEL, AMAT, Hitachi, Design of Experiment (DOE), factory automation control systems
1mo
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Package Development/NPI Engineer
San Jose or Chandler
$180k-$301k/yr OnsiteFull Time
MediaTek
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOE8+ years in package development and NPI for semiconductors; expertise in advanced packaging (EMIB, 2.5D/3D/3.5D, FCBGA, HBM); qualification, reliability, failure analysis, yield improvement, and cross-functional project management.