8 yield engineer jobs at 2 companies in New Mexico
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APTM Yield Analysis/Device Engineer
Albuquerque or Rio Rancho
$122k-$232k/yrHybridFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBachelor's/Master's/PhD in relevant engineering or science field plus 3+ years data analysis experience using JMP or Python; statistical analysis, metrology, and yield improvement skills required.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's+3yrs or Bachelor's+5yrs in a STEM field; experience with yield and failure analysis, statistical and data analysis, machine learning techniques, and cross-functional manufacturing problem solving.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
PhD in a STEM field, expertise in statistical analysis, machine learning, failure and yield analysis, and experience with high-volume semiconductor manufacturing; on-site presence required at least 4 days/week.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
Degree in engineering/science, 2–6+ years relevant experience depending on degree, 3+ years data analysis with JMP or Python, strong statistical and problem-solving skills, knowledge of inline metrology and yield tools.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEDegree in engineering, materials science, physics or related plus relevant process integration/yield experience; proficiency with data analysis using SQL and Python; strong communication and mentoring skills.
Advanced Packaging Technology Development Process Integration Engineer
Albuquerque, New Mexico, United States
$134k-$189k/yrOnsiteFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBachelor's (or higher) in Engineering, Material Science, or Physics with process integration, yield, quality, or process development experience in high-volume semiconductor manufacturing; strong cross-functional collaboration and problem-solving skills.
3D Glass Solutions: Manufactures glass-based semiconductor packaging and radio frequency components.
8+ YOEEngineering degree required; 8–12 years in semiconductor wet etching/TGV/copper etching; leadership experience; knowledge of SPC, DOE, FMEA, process characterization, yield analysis; willing to relocate to Albuquerque or India.