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15 yield engineer jobs at 5 companies in Oregon

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Yield Development Engineer
Hillsboro, Oregon, United States
$134k-$255k/yr HybridFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
3+ YOERequires degree in engineering/physical sciences/computer science and 3+ years experience in semiconductor processing or nanotechnology; proficiency in data analysis, machine learning, SPC, DOE, optical metrology, fault isolation and yield modeling.
machine learning, Statistical Process Control (SPC), Design of Experiments (DOE)
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Technology Development Foundry Engineering – Staff Yield Engineer
Hillsboro or Folsom or Santa Clara or Austin or Phoenix
$156k-$255k/yr HybridFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
2+ YOEDegree in engineering or physical science with 2–6+ years semiconductor yield engineering experience; experience in yield analysis, defect/root-cause, inline/e-test/SORT data, foundry collaboration, and yield model/roadmap development.
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MEMs Yield Engineer
Corvallis, Oregon, United States
$93k-$144k/yr OnsiteFull Time
HP Inc.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
5+ YOEBachelor's in engineering or related field, 5+ years wafer fabrication experience, familiarity with photolithography/deposition/etch/metrology, statistical analysis, and strong analytical and communication skills.
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Intel Foundry LTD Yield Development Engineer
Hillsboro or Austin
$134k-$255k/yr OnsiteFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
2+ YOEPh.D. in a semiconductor-related STEM field,2+ years semiconductor/process experience,skills in statistics,machine learning,data analysis,coding,and yield projection;project management and cross-functional collaboration preferred.
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Low Yield Analysis Engineer on Shift
Hillsboro, Oregon, United States
$99k-$140k/yr OnsiteFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
1+ YOEMaster's degree or higher in engineering, materials science, chemistry, or physics, plus 1+ year of lab experience and defect characterization or electrical fault isolation experience.
Scanning Electron Microscope (SEM), X-ray, microscopy, CSAM, ion milling, Transmission Electron Microscope (TEM), Focused Ion Beam (FIB), hand probe, curve trace, auto probing, Time Domain Reflectometry (TDR), EOTPR, EBAC, RIDR, ELITE, Energy Dispersive X-ray Spectroscopy (EDX), Atomic Force Microscopy (AFM), Fourier-Transform Infrared Spectroscopy (FTIR), Raman, X-ray Diffraction (XRD), Electron Backscatter Diffraction (EBSD), Mentor Graphics, SysNav/CadNav, FIELD, SQL, JMP
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2w
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Low Yield Analysis Engineer on Shift
Hillsboro, Oregon, United States
$99k-$140k/yr OnsiteFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
1+ YOEMaster's degree or higher in a relevant engineering or science field, at least one year of lab experience, and experience with defect characterization or electrical fault isolation techniques.
Scanning Electron Microscope (SEM), X-ray, microscopy, CSAM, ion milling, Transmission Electron Microscope (TEM), Focused Ion Beam (FIB), TDR, EOTPR, EBAC, RIDR, ELITE, EDX, AFM, FTIR, Raman, XRD, EBSD, Mentor Graphics, SysNav, CadNav, FIELD, SQL, JMP
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Fab Metrology and Yield Engineer
Beaverton, Oregon, United States
$116k-$152k/yr OnsiteFull Time
FormFactor, Inc.
FormFactor, Inc.NASDAQ: FORM: Provider of essential test and measurement technologies for the semiconductor industry.
8+ YOE8+ years experience with bachelor's (or equivalent experience), expertise in metrology, AOI, microscopy, profilometry, flying probe, SPC, DOE, and structured problem solving.
Automated Optical Inspection (AOI), SPC, Design of Experiments (DOE), Flying Probe, Profilometry, Optical Microscopy
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Yield Development Engineering Manager-Strategic Programs
Hillsboro, Oregon, United States
$225k-$375k/yr HybridFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
12+ YOEBachelor's in engineering or related field required; 12+ years in semiconductor manufacturing with deep expertise in yield engineering, defect metrology or process integration; experience leading enterprise programs and AI/ML transformation.
AI/ML, Agentic AI, MES, digital twins, data platforms, advanced analytics
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Yield Control Technology Engineer II or Senior (MAD-AS-OR)
Hillsboro, Oregon, United States
$122k-$185k/yr HybridFull Time
Hitachi, Ltd.
Hitachi, Ltd.Tokyo Stock Exchange: 6501: Japanese publicly traded technology conglomerate providing digital, energy, mobility, and industrial infrastructure solutions worldwide.
2+ YOERequires a STEM bachelor's degree or equivalent experience, 2+ years of semiconductor experience for Engineer II or 6+ for Senior, a valid driver's license, networking skills, and proficiency with Microsoft Office and LINUX.
CD-SEM, Microsoft Excel, Microsoft PowerPoint, Microsoft Word, LINUX
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TD Foundry Engineering Principle Engineer
Hillsboro or Folsom or Santa Clara or Austin or Phoenix
$221k-$312k/yr HybridFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
10+ YOEMaster's degree with 13+ years or PhD with 10+ years in semiconductor integration, device engineering, or yield engineering; engineering or physical science background required.
AI/ML, Process Design Kits (PDKs), Sil2Sim, E-Test (ET), WAT/C, Cp/Cpk, Design of Experiments (DOE), Waiver Review Board (WRB), DRC, SORT, Continuous Improvement Program (CIP)
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Process Integration Engineer
Chandler or Oregon
OnsiteFull Time
Everspin Technologies
Everspin TechnologiesNasdaq Stock Market LLC: MRAM: Public semiconductor manufacturer developing MRAM persistent-memory products for industrial, automotive, aerospace, medical, and data-center customers.
5+ YOEBachelor's degree or higher in Chemical Engineering, 5+ years in semiconductor BEOL process integration, expertise in process modules, yield engineering, foundry technology transfer, SPC, FDC, DOE, and JMP.
Statistical Process Control (SPC), Fault Detection Classification (FDC), Design of Experiments (DOE), JMP
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Technology Development Foundry Engineering – Senior Staff Engineer
Hillsboro or Albuquerque or Folsom or Santa Clara or Phoenix
$156k-$255k/yr HybridFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
4+ YOEMaster's degree and 6+ years or PhD and 4+ years of relevant industry experience, plus 4+ years in product/process integration, device, or yield engineering. Engineering or physical science degree required.
Multi-Project Wafer (MPW), High Volume Manufacturing (HVM), Gate-All-Around (GAA), Product Design Kit (PDK)
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3w
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MEMS Wafer Integration Engineer
Corvallis, Oregon, United States
$116k-$182k/yr OnsiteFull Time
HP Inc.
HP Inc.NYSE: HPQ: Global leader in personal computing, printing, and technology solutions.
10+ YOEBachelor’s or advanced degree in materials science, engineering, or physical sciences; 10+ years in semiconductor, MEMS, or microfabrication process development and integration; expertise in fabrication processes, DOE, SPC, data analysis, and yield improvement.
DOE, SPC
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Process Integration Development Engineer
Hillsboro, Oregon, United States
$121k-$232k/yr HybridFull Time
Intel
IntelNASDAQ: INTC: Design and manufacture of semiconductors and computing technology.
4+ YOEPh.D.+4yrs or M.S.+6yrs in a STEM field with semiconductor process, yield, SPC, DOE, JMP/JSL, Python, data analysis, and process integration experience.
JMP/JSL, Python, R, SQL
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2mo
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Sr Manager, Process Integration
Beaverton, Oregon, United States
$139k-$182k/yr OnsiteFull Time
FormFactor, Inc.
FormFactor, Inc.NASDAQ: FORM: Provider of essential test and measurement technologies for the semiconductor industry.
5+ YOESenior technical and people leader with 5+ years experience (minimum pathways: 10 yrs with Bachelor's, 8 yrs with Master's, 5 yrs with PhD) in semiconductor process integration, MEMS/probe card manufacturing, NPI, yield improvement, SPC and MES.
Manufacturing Execution Systems (MES), Statistical Process Control (SPC), Fault Detection and Classification (FDC), Design of Experiments (DOE), Root Cause Analysis (RCA), DMAIC, 8D, Metrology
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