1w
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Advanced Package Design Engineer
San Jose, California, United States
OnsiteFull Time
10+ YOE10+ years experience in 2.5D/3D IC packaging, familiarity with packaging manufacturing flows, yield and reliability qualification, CAD/EDA flows, strong communication and cross-functional collaboration; BS in engineering required, MS/PhD preferred.
CAD, PDK, EDA
3w
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Sr. Staff PIC Platform Engineer
Los Gatos, California, United States
OnsiteFull Time
5+ YOE5+ years in semiconductor process or foundry interface roles; experience with silicon photonics/CMOS; expertise in wafer fabrication, yield analysis, SPC/DOE, root-cause methods; strong cross-functional communication.
JMP, Python, MATLAB
2mo
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Software Engineer 6 - Ads Pricing & Packaging
Los Gatos or New York
$499k-$900k/yr OnsiteFull Time
10+ YOE10+ years software development; 5+ years in inventory management and yield optimization; experience with dynamic pricing, rate cards, and auction mechanics; strong leadership and communication skills.
Programming, API Design, Data Modeling, Advertising Technology, Auction Systems, Rate Card Management, Inventory Management Systems
2mo
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Software Engineer 6 - Ads Pricing & Packaging
Los Gatos or New York
$499k-$900k/yr OnsiteFull Time
10+ YOE10+ years software development experience (5+ years on inventory management); expertise in yield optimization, dynamic pricing, auction mechanics, rate card and packaging systems; API and data model design; technical leadership and strong communication.
VAST, OpenRTB
3mo
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Machine Learning Engineer 5 - Ads Platform Engineering
Los Gatos or Seattle or New York City or Los Angeles
$466k-$750k/yr OnsiteFull Time
Expertise in Java, C++, Python, or Scala; experience building low-latency ML model deployment and inference infra, large-scale data processing (Spark), ad-tech modeling (yield, bidding, forecasting), and productionizing models.
Java, C++, Python, Scala, Spark, Lucene, VAST, OpenRTB
3w
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Integrated Circuit Packaging Architect
San Jose, California, United States
$183k-$314k/yr HybridFull Time
Proven track record in semiconductor technology development and leadership; define package architecture, DFM/DFY and yield roadmaps; collaborate with product architects and manufacturing partners; strong communication skills; BS/MS/PhD in related fields.