Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
8+ YOEMaster's in engineering or related plus 8+ years in semiconductor package thermal/thermomechanical analysis; experience with Ansys/Abaqus/COMSOL and Python; reliability statistics and failure analysis skills.
Joby AviationNYSE: JOBY: Manufacturer of electric vertical takeoff and landing aircraft.
3+ YOEBachelor's in aerospace or mechanical engineering, 3+ years in structural loads or aeroelasticity, proficiency with NASTRAN/Abaqus/ZONA, MATLAB/Python, Linux/HPC, and strong problem-solving for flight test support.
ArcherNYSE: ACHR: Develops electric vertical takeoff and landing aircraft for urban mobility.
6+ YOEBachelor's in Aerospace or Mechanical Engineering required (Master's/PhD alternative). Minimum 6 years' experience in composite and metallic static and fatigue analysis, design and instrumentation engineering; experience with CATIA V5 and Abaqus preferred.
Engineering Consultant – ASME Section III, Division 5
Denver or San Jose or Huntersville
$97k-$171k/yrHybridFull Time
Structural Integrity Associates: Provides specialized engineering and inspection services for critical infrastructure.
6+ YOEBS in Mechanical or Materials Engineering, 6+ years experience with ASME Section III Division 5, high-temperature/creep-fatigue analysis, FEA (ANSYS,Abaqus), NRC knowledge, strong communication; MS and PE preferred.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
6+ YOEMaster's or higher in engineering-related field preferred; 5+–6+ years FEA experience (min), strong structural mechanics and dynamics background, proficiency with ANSYS/ABAQUS/HyperMesh, experience correlating FEA with test data, strong communication.
Dexmate: Building AI-powered mobile humanoid robots for industrial automation.
3+ YOE3+ years FEA/CAE experience with strong solid mechanics and structural dynamics background; proficiency in FEA tools, implicit/explicit analysis, experimental validation, and cross-functional collaboration.
Atomic Machines: Develops AI-powered robotic platforms for autonomous micro-scale manufacturing.
5+ YOE5+ years relevant industry experience or related PhD; DFM coding experience; computational geometry; Python and a systems language; geometry kernel APIs; and a relevant engineering, computer science, math, or design degree.
NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
5+ YOE5+ years experience, bachelor’s in engineering/computer science (or equivalent), CAE tool experience, Linux HPC and job scheduler familiarity, MPI workloads, strong communication and performance analysis skills.
Lithium Power: Custom-designed lithium battery and energy storage solutions.
3+ YOEB.S. in Mechanical Engineering or technical diploma with equivalent experience, 3+ years mechanical design, 3D CAD proficiency, 2D drawing and GD&T knowledge, fabrication/manufacturing understanding, and strong communication.
Hark: An artificial intelligence building advanced personalized intelligence paired with next-generation hardware.
8+ YOE8+ years FEA and structural simulation experience; expertise in structural, thermal, and dynamic analysis; proficiency with major FEA platforms and 3D CAD; strong solid mechanics and materials knowledge.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
12+ YOEBS/MS/PhD in Materials Science, Mechanical, Electrical, Physics or related; 12+ years IC packaging/NPI experience; knowledge of flip-chip, 2.5D/3D, wire bonding; FA and prototyping experience.
Samsung SemiconductorKorea Exchange: 005930: Designs and manufactures memory chips, processors, and sensors.
3+ YOEPhD in engineering discipline, 3+ years modeling/simulation experience in semiconductors, expertise in mechanical/thermal modeling, strong technical writing and collaboration skills.