NVIDIANASDAQ: NVDA: Designs graphics processing units and artificial intelligence hardware.
4+ YOEPhD or equivalent experience with 4+ years in thermal/mechanical engineering, expertise in heat transfer, electro-thermal simulation, thermo-mechanical stress and reliability; proficiency with Cadence Celsius, Ansys Fluent/Icepak/ANSYS, and Python or MATLAB.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
4+ YOEPhD in Mechanical Engineering or equivalent experience with 4+ years in thermal/mechanical engineering; expertise with Cadence Celsius Thermal Solver, CFD (Ansys Fluent, Icepak), coupled electro-thermal simulation, ANSYS thermo-mechanical analysis, and Python or MATLAB.
Altera: Manufacturer of field-programmable gate arrays and programmable logic devices.
8+ YOEMaster's in engineering or related plus 8+ years in semiconductor package thermal/thermomechanical analysis; experience with Ansys/Abaqus/COMSOL and Python; reliability statistics and failure analysis skills.
Bloom EnergyNYSE: BE: Manufactures solid oxide fuel cell systems for onsite power.
5+ YOEMS or PhD in Mechanical/Aerospace engineering; 5+ years CFD experience in thermal management; proficiency with ANSYS Icepak/Fluent/Flotherm; strong communication; ability to manage multiple projects.
AmphenolNYSE: APH: Manufactures electronic and fiber optic connectors and interconnect systems.
4+ YOE4+ years engineering experience, bachelor\u0002s in mechanical/electrical required, SolidWorks and FEA (ANSYS) experience, GD&T knowledge, product verification and design for manufacturability skills, up to 25% travel.
Commonwealth Fusion Systems: Designing and building commercial fusion energy power plants.
10+ YOEMaster's or PhD in mechanical engineering, aerospace engineering, physics, or related field; 10+ years in complex R&D simulation; expertise in ANSYS or COMSOL; coupled multiphysics modeling and hardware validation experience.
SynopsysNasdaq: SNPS: Provides software and IP for semiconductor design and manufacturing.
2+ YOEBachelor's degree +2 years or Master’s in engineering or natural science, strong programming (C, Fortran), finite element method expertise, experience with LS-DYNA/Ansys and CAD, ability to relocate to Livermore, CA.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
7+ YOEBachelor's degree, 7+ years engineering experience, FEA/thermal/structural/flow analysis experience (COMSOL or Ansys), 3D CAD design and release (NX/UG preferred), prototype build and testing experience.
PsiQuantum: Builds fault-tolerant quantum computers using silicon photonics technology.
5+ YOEM.Sc. or Ph.D. in engineering/physics, 5+ years semiconductor modeling and simulation experience, strong thermal and solid mechanics knowledge, proficiency with ANSYS/COMSOL and lab validation, and experience correlating FEA/CFD with test data.
AmphenolNYSE: APH: Designs and manufactures electronic connectors and interconnect systems.
4+ YOEBachelor's in mechanical or electrical engineering (or equivalent),4+ years industry experience,experience with high-speed connector or cable assembly design,SolidWorks and FEA/ANSYS proficiency,ability to work with cross-functional teams and customers.
Engineering Consultant – ASME Section III, Division 5
Denver or San Jose or Huntersville
$97k-$171k/yrHybridFull Time
Structural Integrity Associates: Provides specialized engineering and inspection services for critical infrastructure.
6+ YOEBS in Mechanical or Materials Engineering, 6+ years experience with ASME Section III Division 5, high-temperature/creep-fatigue analysis, FEA (ANSYS,Abaqus), NRC knowledge, strong communication; MS and PE preferred.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
5+ YOEBachelor’s or Master’s in electrical/computer engineering or power electronics with experience; design of power electronics; knowledge of power topologies; experience with design tools such as Concept, Allegro, LTspice, PSpice, Simplis, Mathcad, PowerDC, SIWave, Ansys, or Hyperlynx.
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
7+ YOEBachelor's degree, 7+ years experience, FEA/thermal/structural/flow analysis experience (COMSOL or Ansys), 3D CAD and NX/UG design, prototype build and test, strong problem solving and cross-functional collaboration.
Lawrence Livermore National Laboratory: Develops science and technology for United States national security.
U.S. citizenship and ability to obtain DOE Q-level clearance; Bachelor's in engineering or applied physics (or equivalent); advanced optomechanical design experience; proficiency with Creo/SolidWorks and ANSYS/NASTRAN/Abaqus; strong communication and leadership for senior level.
QualcommNASDAQ: QCOM: Designs and manufactures semiconductors and wireless telecommunications products.
6+ YOEMaster's or higher in engineering-related field preferred; 5+–6+ years FEA experience (min), strong structural mechanics and dynamics background, proficiency with ANSYS/ABAQUS/HyperMesh, experience correlating FEA with test data, strong communication.
ArcherNYSE: ACHR: Develops electric vertical takeoff and landing aircraft for urban mobility.
5+ YOEBachelor's in aerospace/mechanical or related, 5+ years designing and analyzing critical aircraft structures, proficiency with ANSYS/NASTRAN/FE software, NX CAD, knowledge of fatigue and damage tolerance, ability to read drawings, Python/Matlab scripting preferred.
MediaTekTaiwan Stock Exchange: 2454: Designs and develops system-on-chip solutions for electronic devices.
8+ YOEMS in EE or related, 8+ years SI/PI experience across chip, package, PCB; EM simulation and SPICE-level modeling; Cadence/Ansys/HSPICE experience; Python/Matlab/C scripting a plus; ~10% international travel.
Ansys, Cadence, Cadence Spectre, Synopsys HSPICE, SPICE, Python, Matlab, C