CelLink: Manufactures flexible electrical circuits for automotive and energy industries.
2+ YOEBachelor's in engineering or related, 2+ years CAD design experience, ability to create 3D models and 2D drawings, GD&T familiarity, strong communication and problem-solving skills.
Equal1: A developing cryogenic coolers and system integration for precision engineering applications.
Master's in Mechanical Engineering, strong 3D CAD and CAM knowledge (NX or Onshape a plus), understanding of CNC and metal production processes, hands-on assembly experience, and materials/process knowledge.
Micron TechnologyNASDAQ: MU: Designs and manufactures semiconductor memory and data storage solutions.
5+ YOEBS/MS in EE/CE/CS,5+ years relevant experience,hands-on AI/ML/LLM and Python,knowledge of CMOS/custom layout/verification,experience with CAD/EDA tool integration and Linux.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Bachelor's or Master's in Computer/Electrical Engineering, strong experience with Cadence Virtuoso, LEF and Calibre flows, proficiency in Cadence SKILL and Perl, AI agent integration experience preferred, strong communication and problem-solving skills.
SandiskNasdaq: SNDK: Designs and manufactures flash memory and data storage products.
7+ YOEB.S./M.S. in EE/CE/CS,7+ years design verification experience,expert SystemVerilog/UVM and SVA/CDV,advanced Python and Shell skills,Linux and regression farm experience (LSF/NC/Slurm),familiarity with Cadence verification tools.
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
3+ YOEDegree in EE/CE/CS (or equivalent) with minimum 3 years technical engineering experience; experience with signoff tools (StarRC, PrimeTime, Redhawk-SC, Fusion Compiler, Innovus); scripting in TCL/Python; must meet Microsoft background and export-control screening requirements.
5+ YOEBachelor's in EE or Computer Science (or equivalent),5+ years CAD experience,SystemVerilog and design verification experience,EM automation and tool deployment experience,strong communication and technical leadership.
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
3+ YOEMS in CS/Engineering or equivalent, 3+ years VLSI CAD experience, proficiency in C++, Tcl, Python, Makefile, strong VLSI background, and good interpersonal and presentation skills.
Northrop GrummanNYSE: NOC: Develops and manufactures advanced aerospace, defense, and space systems.
6+ YOESTEM degree with 6+ years experience, Teamcenter PDM administration, CREO and NX CAD modeling, ASME Y14.5 drawing/GD&T knowledge, Microsoft Office proficiency, and U.S. citizenship with ability to obtain DoD Secret clearance.
Teamcenter, CREO, NX, CREO Check-Mate, Microsoft Excel, Microsoft Word, Microsoft PowerPoint, Microsoft Outlook
Eliyan: High-performance chiplet interconnect technology for artificial intelligence applications
15+ YOE15+ years ASIC CAD, design methodology, and physical design; multi-node, multi-foundry platform deployments; R2G across major nodes; UPF/CPF flows; clocking and chiplet/2.5D methods.
NokiaNYSE: NOK: Sells telecommunications infrastructure and software for global network operators.
5+ YOE5+ years high-speed analog & mixed-signal IC CAD experience; expert with Cadence Virtuoso/ADE, Spectre, Mentor Calibre, SKILL; PDK installation/support, FlexLM, Unix/Linux; strong problem solving and IC layout/flow knowledge.
BitdeerNASDAQ: BTDR: Operates cryptocurrency mining and high-performance computing data centers.
Master's degree in EE/CE/CS, deep EDA and physical design expertise, proficiency with Cadence Innovus or OpenROAD, Cadence ADE, and scripting in TCL/Python/BASH/C/C++, plus ASIC/bitcoin domain knowledge.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEBachelor's in EE/CS (or Master's) plus 3+ years CAD/EDA tooling experience, 3+ years Python, schema design (JSON/YAML), Git and CI/CD practices, strong software engineering and communication skills.
Electrical CAD and Manufacturing Lead, Robotics Hardware Engineering
Redmond or Burlingame
$173k-$245k/yrOnsiteFull Time
MetaNASDAQ: META: Develops social networking platforms and virtual reality technologies.
7+ YOE7+ years PCB layout and manufacturing engineering; associates in EE or equivalent; expert Cadence Allegro; HDI/rigid/flex experience; IPC/JEDEC knowledge; vendor management; library and documentation skills; ECAD/MCAD workflows.