10+ YOEBS/MS/PhD in Mechanical Engineering, 10+ years experience in component sourcing and mechanical design for data center equipment; PLM/change management knowledge and proficiency with Creo and Agile systems.
Tenstorrent: Designs and manufactures AI processors and RISC-V CPU solutions.
5+ YOE5+ years in component/hardware/supply chain roles; degree in electrical engineering or related field; deep knowledge of semiconductors, memory, power, passives, and connectors; experience with multi-sourcing and supplier risk management.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
3+ YOEBSME/BSEE or equivalent, typically 3+ years experience; hands-on interconnect/connector experience, signal integrity familiarity, mechanical/electrical design knowledge, and project management skills.
SPC, FMEA, 8D, Design of Experiments (DOE), Signal Integrity (SI)
Lockheed MartinNYSE: LMT: Designs and manufactures global security and aerospace systems.
3+ YOEBachelor's in EE or related STEM, typically 3+ years engineering experience with high-reliability EEEE components; US citizenship and ability to obtain/maintain Secret clearance; experience with SCDs/AIDs/SOWs and supplier evaluation.
Lumilens: Designs photonic interconnects for AI supercomputing infrastructure.
8+ YOE8+ years in FR4/PCB development with mSAP/Any-Layer HDI experience, supplier qualification, PCB DFM/DFT, failure analysis, PCB test methods, and strong cross-functional communication.
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experienced supplier quality/reliability engineer with expertise in component qualification, supplier management, 8D/root cause, process capability, audits, and strong project and stakeholder management.
Avicena: Develops microLED optical interconnects for high-speed chip-to-chip communication.
5+ YOE5+ years in opto-mechanical or optical packaging, M.S. or higher, hands-on with SolidWorks, optical modelling (Zemax, LightTools) preferred, experience with transceiver assembly or silicon photonics an asset.
Tessera Labs: Automates complex enterprise workflows with multi-agent AI systems.
4+ YOE4+ years at the intersection of design and front-end engineering; production experience with React and TypeScript; strong CSS and component-driven architecture; experience building/maintaining component libraries; Figma fluency; accessibility and performance focus.
SupermicroNASDAQ: SMCI: Designs and manufactures high-performance server and storage solutions.
1+ YOEBS in Engineering, 1+ years in FAE/validation/NPI/test or fixture design, hands-on connector/cabling experience, system/component debugging, documentation skills, and ability to travel domestically and internationally.
IntuitiveNASDAQ: ISRG: Robotic-assisted systems for minimally invasive surgery.
Bachelors in Mechanical Engineering required; strong mechanical design, SolidWorks proficiency, component manufacturing knowledge, and experience leading/mentoring engineers; familiarity with medical device design and manufacturing processes.
AmphenolNYSE: APH: Designs and manufactures electronic connectors and interconnect systems.
BS in Electrical Engineering or Physics; hands-on frequency- and time-domain component characterization; experience with TDR/VNA measurements; understanding of electromagnetics and high-speed digital transmission.
nEye Systems: Develops MEMS-based silicon photonics optical circuit switches for data centers.
10+ YOE10+ years packaging design experience for optical/photonic components, experience with PIC edge coupling, reliability engineering, CAD and FEA usage, and working with contract manufacturers.
Ayar Labs: Develops optical interconnect technology for high-speed data movement.
10+ YOE10+ years in electrical engineering with component and system test, SerDes validation, Python automation, and high-speed optical/electrical test experience.
Test equipment (BERT, DCA, OSA), Python, High-speed SerDes characterization, Signal integrity and eye analysis, CMOS/SoC validation tooling
8+ YOEBachelor's in mechanical engineering or related,8+ years designing mechanical components,proficiency with CAD tools (3D MCAD,NX,Creo,Solidworks),BLS not mentioned,excellent communication and critical thinking.
computer-aided design (CAD), 3D MCAD, NX, Creo, Solidworks
NVIDIANASDAQ: NVDA: Designs GPU-accelerated computing and artificial intelligence hardware.
6+ YOEBS degree or equivalent experience, 6+ years in PCB library/layout/component/manufacturing engineering, expert in footprint and padstack development, Cadence Allegro proficiency, strong DFM/DFT/DFA and IPC knowledge.
Qnity ElectronicsNYSE: Q: Manufactures materials and solutions for the semiconductor industry.
6+ YOEBachelor's in engineering or technical field, 6+ years relevant experience, 3+ years component/subsystem design and thermal/EMI expertise, Solidworks and FEA knowledge, strong customer-facing and project management skills.
Johnson & JohnsonNYSE: JNJ: Global healthcare providing pharmaceuticals and medical technologies.
7+ YOEBS in Engineering, 7+ years in a regulated industry (medical device preferred). Deep knowledge of metals component manufacturing, GD&T, supplier management, quality systems (21 CFR 820, ISO 13485), and ability to lead supplier process scale-up and improvements.
machining, metal injection molding, stamping, casting, EDM/ECM, additive manufacturing, GD&T, Six Sigma, Lean, SPC, FMEA, DFM/A, 21 CFR part 820, ISO 13485