AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Expertise in liquid cooling and electronics thermal management; experience with cold plate design, CFD and FEA, lab validation, data analysis, and cross-functional collaboration.
5+ YOEBachelor’s degree in EE or related, 5+ years in embedded hardware design for power/control, analog/mixed-signal design, high-speed interfaces, PCB schematic/layout (Altium/OrCAD), lab bring-up and debugging, ability to lift 50 lbs and work occasional nights/weekends.
Mechanical Engineer II - Electronics Packaging & Thermal Design
Bohemia, New York, United States
$80k-$110k/yrOnsiteFull Time
North Atlantic Industries: Designs and manufactures rugged embedded computing and power systems.
5+ YOEBachelor's degree in mechanical engineering, 5+ years of drafting experience, CAD proficiency, electronics understanding, FEA/CFD experience, and knowledge of MIL-STD-810, IPC, ASME Y14.5M-1994, and GD&T.
Sr Lead Infrastructure Engineer- Electronic Trading Services
Jersey City, New Jersey, United States
$157k-$200k/yrHybridFull Time
JPMorgan ChaseNYSE: JPM: Global financial services firm providing banking and investment solutions.
10+ YOE10+ years in facilities design/implementation for data center/colocation, 5+ years IT experience in commercial/investment banking, knowledge of host and networking systems, asset and vendor coordination, strong communication and analytical skills.
Persistent Systems: Developer of secure mobile ad-hoc networking systems for mission-critical operations.
7+ YOEBachelor’s degree in electrical engineering or computer science; 7+ years in systems engineering or product design; defense project management experience; end-to-end design knowledge; experience with complex systems and electrical/mechanical interfaces; travel up to 10%; ability to obtain US security clearance.
Root Access: AI-native developer tools for embedded and hardware engineers.
3+ YOEBachelor's degree in electrical engineering or equivalent experience, plus 3+ years designing electronic circuits and PCBs. Requires schematic/PCB design tool proficiency and hardware debugging skills.
Ultra: Builds AI robots for automated warehouse order packaging and fulfillment.
Multiple years of experience shipping electromechanical systems to production; expertise in PCB design, power electronics, digital bus debugging, manufacturing at scale, and cost engineering.
Network Engineer, Global Banking & Markets, Electronic Trading Platform
New York City, New York, United States
$150k-$300k/yrOnsiteFull Time
Goldman SachsNYSE: GS: Global investment banking, securities, and investment management firm.
7+ YOEBachelor's degree in Computer Science, Engineering, or related field; CCNP or equivalent; deep networking expertise including BGP, multicast, switching, and scalable network design; 7+ years preferred.
Clera: AI talent agent matching professionals with high-growth startup roles
3+ YOERequires 3+ years of hands-on PCB design, shipped consumer electronics from prototype to production, and proficiency with embedded hardware, sensors, and consumer electronics constraints.
CapgeminiEuronext Paris: CAP: Provides global IT consulting and digital transformation services.
5+ YOEBS in Mechanical Engineering,5+ years mechanical design experience (consumer electronics preferred),SolidWorks and 3D CAD expertise,DFM/DFA and manufacturing process knowledge,prototyping and vendor documentation skills.
Spellman High Voltage Electronics: Designs and manufactures precision high voltage power conversion solutions.
5+ YOEBachelor's degree or higher and 5+ years designing switch-mode power supplies. Requires design verification, troubleshooting, converter topology, analog circuit, and digital electronics experience.
Ingersoll RandNYSE: IR: Designs and manufactures mission-critical industrial flow and compression equipment.
5+ YOEBachelor's in engineering,5+ years experience,expertise in electronic circuit and electrical design,experience with motor controls and manufacturing,project management and strong communication skills.
Altium, Windchill PLM, Creo Parametric, Wi-Fi 6, 5G, Zigbee, Bluetooth
Frontgrade Technologies: Provides mission-critical electronics for space and defense applications.
5+ YOE5+ years related experience (or 3 years with a Master’s), bachelor's in Mechanical Engineering or related field (degree may be substituted by experience), ability to obtain/maintain a security clearance, experience designing electronic or electromechanical products.
Senior Lead Software Engineer – Equities Electronic Trading, Senior Vice President
Jersey City, New Jersey, United States
$177k-$265k/yrHybridFull Time
CitiNYSE: C: A global financial services providing banking and credit services.
12+ YOE12+ years of experience designing low-latency electronic trading platforms using Java, C++, or Rust; requires a bachelor's degree or equivalent experience and expertise in testing, Agile, CI/CD, concurrency, and high-throughput systems.
Data Device Corporation: Manufacturer of high-reliability connectivity and power control electronics.
3+ YOEBachelor's in electrical engineering, 3+ years analog/mixed-signal and power electronics experience, Cadence/Tanner and SPICE tool experience, US person eligibility, strong analog design and motor-control skills.
HubbellNYSE: HUBB: Designs and manufactures electrical products and utility infrastructure solutions.
3+ YOE3-6 years engineering experience with electronic/electromechanical fixtures, CNC and testing; knowledge of C#, VB6, Python, Altium, SolidWorks, and test equipment; ability to design test fixtures and support technicians.
Senior Principal Engineer - Commercial Nuclear (Remote)
Danbury, Connecticut, United States
RemoteFull Time
Leonardo DRSNASDAQ: DRS: Designs and integrates advanced defense technologies for military customers.
8+ YOEBachelor’s degree in electrical engineering and 8+ years in electronic system design. Requires digital/analog systems expertise, nuclear regulations experience, U.S. citizenship, and ability to obtain clearance.
A/D, D/A, Motorola 68000, MC68360, PowerPC, TI DSP, TTL/HC, Xilinx ISE, Altera, Actel/Microsemi SmartFusion, Libero, PCI, PCIe, VME64x, ECC memory, Cadence OrCAD, Microsoft Office Suite, Microsoft Word, Microsoft Excel, Microsoft Visio, Microsoft PowerPoint