848 failure analysis jobs at 353 companies in United States
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Failure Analysis Engineer
Maynard, Massachusetts, United States
$78k-$99k/yrOnsiteFull Time
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
0+ YOEExperience in failure analysis of transceivers and optical components, hands-on debug with electronic/optical test equipment, root-cause analysis, documentation, and cross-team collaboration.
oscilloscope, pattern generator/error detector, electrical spectrum analyzer, optical spectrum analyzer, Electronic and optical test equipment
WistronTaiwan Stock Exchange: 3231: Manufactures electronics and computing hardware for global technology brands.
3+ YOEBachelor's in engineering or materials science, 3+ years failure analysis in electronics, experience with SEM, EDX, XRF, reliability testing, root cause analysis, and technical reporting.
Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), X-ray Fluorescence (XRF)
Applied OptoelectronicsNASDAQ: AAOI: Designs and manufactures fiber-optic components and networking equipment.
1+ YOEHands-on TEM/FIB experience for semiconductor failure analysis, knowledge of material characterization (EDX/EDS,SIMS,XPS), data analysis skills, DOE/SPC familiarity, and strong communication skills.
Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), HR-STEM, Energy Dispersive X-ray Spectroscopy (EDX/EDS), SIMS, XPS, SEM, Microsoft Access, SQL, LabVIEW
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
High school diploma required; electronics/Materials science preferred; experience in failure analysis helpful; responsibilities include sample preparation, FA engineering support, documentation.
Optical inspection, X-ray, Decapsulation, Reballing, IR, UV inspections, SEM, FIB
AmphenolNYSE: APH: Manufactures electronic and fiber optic connectors and interconnect systems.
5+ YOEBS/MS in Mechanical Engineering; 5+ years failure analysis or connector experience; Pro/E or SolidWorks, Microsoft Excel, Minitab familiarity; develop test plans, perform root cause analysis, communicate with customers and teams.
10+ YOEBachelor's degree in EE or equivalent, 10+ years SoC failure analysis, experience with EFI, ATE, DFT/diagnosis, physical and electrical failure analysis, and scripting (Python/C/Java).
Siemens Tessent, Advantest 93k, Python, C, Java, Automated Test Equipment (ATE), Design for Test (DFT), ATPG, MBIST, Electrical Fault Isolation (EFI), 3D X-ray, CSAM
SkyWater TechnologyNASDAQ: SKYT: Manufacturing U.S. semiconductors and providing specialized foundry services.
5+ YOEAssociate degree, 5+ years operating SEM/FIB failure analysis tools, semiconductor industry experience, strong organizational and troubleshooting skills, Microsoft Office and reporting proficiency.
SEM, FIB, Microsoft Outlook, Microsoft Word, Microsoft Excel, Microsoft PowerPoint, Microsoft Teams
AmphenolNYSE: APH: Designs and manufactures electrical connectors and interconnect systems.
5+ YOEBS/MS in Mechanical Engineering, 5+ years failure analysis or connector experience, proficiency with Pro/E or SolidWorks, Microsoft Excel, Minitab; develop test plans, conduct root-cause analysis, communicate with customers and cross-functional teams.
AmazonNASDAQ: AMZN: Global online retail and cloud computing technology provider.
7+ YOE7+ years hardware product development, Master's degree in engineering/physics, proven leadership scaling technical teams, deep hands-on failure analysis across component/board/system levels, structured problem solving, and strong written/verbal communication.
CT X-ray, optical/UV/thermal imaging, TDR, SEM, EDS, FTIR, XRF, Design Failure Mode and Effects Analysis (DFMEA), Design for Reliability (DfR), accelerated life testing
Hyve SolutionsNYSE: SNX: Designs and manufactures custom hardware for hyperscale data centers.
3+ YOEBachelor's in engineering, 3+ years in failure analysis/hardware validation, experience with enterprise servers and rack systems, board-level debugging, lab instruments, and RCA methodologies (8D, 5-Why, FMEA).
Oscilloscope, Digital Multimeter, Power Analyzer, Thermal Camera, Logic Analyzer, X-ray System, Optical Microscope, Environmental Test Equipment
Samsung SDIKRX: 006400: Manufacturer of lithium-ion batteries and energy storage systems.
Bachelor's degree in engineering or materials/chemistry, experience with battery failure analysis and root cause investigation, ability to operate analytical equipment (CT, SEM/EDX), strong documentation and problem-solving skills.
DEKA Research & Development: Designs and develops advanced medical and robotic technologies.
Perform failure analysis on returned medical devices, diagnose root cause from mechanical/electrical/software issues, operate diagnostic and data acquisition equipment, and document investigations in an FDA-compliant quality system.
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
1+ YOE1+ years physical failure analysis experience; hands-on skills with microscopy, decapsulation, X-Ray, SEM/EDX, electrical test and fault localization; bachelor’s in engineering/materials/chemistry required; US work eligibility.
Texas InstrumentsNASDAQ: TXN: Designs and manufactures semiconductors and integrated circuits.
5+ YOEMaster's or PhD in EE/CE/Physics, 5+ years in Analog IC design or failure analysis, strong analog/digital circuit and process knowledge, lab test experience, programming for bench automation (VBA, Python, GPIB).
Avicena: Develops microLED optical interconnects for high-speed chip-to-chip communication.
5+ YOEMS/PhD in EE, Materials, Physics or related (BS with experience acceptable). 5–8+ years failure analysis in semiconductor/optoelectronic devices. Skills in root-cause methods, device physics, Python or MATLAB, and technical communication.
EL/PL imaging, SIMS, EMMI, OBIRCH, FIB, SEM, TEM, EDX, CT/acoustic microscopy, curve tracing, Python, MATLAB
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
1+ YOE1-3 years physical failure analysis experience; hands-on microscopy, decapsulation, X‑Ray, SEM/EDX, electrical test and fault localization; familiarity with electrical measurements and environmental stress testing; bachelor's degree in related field required.
Microscopy, Sample preparation (decapsulation), X-Ray, SEM/EDX, Electrical Test, Fault Localization, DC measurements, Oscilloscope, Frequency generator
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experience in system- or rack-level failure analysis and hardware/firmware debugging; familiarity with Linux, BIOS/BMC/IPMI, lab diagnostic tools; strong communication and documentation skills; bachelor's or master's preferred in EE/CE/CS or related field.