5+ YOEBS/MS in Mechanical Engineering; 5+ years failure analysis or connector experience; Pro/E or SolidWorks, Microsoft Excel, Minitab familiarity; develop test plans, perform root cause analysis, communicate with customers and teams.
5+ YOEBS/MS in Mechanical Engineering, 5+ years failure analysis or connector experience, proficiency with Pro/E or SolidWorks, Microsoft Excel, Minitab; develop test plans, conduct root-cause analysis, communicate with customers and cross-functional teams.
Zipline: Autonomous logistics and drone delivery service.
Hands-on electronics failure analysis experience, ability to reproduce and isolate failures, read schematics, use lab test equipment, analyze data with Python/MATLAB/JMP/SQL, and write clear technical reports.
Renesas ElectronicsTokyo Stock Exchange: 6723: Global provider of embedded semiconductor and system solutions.
10+ YOERequires 10–15 years of semiconductor failure analysis experience, a bachelor's or master's in electrical engineering, power management experience, and expertise in electrical isolation and physical failure analysis techniques.
SMS InfoComm Corporation: Global provider of electronics lifecycle and service solutions.
0+ YOERequires a bachelor's degree or associate degree with product engineering experience, 0–2 years in failure analysis or 4+ years in electronics quality inspection, computer knowledge, test equipment skills, and English.
Microsoft Office, Microsoft Excel, oscilloscopes, multi-meters, Operating Systems (OS), BIOS, Drivers, Firmware
Hyve Solutions: Designs and manufactures custom data center infrastructure solutions.
3+ YOEBachelor's in engineering, 3+ years in failure analysis/hardware validation, experience with enterprise servers and rack systems, board-level debugging, lab instruments, and RCA methodologies (8D, 5-Why, FMEA).
Oscilloscope, Digital Multimeter, Power Analyzer, Thermal Camera, Logic Analyzer, X-ray System, Optical Microscope, Environmental Test Equipment
Samsung SDIKorea Exchange (KRX): 006400: Public South Korean manufacturer of batteries for electric vehicles, energy storage, and IT devices plus semiconductor and display materials.
Bachelor's degree in engineering or materials/chemistry, experience with battery failure analysis and root cause investigation, ability to operate analytical equipment (CT, SEM/EDX), strong documentation and problem-solving skills.
CiscoNASDAQ: CSCO: Global leader in networking, cybersecurity, and cloud-native technology solutions.
0+ YOEExperience in failure analysis of transceivers and optical components, hands-on debug with electronic/optical test equipment, root-cause analysis, documentation, and cross-team collaboration.
oscilloscope, pattern generator/error detector, electrical spectrum analyzer, optical spectrum analyzer, Electronic and optical test equipment
Wing: Alphabet-owned drone delivery serving homes and businesses with autonomous last-mile delivery of food, groceries, and essentials.
8+ YOE8+ years in failure analysis; bachelor's or master's in electrical engineering or related field; 8D expertise; electrical failure analysis tools, PCB layouts, SMT, schematics, troubleshooting, and leadership experience.
Samtec: Manufacturer of advanced electronic interconnect solutions.
1+ YOE1+ years physical failure analysis experience; hands-on skills with microscopy, decapsulation, X-Ray, SEM/EDX, electrical test and fault localization; bachelor’s in engineering/materials/chemistry required; US work eligibility.
Applied OptoelectronicsNASDAQ: AAOI: Public fiber-optic networking products manufacturer serving data centers, cable operators, telecom and fiber-to-the-home markets.
1+ YOEHands-on TEM/FIB experience for semiconductor failure analysis, knowledge of material characterization (EDX/EDS,SIMS,XPS), data analysis skills, DOE/SPC familiarity, and strong communication skills.
Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), HR-STEM, Energy Dispersive X-ray Spectroscopy (EDX/EDS), SIMS, XPS, SEM, Microsoft Access, SQL, LabVIEW
Spirit Electronics: Veteran- and woman-owned high-reliability electronics distributor and engineering-services provider for aerospace and defense customers.
5+ YOE5+ years failure/semiconductor device analysis experience, bachelor\u0002s in electrical/electronics engineering, hands-on DPA/SEM/EDS/X-Ray/C-SAM experience, MIL-STD-1580 knowledge, strong problem-solving and communication skills.
C-SAM, X-Ray, SEM, EDS, MIL-STD-1580, AS9100, ISO9001
Texas InstrumentsNASDAQ: TXN: Global semiconductor designing and manufacturing analog and embedded processing chips.
5+ YOEMaster's or PhD in EE/CE/Physics, 5+ years in Analog IC design or failure analysis, strong analog/digital circuit and process knowledge, lab test experience, programming for bench automation (VBA, Python, GPIB).
Qualcomm Technologies, Inc.: Developing semiconductor, wireless, connectivity, automotive, AI, and computing technologies for device and enterprise customers.
2+ YOEBachelor's degree and 2+ years of hardware engineering experience, or master's degree and 1+ year, or PhD; semiconductor failure analysis, nanoprobing, CMOS circuits, CAD layout, and data analysis experience preferred.
Samtec: Manufacturer of advanced electronic interconnect solutions.
1+ YOE1-3 years physical failure analysis experience; hands-on microscopy, decapsulation, X‑Ray, SEM/EDX, electrical test and fault localization; familiarity with electrical measurements and environmental stress testing; bachelor's degree in related field required.
Microscopy, Sample preparation (decapsulation), X-Ray, SEM/EDX, Electrical Test, Fault Localization, DC measurements, Oscilloscope, Frequency generator
AMDNASDAQ: AMD: Leader in high-performance computing, graphics, and visualization technologies.
Experience in system- or rack-level failure analysis and hardware/firmware debugging; familiarity with Linux, BIOS/BMC/IPMI, lab diagnostic tools; strong communication and documentation skills; bachelor's or master's preferred in EE/CE/CS or related field.
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
8+ YOEB.S., M.S., or Ph.D. in electrical engineering, materials science, physics, or related field, plus 8+ years of hands-on industry experience in semiconductor fabrication, packaging, microscopy, and failure analysis.
Focused Ion Beam (FIB), Optical microscopy, Electron microscopy, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM)
Wistron CorporationTaiwan Stock Exchange: 3231: Global technology provider specializing in ODM electronics manufacturing services.
3+ YOEBachelor's in engineering or materials science, 3+ years failure analysis in electronics, experience with SEM, EDX, XRF, reliability testing, root cause analysis, and technical reporting.
Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), X-ray Fluorescence (XRF)
NVIDIANASDAQ: NVDA: Computing platform for AI and accelerated graphics.
8+ YOE8+ years industry experience in semiconductor failure analysis; degree in EE, Materials Science, or Physics (or equivalent); expertise in IC sample preparation, microscopy, and system-level FA.