703 failure analysis engineer jobs at 287 companies in United States
2w
Save
Mark Applied
Hide
2w
Failure Analysis Engineer
Nashua, New Hampshire, United States
OnsiteFull Time
AmphenolNYSE: APH: Manufactures electronic and fiber optic connectors and interconnect systems.
5+ YOEBS/MS in Mechanical Engineering; 5+ years failure analysis or connector experience; Pro/E or SolidWorks, Microsoft Excel, Minitab familiarity; develop test plans, perform root cause analysis, communicate with customers and teams.
AmphenolNYSE: APH: Designs and manufactures electrical connectors and interconnect systems.
5+ YOEBS/MS in Mechanical Engineering, 5+ years failure analysis or connector experience, proficiency with Pro/E or SolidWorks, Microsoft Excel, Minitab; develop test plans, conduct root-cause analysis, communicate with customers and cross-functional teams.
Hyve SolutionsNYSE: SNX: Designs and manufactures custom hardware for hyperscale data centers.
3+ YOEBachelor's in engineering, 3+ years in failure analysis/hardware validation, experience with enterprise servers and rack systems, board-level debugging, lab instruments, and RCA methodologies (8D, 5-Why, FMEA).
Oscilloscope, Digital Multimeter, Power Analyzer, Thermal Camera, Logic Analyzer, X-ray System, Optical Microscope, Environmental Test Equipment
Samsung SDIKRX: 006400: Manufacturer of lithium-ion batteries and energy storage systems.
Bachelor's degree in engineering or materials/chemistry, experience with battery failure analysis and root cause investigation, ability to operate analytical equipment (CT, SEM/EDX), strong documentation and problem-solving skills.
CiscoNASDAQ: CSCO: Develops and sells networking hardware and cybersecurity software.
0+ YOEExperience in failure analysis of transceivers and optical components, hands-on debug with electronic/optical test equipment, root-cause analysis, documentation, and cross-team collaboration.
oscilloscope, pattern generator/error detector, electrical spectrum analyzer, optical spectrum analyzer, Electronic and optical test equipment
Samtec: Manufacturer of high-speed electronic connectors and cable assemblies.
1+ YOE1+ years physical failure analysis experience; hands-on skills with microscopy, decapsulation, X-Ray, SEM/EDX, electrical test and fault localization; bachelor’s in engineering/materials/chemistry required; US work eligibility.
Applied OptoelectronicsNASDAQ: AAOI: Designs and manufactures fiber-optic components and networking equipment.
1+ YOEHands-on TEM/FIB experience for semiconductor failure analysis, knowledge of material characterization (EDX/EDS,SIMS,XPS), data analysis skills, DOE/SPC familiarity, and strong communication skills.
Transmission Electron Microscopy (TEM), Focused Ion Beam (FIB), HR-STEM, Energy Dispersive X-ray Spectroscopy (EDX/EDS), SIMS, XPS, SEM, Microsoft Access, SQL, LabVIEW
WolfspeedNYSE: WOLF: Manufactures silicon carbide and GaN semiconductors for power systems.
Bachelor's degree in physics/chemistry/materials/engineering, working knowledge of semiconductor process and device functionality, hands-on lab experience with failure analysis processes, strong technical communication and critical thinking, able to perform chemical/mechanical/high-voltage lab work and stand up to 8 hours.
C-Mode Scanning Acoustic Microscopy (CSAM), Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS), EDX
PG&ENYSE: PCG: Provides natural gas and electric service in California.
3+ YOEB.S. in engineering, minimum 3 years related experience, experience with failure analysis/materials testing, strong investigative and communication skills; PE preferred.
Texas InstrumentsNASDAQ: TXN: Designs and manufactures semiconductors and integrated circuits.
5+ YOEMaster's or PhD in EE/CE/Physics, 5+ years in Analog IC design or failure analysis, strong analog/digital circuit and process knowledge, lab test experience, programming for bench automation (VBA, Python, GPIB).
AMDNASDAQ: AMD: Designs and manufactures computer processors and graphics technology.
Experience in system- or rack-level failure analysis and hardware/firmware debugging; familiarity with Linux, BIOS/BMC/IPMI, lab diagnostic tools; strong communication and documentation skills; bachelor's or master's preferred in EE/CE/CS or related field.
Samtec: Manufactures electronic connectors and high-speed cable assembly systems.
1+ YOE1-3 years physical failure analysis experience; hands-on microscopy, decapsulation, X‑Ray, SEM/EDX, electrical test and fault localization; familiarity with electrical measurements and environmental stress testing; bachelor's degree in related field required.
Microscopy, Sample preparation (decapsulation), X-Ray, SEM/EDX, Electrical Test, Fault Localization, DC measurements, Oscilloscope, Frequency generator
WistronTaiwan Stock Exchange: 3231: Manufactures electronics and computing hardware for global technology brands.
3+ YOEBachelor's in engineering or materials science, 3+ years failure analysis in electronics, experience with SEM, EDX, XRF, reliability testing, root cause analysis, and technical reporting.
Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDX), X-ray Fluorescence (XRF)
LG Energy Solution Michigan: Manufactures lithium-ion batteries for electric vehicles and energy storage.
Bachelor's or higher in Data Science or an engineering discipline with coursework in DBMS, data analysis/visualization, big data, machine learning, and AI. Perform battery cell/module teardown analysis, investigate failures, maintain equipment, train operators, and follow 5S3R standards.
SMS InfoComm: Technical repair and lifecycle services for electronic products.
Perform root-cause failure analysis and component-/system-level repair of PCBAs and systems using analytical tools; prepare technical reports; mentor junior staff. Bachelor’s degree in engineering or related field expected.
Renesas ElectronicsTokyo Stock Exchange: 6723: Designs and manufactures semiconductors for automotive and industrial systems.
10+ YOE10+ years failure analysis experience in semiconductors, Bachelor's in electrical engineering, experience with power management products, electrical isolation and physical FA techniques, package/non-destructive imaging and deprocessing techniques, strong communication and teamwork.