4 failure analysis engineer jobs at 3 companies in Cullman, AL

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EEE Parts - Failure Parts Analysis Engineer - (R0161777+) (J)
Huntsville, Alabama, United States
$80k-$115k/yr OnsiteFull Time
Aerodyne Industries
Aerodyne Industries: Providing engineering and mission operations support for space programs.
5+ YOEBS in Engineering required, typically 5+ years EEE parts/obsolescence experience. Must use Silicon Expert, Total Parts Plus, EPARTS; perform failure analysis, materials/electronic component evaluation, and technical writing. U.S. citizenship required; domestic travel <15%.
Silicon Expert, Total Parts Plus, EPARTS (Electronics Parts Application, Reporting, and Tracking System)
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Counter-Countermeasure and Threat Discrimination Program Engineer (MDA)
Huntsville, Alabama, United States
OnsiteFull Time
Mission Driven Research
Mission Driven Research: Technical services for government defense and space programs.
12+ YOEMaster's in STEM and 12+ years experience, active Secret clearance, expertise in radar signal processing and electronic protection, systems engineering, failure and risk analysis, modeling, and technical communications.
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Semiconductor Engineering Technician
Huntsville, Alabama, United States
$87k-$198k/yr OnsiteFull Time
Booz Allen Hamilton
Booz Allen HamiltonNYSE: BAH: Consulting and technology services for government and commercial clients
10+ YOE10+ years in semiconductor design/fabrication/validation or failure analysis, SEM/FIB imaging, silicon sample prep, strong documentation, Top Secret clearance, bachelor's degree.
Scanning Electron Microscope (SEM), Focused Ion Beam (FIB)
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Semiconductor Engineering Technician
Huntsville, Alabama, United States
$87k-$198k/yr OnsiteFull Time
Booz Allen Hamilton
Booz Allen HamiltonNYSE: BAH: Provides technology and management consulting services to diverse organizations.
10+ YOE10+ years in semiconductor design/fabrication/validation, SEM/FIB imaging, silicon wafer/chip prep, CMOS design or failure analysis, technical documentation, and Top Secret clearance eligibility.
Scanning Electron Microscope (SEM), Focused Ion Beam (FIB), CMOS