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Product Failure Analysis Engineer
Hillsboro, Oregon, United States
$104k-$199k/yr OnsiteFull Time
5+ YOE5+ years (BS) or 3+ years (MS) experience in semiconductor device physics, circuit design, or defect/fault isolation; strong root-cause analysis and communication skills.
2mo
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Senior Engineer, Product Engineering (Mfg.)
Beaverton, Oregon, United States
$122k-$143k/yr HybridFull Time
2+ YOEMaster’s degree in Electrical Engineering, Materials Science, or Device Physics; 2+ years in product engineering with mixed-signal debugging and failure analysis; strong data analysis and measurement skills.
Cadence, Avalon, Console, ADS, Klarity ACE, Galaxy Examinator, PDF Solutions Exensio, Python, LabView, TestStand, Oscilloscopes, Spectrum Analyzers, Power Meters, X-Ray, SEM, FIB
2w
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Senior Integration Engineer
Hillsboro, Oregon, United States
$95k-$140k/yr OnsiteFull Time
3+ YOEMaster's or PhD in electrical engineering, 3+ years development experience in semiconductor/power device development, wafer fabrication knowledge, DOE and failure analysis experience.
1mo
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Silicon Debug Engineer
Beaverton, Oregon, United States
OnsiteFull Time
Investigate and root-cause complex silicon failures using electrical characterization and physical failure analysis; apply circuit theory and device physics to support product ramp.
2d
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Silicon Product Engineer
Hillsboro, Oregon, United States
$149k-$200k/yr OnsiteFull Time
3+ YOEMaster's in engineering or STEM and 3 years related experience; develop test strategies, perform failure analysis, and support manufacturing ramp; strong analytical and communication skills.
2mo
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Mechanical Engineer Manager
Tualatin, Oregon, United States
HybridFull Time
4+ MgmtBachelor's in Mechanical Engineering and ~4+ years supervisory/leadership experience; experience with PDR, CIP, design changes, failure analysis, and cross-functional support for manufacturing and field.
2d
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Senior Test Engineer
Hillsboro or Austin or Redmond or Mountain View
$120k-$235k/yr HybridFull Time
1+ YOEExperience in scan/structural test, ATE/ATPG test program development, silicon bring-up, failure analysis, and collaboration with cross-functional teams; ability to meet export-control screening; Linux proficiency.
Advantest 93K, Linux, ATPG, DFT
3w
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Field Applications Engineer (TEM)
Hillsboro or Oregon
FieldFull Time
5+ YOEUndergraduate degree in physics/materials science/chemistry (advanced degree preferred), 5+ years TEM hands-on experience, strong semiconductor process and failure analysis knowledge, coding/scripting a plus, valid passport and ability to travel up to 25%.
Transmission Electron Microscopy (TEM), C#, Python, MATLAB
1mo
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Technical Product Support (TPS) Engineer III - (E3)
Hillsboro, Oregon, United States
$96k-$132k/yr OnsiteFull Time
Provide advanced hardware/software product support, lead failure analysis, support new product introductions and customer escalations, deliver training and technical documentation; 50% travel and relocation eligible.
1mo
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Technical Product Support (TPS) Engineer III - (E3)
Hillsboro, Oregon, United States
$96k-$132k/yr OnsiteFull Time
Provides third-level hardware/software escalation, supports new product introductions and alpha/beta site deployments, drives failure analysis and ECOs, and supports customer installations; role requires frequent travel (50%).
18h
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Staff Manufacturing Engineer, Advanced Components (62390)
Lake Oswego, Oregon, United States
OnsiteFull Time
8+ YOEB.Sc. or M.Sc. in EE/Physics/Materials,8+ years experience in chip scale packaging and high-reliability electronics, strong failure analysis and supplier qualification skills, leadership and technical writing ability.
Microsoft Excel, Microsoft Word, Microsoft PowerPoint