16 failure analysis engineer jobs at 12 companies in Oatfield, OR
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Product Failure Analysis Engineer
Hillsboro, Oregon, United States
$104k-$199k/yrOnsiteFull Time
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
5+ YOE5+ years (BS) or 3+ years (MS) experience in semiconductor device physics, circuit design, or defect/fault isolation; strong root-cause analysis and communication skills.
Analog DevicesNASDAQ: ADI: Designs and manufactures semiconductors for signal processing and power management.
2+ YOEMaster’s degree in Electrical Engineering, Materials Science, or Device Physics; 2+ years in product engineering with mixed-signal debugging and failure analysis; strong data analysis and measurement skills.
Cadence, Avalon, Console, ADS, Klarity ACE, Galaxy Examinator, PDF Solutions Exensio, Python, LabView, TestStand, Oscilloscopes, Spectrum Analyzers, Power Meters, X-Ray, SEM, FIB
Saint-GobainEuronext Paris: SGO: Designs, manufactures, and distributes materials for building and industry.
2+ YOEBachelor's degree in engineering required; 2+ years of manufacturing engineering preferred. Requires root cause and failure analysis, improvement projects, problem resolution, Microsoft Office, and 2D AutoCAD experience.
Bonneville Power Administration: Provides wholesale hydroelectric power and regional electrical transmission services.
1+ YOEEngineering degree or qualifying engineering education, registration, examination, or related curriculum; at least 1 year specialized experience in high-voltage asset reliability, maintenance, failure analysis, and technical team leadership.
AppleNASDAQ: AAPL: Designs and sells consumer electronics, software, and online services.
Experience in circuit theory, device physics, electrical characterization, failure investigation and physical analysis to root-cause silicon failures in advanced SoCs.
Hillsboro or Redmond or Mountain View or Raleigh or Austin
$102k-$202k/yrHybridFull Time
MicrosoftNASDAQ: MSFT: Develops software, services, devices, and cloud computing solutions.
1+ YOEMaster's degree plus 1+ year or bachelor's degree plus 2+ years of technical engineering experience; expertise in semiconductor debug, ATE, fault isolation, failure analysis, and product engineering.
IntelNasdaq: INTC: Designs and manufactures microprocessors and semiconductor components.
3+ YOEMaster's in engineering or STEM and 3 years related experience; develop test strategies, perform failure analysis, and support manufacturing ramp; strong analytical and communication skills.
Alpha and Omega SemiconductorNASDAQ: AOSL: Designs and manufactures power semiconductor products for electronic systems.
3+ YOEMaster's or PhD in electrical or related engineering, 3+ years in development, and semiconductor process and wafer fabrication knowledge; power device, DOE, failure analysis, and characterization experience preferred.
MOSFET, IGBT, TVS, DOE, New Product Introduction (NPI), Process Control Document (PCD)
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Technical expert leading complex hardware and software customer escalations, failure analysis, new product introductions, site support, taskforces, program execution, and technical documentation.
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Technical expert responsible for complex semiconductor equipment hardware and software performance, failure analysis, customer escalations, new product introductions, site leadership, and cross-functional program execution.
Thermo Fisher ScientificNYSE: TMO: Sells equipment and chemicals for scientific research and healthcare.
5+ YOEUndergraduate degree in physics/materials science/chemistry (advanced degree preferred), 5+ years TEM hands-on experience, strong semiconductor process and failure analysis knowledge, coding/scripting a plus, valid passport and ability to travel up to 25%.
Transmission Electron Microscopy (TEM), C#, Python, MATLAB
Technical Product Support (TPS) Engineer III - (E3)
Hillsboro, Oregon, United States
$96k-$132k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Manufacturers of equipment for semiconductor and display production.
Provide advanced hardware/software product support, lead failure analysis, support new product introductions and customer escalations, deliver training and technical documentation; 50% travel and relocation eligible.
Technical Product Support (TPS) Engineer III - (E3)
Hillsboro, Oregon, United States
$96k-$132k/yrOnsiteFull Time
Applied MaterialsNASDAQ: AMAT: Produces equipment and services for chip and display manufacturing.
Provides third-level hardware/software escalation, supports new product introductions and alpha/beta site deployments, drives failure analysis and ECOs, and supports customer installations; role requires frequent travel (50%).
BIOTRONIK: Manufactures cardiovascular and endovascular medical devices for patient therapy.
8+ YOEB.Sc. or M.Sc. in EE/Physics/Materials,8+ years experience in chip scale packaging and high-reliability electronics, strong failure analysis and supplier qualification skills, leadership and technical writing ability.
Microsoft Excel, Microsoft Word, Microsoft PowerPoint
Agility Robotics: Develops bipedal humanoid robots for industrial warehouse automation.
10+ YOE5+ MgmtBachelor's degree in engineering or related technical field; 10+ years in quality, field quality, or reliability engineering; 5+ years managing technical engineering teams; expertise in electromechanical failure analysis and RCA methodologies.